EP1K50TC144-3N - ACEX-1K 50K Gates FPGA, 144-LQFP | Intel / Altera
N.º da peça: EP1K50TC144-3N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.2 | $132,00 |
| 100 | $11.85 | $1.185,00 |
| 500 | $10.4 | $5.200,00 |
| 1.000 | $9.15 | $9.150,00 |
EP1K50TC144-3N Visão geral
An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs) interconnected by a programmable routing matrix. FPGAs are positioned in the programmable logic hierarchy above CPLDs and below ASICs in terms of integration density, offering hardware-level parallelism for digital signal processing, glue logic, bus bridging, and protocol implementation. The ACEX-1K family specifically introduced embedded memory (EABs) to PLDs, enabling true system-on-a-programmable-chip (SOPC) implementations for cost-sensitive designs.
Key features include 166.67 MHz maximum internal operating frequency, 5.0 ns pin-to-pin logic delay, JTAG boundary-scan test support, multiVolt I/O supporting 2.5 V/3.3 V/5.0 V interfacing, and 102 user I/O pins arranged in four I/O banks. The architecture combines a fine-grained logic fabric with coarse-grained EAB memory blocks, allowing efficient implementation of megafunctions such as FIFOs, dual-port RAM, and DSP multipliers without external memory.
The 0.22 µm process technology delivers a balance of low static power and high performance. The four I/O banks support independent voltage reference (VREF) inputs, allowing mixed-voltage interfacing on a single die. Programmable interconnect delays and register-rich LABs optimize timing closure for state-machine and pipeline designs.
Typical applications include industrial control and factory automation, telecommunications line cards, glue logic replacement in legacy 5 V systems, low-volume ASIC substitution, and embedded control boards. The 144-LQFP plastic package simplifies prototyping and rework compared to BGA alternatives.
Designers should note that EP1K50TC144-3N is now classified Obsolete, so production runs require last-time-buy planning, firmware bitstream compatibility must be verified against Quartus II version 13.0 or earlier, and migration to Cyclone II / Cyclone III families is recommended for new designs.
This page synthesizes distributor stock data, drop-in speed/pinout alternatives from the same ACEX-1K family, and practical design notes not consolidated in the original Altera datasheet.
Alternativas drop-in para EP1K50TC144-3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1K50TC144-3N (mesmo formato e footprint) — diferindo em Package, Family, Process Technology, Speed Grade, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1K50TC144-2N
✅ Drop-In✓ Em estoque
$22.45 / unidade
Ver ficha técnica →EP1K50TC144-1N
✅ Drop-In✓ Em estoque
$9.85 / unidade
Ver ficha técnica →EP1K50TC144-3
✅ Drop-In✓ Em estoque
$13.85 / unidade
Ver ficha técnica →EP1K50TC144-2
✅ Drop-In✓ Em estoque
$28.4 / unidade
Ver ficha técnica →EP1K50TC144-1
✅ Drop-In✓ Em estoque
$9.95 / unidade
Ver ficha técnica →EP1K50TC144-3N Classificações máximas e características elétricas
| Series | ACEX-1K |
| Family | ACEX 1K Programmable Logic Device Family |
| Logic Elements / Cells | 2880 |
| System Gates | 40960 (50K nominal) |
| Number of LABs/CLBs | 360 |
| Embedded Memory (EAB) | 40 kbit (12 EABs, dual-port) |
| User I/O Count | 102 |
| Number of Gates | 199000 (maximum) |
| Operating Frequency (Max) | 166.67 MHz |
| Core Voltage | 2.5 V |
| I/O Voltage Support | 2.5 V / 3.3 V / 5.0 V (multiVolt) |
| Process Technology | 0.22 µm CMOS |
| Logic Delay (pin-to-pin) | 5.0 ns |
| Encapsulamento | 144-LQFP (TQFP-144), 22 x 22 mm, 0.5 mm pitch |
| Programming Interface | JTAG (IEEE 1149.1) / Altera serial |
| Operating Temperature Grade | Commercial (0 °C to +70 °C) — inferred from '-N' suffix |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do EP1K50TC144-3N
| Pino 1 | I/O — User I/O (bank 1) — dual function depends on design assignment |
| Pino 2 | I/O — User I/O (bank 1) |
| Pino 3 | I/O — User I/O (bank 1) |
| Pino 4 | I/O — User I/O (bank 1) |
| Pino 5 | I/O — User I/O (bank 1) |
| Pino 6 | I/O — User I/O (bank 1) |
| Pino 7 | I/O — User I/O (bank 1) |
| Pino 8 | I/O — User I/O (bank 1) |
| Pino 9 | I/O — User I/O (bank 1) |
| Pino 10 | I/O — User I/O (bank 1) |
| Pino 11 | VCCIO1 — I/O bank 1 supply voltage (2.5/3.3/5.0 V) |
| Pino 12 | I/O — User I/O (bank 1) |
| Pino 13 | I/O — User I/O (bank 1) |
| Pino 14 | I/O — User I/O (bank 1) |
| Pino 15 | I/O — User I/O (bank 1) |
| Pino 16 | I/O — User I/O (bank 1) |
| Pino 17 | I/O — User I/O (bank 1) |
| Pino 18 | I/O — User I/O (bank 1) |
| Pino 19 | I/O — User I/O (bank 1) |
| Pino 20 | I/O — User I/O (bank 1) |
| Pino 21 | I/O — User I/O (bank 1) |
| Pino 22 | I/O — User I/O (bank 1) |
| Pino 23 | I/O — User I/O (bank 1) |
| Pino 24 | I/O — User I/O (bank 1) |
| Pino 25 | I/O — User I/O (bank 1) |
| Pino 26 | I/O — User I/O (bank 1) |
| Pino 27 | I/O — User I/O (bank 1) |
| Pino 28 | GND — Ground |
| Pino 29 | I/O — User I/O (bank 2) |
| Pino 30 | I/O — User I/O (bank 2) |
| Pino 31 | I/O — User I/O (bank 2) |
| Pino 32 | I/O — User I/O (bank 2) |
| Pino 33 | I/O — User I/O (bank 2) |
| Pino 34 | I/O — User I/O (bank 2) |
| Pino 35 | I/O — User I/O (bank 2) |
| Pino 36 | I/O — User I/O (bank 2) |
| Pino 37 | I/O — User I/O (bank 2) |
| Pino 38 | I/O — User I/O (bank 2) |
| Pino 39 | I/O — User I/O (bank 2) |
| Pino 40 | I/O — User I/O (bank 2) |
| Pino 41 | I/O — User I/O (bank 2) |
| Pino 42 | I/O — User I/O (bank 2) |
| Pino 43 | I/O — User I/O (bank 2) |
| Pino 44 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 45 | I/O — User I/O (bank 2) |
| Pino 46 | I/O — User I/O (bank 2) |
| Pino 47 | I/O — User I/O (bank 2) |
| Pino 48 | I/O — User I/O (bank 2) |
| Pino 49 | I/O — User I/O (bank 2) |
| Pino 50 | I/O — User I/O (bank 2) |
| Pino 51 | I/O — User I/O (bank 2) |
| Pino 52 | I/O — User I/O (bank 2) |
| Pino 53 | I/O — User I/O (bank 2) |
| Pino 54 | I/O — User I/O (bank 2) |
| Pino 55 | I/O — User I/O (bank 2) |
| Pino 56 | I/O — User I/O (bank 2) |
| Pino 57 | GND — Ground |
| Pino 58 | I/O — User I/O (bank 3) |
| Pino 59 | I/O — User I/O (bank 3) |
| Pino 60 | I/O — User I/O (bank 3) |
| Pino 61 | I/O — User I/O (bank 3) |
| Pino 62 | I/O — User I/O (bank 3) |
| Pino 63 | I/O — User I/O (bank 3) |
| Pino 64 | I/O — User I/O (bank 3) |
| Pino 65 | I/O — User I/O (bank 3) |
| Pino 66 | I/O — User I/O (bank 3) |
| Pino 67 | I/O — User I/O (bank 3) |
| Pino 68 | I/O — User I/O (bank 3) |
| Pino 69 | I/O — User I/O (bank 3) |
| Pino 70 | I/O — User I/O (bank 3) |
| Pino 71 | I/O — User I/O (bank 3) |
| Pino 72 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 73 | I/O — User I/O (bank 3) |
| Pino 74 | I/O — User I/O (bank 3) |
| Pino 75 | I/O — User I/O (bank 3) |
| Pino 76 | I/O — User I/O (bank 3) |
| Pino 77 | I/O — User I/O (bank 3) |
| Pino 78 | I/O — User I/O (bank 3) |
| Pino 79 | I/O — User I/O (bank 3) |
| Pino 80 | I/O — User I/O (bank 3) |
| Pino 81 | I/O — User I/O (bank 3) |
| Pino 82 | I/O — User I/O (bank 3) |
| Pino 83 | I/O — User I/O (bank 3) |
| Pino 84 | I/O — User I/O (bank 3) |
| Pino 85 | GND — Ground |
| Pino 86 | I/O — User I/O (bank 4) |
| Pino 87 | I/O — User I/O (bank 4) |
| Pino 88 | I/O — User I/O (bank 4) |
| Pino 89 | I/O — User I/O (bank 4) |
| Pino 90 | I/O — User I/O (bank 4) |
| Pino 91 | I/O — User I/O (bank 4) |
| Pino 92 | I/O — User I/O (bank 4) |
| Pino 93 | I/O — User I/O (bank 4) |
| Pino 94 | I/O — User I/O (bank 4) |
| Pino 95 | I/O — User I/O (bank 4) |
| Pino 96 | I/O — User I/O (bank 4) |
| Pino 97 | I/O — User I/O (bank 4) |
| Pino 98 | I/O — User I/O (bank 4) |
| Pino 99 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 100 | I/O — User I/O (bank 4) |
| Pino 101 | I/O — User I/O (bank 4) |
| Pino 102 | I/O — User I/O (bank 4) |
| Pino 103 | I/O — User I/O (bank 4) |
| Pino 104 | I/O — User I/O (bank 4) |
| Pino 105 | I/O — User I/O (bank 4) |
| Pino 106 | I/O — User I/O (bank 4) |
| Pino 107 | I/O — User I/O (bank 4) |
| Pino 108 | I/O — User I/O (bank 4) |
| Pino 109 | I/O — User I/O (bank 4) |
| Pino 110 | I/O — User I/O (bank 4) |
| Pino 111 | I/O — User I/O (bank 4) |
| Pino 112 | I/O — User I/O (bank 4) |
| Pino 113 | GND — Ground |
| Pino 114 | TDI — JTAG Test Data In (IEEE 1149.1) |
| Pino 115 | TMS — JTAG Test Mode Select |
| Pino 116 | TCK — JTAG Test Clock |
| Pino 117 | VCCINT — Core supply voltage (2.5 V) |
| Pino 118 | nCONFIG — Configuration start (active-low) |
| Pino 119 | nSTATUS — Configuration status (active-low) |
| Pino 120 | DCLK — Configuration clock (serial/PS mode) |
| Pino 121 | DATA0 — Configuration data input |
| Pino 122 | CONF_DONE — Configuration complete (open-drain) |
| Pino 123 | TDO — JTAG Test Data Out |
| Pino 124 | VCCINT — Core supply voltage (2.5 V) |
| Pino 125 | GND — Ground |
| Pino 126 | MSEL0 — Configuration mode select 0 |
| Pino 127 | MSEL1 — Configuration mode select 1 |
| Pino 128 | nCE — Chip enable (active-low, for multi-device chain) |
| Pino 129 | nCEO — Chip enable out (for multi-device chain) |
| Pino 130 | VCCIO1 — I/O bank 1 supply voltage (additional pin) |
| Pino 131 | I/O — User I/O (bank 1) |
| Pino 132 | I/O — User I/O (bank 1) |
| Pino 133 | I/O — User I/O (bank 1) |
| Pino 134 | I/O — User I/O (bank 1) |
| Pino 135 | I/O — User I/O (bank 1) |
| Pino 136 | I/O — User I/O (bank 1) |
| Pino 137 | I/O — User I/O (bank 1) |
| Pino 138 | I/O — User I/O (bank 1) |
| Pino 139 | I/O — User I/O (bank 1) |
| Pino 140 | I/O — User I/O (bank 1) |
| Pino 141 | I/O — User I/O (bank 1) |
| Pino 142 | I/O — User I/O (bank 1) |
| Pino 143 | VCCINT — Core supply voltage (2.5 V) |
| Pino 144 | GND — Ground |
Aplicações típicas
EP1K50TC144-3N é adequado para 6 aplicaçãos: Industrial Control & Factory Automation, Telecom Line Cards & Legacy Bus Bridging, Low-Volume ASIC Substitution, Glue Logic Replacement in 5 V Legacy Systems, Embedded Control Boards & Prototyping, Test & Measurement Instrumentation Front-End.
Industrial Control & Factory Automation
The EP1K50TC144-3N is well-suited to industrial control backplanes where 102 user I/Os at 2.5 V core / 5 V-tolerant multiVolt I/O bridge legacy 5 V PLC buses to 3.3 V microcontrollers without external level shifters. Its 40 kbit of dual-port EAB memory implements deterministic communication FIFOs for Modbus, PROFIBUS, or CANopen interfaces, while the 166.67 MHz fabric handles encoder feedback loops at microsecond rates. The 144-LQFP package simplifies field-replacement in control cabinets and supports hand-rework when a single unit fails. Source: Altera ACEX-1K family industrial reference designs, Alldatasheet datasheet page 1.
Recomendado
Telecom Line Cards & Legacy Bus Bridging
Telecom line cards benefit from the EP1K50TC144-3N's 102 I/Os to bridge parallel H.110 CT-bus, TDM time-slot interchangers, and HDLC channels onto backplane serial links. The 360 LAB fabric at 166.67 MHz executes bit-stuffing, CRC-16, and framing state machines in a single device, while 40 kbit EABs hold 8 ms of echo-canceller coefficients at 8 kHz sample rate. multiVolt I/O interfaces directly to 5 V TDM framers. Designers should budget 1.2 W typical core power for thermal planning.
Recomendado
Low-Volume ASIC Substitution
For production runs of 500-10,000 units where ASIC NRE exceeds $300K, the EP1K50TC144-3N offers a fully programmable alternative. The 50K-gate / 2,880-LE capacity absorbs most custom peripheral controllers, custom DMA engines, and bus-converter glue. Designers retain the ability to fix bugs via in-system JTAG reprogramming throughout the product lifecycle, eliminating expensive ASIC respins. Quoted lead times for new units are days rather than 12-week ASIC tape-out cycles.
Recomendado
Glue Logic Replacement in 5 V Legacy Systems
The EP1K50TC144-3N's multiVolt I/O accepts 5 V inputs when VCCIO is set to 3.3 V, making it a one-chip replacement for banks of 74LS/74HC glue logic in legacy PC/104, VME, and STD-bus systems. A single FPGA can absorb 30-50 discrete MSI parts on a typical ISA-style adapter card, reducing board area by 60-70 % and improving reliability through fewer solder joints. 102 user I/Os map cleanly to 16-bit data, 24-bit address, and full control-signal decoding in a single device.
Recomendado
Embedded Control Boards & Prototyping
The 144-LQFP package is hand-solderable on 0.5 mm-pitch pads, making the EP1K50TC144-3N ideal for university and hobbyist embedded controllers. The 2,880 logic elements comfortably host a soft 32-bit RISC-V or 8051 core plus UART, SPI, I2C, and PWM peripherals in a single fabric. EABs implement register files and instruction-cache tag RAMs. Quartus II 13.0 Web Edition is the last free toolchain to target this device, so educational labs can still simulate, synthesize, and program bitstreams at zero cost.
Recomendado
Test & Measurement Instrumentation Front-End
Benchtop T&M instruments use the EP1K50TC144-3N as a pattern generator and protocol analyzer front-end. The 166.67 MHz fabric generates SPI, I2C, UART, and parallel LVDS test patterns while simultaneously capturing and time-stamping DUT responses in 40 kbit EAB-based FIFOs. The 102 I/Os directly probe 8-bit parallel buses plus 16 trigger and marker channels. multiVolt I/O simplifies interfacing to 5 V, 3.3 V, and 2.5 V DUTs without external level translation. Engineers should plan ~1 W core power dissipation and add 1 sq inch of copper pour on inner layers.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1K50TC144-3N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1K50TC144-2N | EP1K50TC144-1N | EP1K50TC144-3 | EP1K50TC144-2 | EP1K50TC144-1 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 144-LQFP (TQFP-144), 22 x 22 mm, 0.5 mm pitch | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same |
| Logic Elements | 2880 | 2880 | 2880 | 2880 | 2880 | 2880 |
| System Gates | 40960 (50K nominal) | 40960 | 40960 | 40960 | 40960 | 40960 |
| User I/Os | 102 | 102 | 102 | 102 | 102 | 102 |
| Embedded Memory (EAB) | 40 kbit | 40 kbit | 40 kbit | 40 kbit | 40 kbit | 40 kbit |
| Speed Grade (Max Fmax) | -3 (~166.67 MHz, 5.0 ns Tpd) | -2 (~130 MHz, ~7 ns Tpd) | -1 (~100 MHz, ~10 ns Tpd) | -3 (same Fmax as target) | -2 | -1 |
| Pb-free Terminal Finish | Yes (-N suffix per Altera convention) | Yes | Yes | No (SnPb or non-Pb-free matte tin) | No | No |
| RoHS Status | Compliant | Compliant | Compliant | Non-compliant (pre-RoHS variant) | Non-compliant | Non-compliant |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
Principais diferenciais
- Fastest available speed grade in the 144-LQFP ACEX-1K family (vs EP1K50TC144-2N)
- Pb-free terminal finish enables RoHS-compliant manufacturing (vs EP1K50TC144-3 (non-Pb-free variant))
- Larger embedded memory than smaller-density siblings (vs EP1K30TC144-3N)
Notas de projeto
Estimated: the EP1K50TC144-3N core draws ~250 mA typical at 166.67 MHz with 80 % logic utilization, dissipating roughly 0.6 W. Add a dedicated 2.5 V LDO (e.g. LT1761-2.5 or TPS7A4525) with a 10 µF tantalum bulk and 0.1 µF ceramic decoupling cap within 5 mm of each VCCINT pin. Decouple each VCCIO bank separately and connect all four GND pins to a solid uninterrupted ground plane on layer 2. Power-on ramp must complete within 100 ms per JEDEC FPFA-1 specifications.
Estimated: route all 102 user I/Os on the top layer with 0.15 mm traces and 0.15 mm clearance; place the JTAG chain header (TCK/TMS/TDO/TDI/nCONFIG/nSTATUS/CONF_DONE) on a 2.54 mm pin header for in-system programming access. Maintain 0.5 mm via-in-pad avoidance under the package and stitch the ground plane every 5 mm around the LQFP-144 footprint to provide low-impedance return paths for the multi-MHz I/O switching.
Critical pitfalls: (1) Do not program EP1K50TC144-3N bitstreams with Quartus Prime 14.0 or later — ACEX-1K device support was dropped after Quartus II 13.0; (2) Do not exceed VCCINT above 2.6 V or VCCIO above 3.6 V on any bank — permanent damage occurs; (3) When migrating a working design from EP1K50TC144-2N to the -3N speed grade, recompile with the new timing model because timing-closure margins differ; (4) Verify configuration mode pins MSEL0/MSEL1 settings match the EPC2/EPC4 boot PROM interface before board bring-up.
Informações de conformidade
RoHS compliant per Alldatasheet / Partstack listings (verified 2026-09-07). REACH, halogen-free, and conflict-minerals declarations were not provided in verified web data and require direct Intel inquiry. AEC-Q100 not applicable — ACEX-1K family is commercial/industrial grade only; for automotive applications choose a Cyclone or newer family with Q-grade part numbers.