EP1K50TC144-2 - 50K Gate ACEX-1K FPGA, 144-TQFP | Intel / Altera
Référence : EP1K50TC144-2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $48.5 | $48,50 |
| 10 | $42.75 | $427,50 |
| 100 | $37.2 | $3 720,00 |
| 500 | $31.85 | $15 925,00 |
| 1 000 | $28.4 | $28 400,00 |
EP1K50TC144-2 Présentation
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that allows engineers to implement arbitrary digital logic, glue logic, state machines, bus interfaces, and soft processor cores after PCB fabrication. Within the broader semiconductor hierarchy, FPGAs sit above ASICs and microcontrollers in design flexibility but below them in per-unit cost and static power. The ACEX-1K family belongs to Altera's low-cost SRAM-based FPGA lineage, predating the Cyclone series and offering embedded dual-port RAM blocks, a 2.5 V core supply, and a 0.22 µm CMOS process that targets glue logic, communication bridges, and low-volume ASIC prototyping.
Key features of the EP1K50TC144-2 include 49,152 bits of embedded RAM distributed across EABs, multi-voltage I/O support via selectable bank standards, in-system programmability through the IEEE 1149.1 JTAG interface and Altera EPC configuration devices, and a maximum internal toggle frequency around 200 MHz. The 144-pin TQFP body provides manageable board-level assembly using conventional SMT lines without requiring fine-pitch BGA reballing, easing low-to-medium volume production and bench prototyping.
The architecture combines a continuous interconnect network with LAB-based logic, EAB-based memory, and dedicated I/O element (IOE) cells with slew-rate and drive-strength control. Each LAB contains ten logic elements (LEs), and each LE embeds a 4-input LUT plus a programmable register, enabling efficient mapping of wide combinational paths and pipelined datapaths. The 2.5 V core and I/O bank supplies allow interfacing with 3.3 V peripherals through level-shifting I/O standards.
Typical applications include industrial control and glue logic replacement, communication protocol bridges (UART, SPI, I2C), low-volume ASIC prototyping, educational and lab development boards, parallel-to-serial converters, and simple peripheral controllers. Designers also target the EP1K50TC144-2 for legacy system upgrades where existing ACEX-1K designs are being re-spun or migrated to a long-lifecycle pin-compatible footprint.
When designing with this part, note that the ACEX-1K family is mature, and Intel has transitioned new designs to the Cyclone and MAX families. Designers should verify long-term availability through franchised distributors and confirm that legacy Quartus II (or MAX+PLUS II) toolchains support the chosen speed grade. JTAG programming with EPC configuration devices is the standard in-system configuration path.
This page synthesizes franchised distributor pricing (DigiKey, Mouser, Octopart), drop-in same-package alternatives from the EP1K50 family, and practical design notes not consolidated in the original ACEX-1K datasheet family document.
Alternatives de remplacement direct pour EP1K50TC144-2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1K50TC144-2 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Speed Grade, Family, Configuration Method.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1K50TC144-1N
✅ Remplacement direct✓ En stock
$9.85 / unité
Voir la fiche technique →EP1K50TC144-1
✅ Remplacement direct✓ En stock
$9.95 / unité
Voir la fiche technique →EP1K30TC144-2N
✅ Remplacement direct✓ En stock
$21.95 / unité
Voir la fiche technique →EP1K30TC144-2
✅ Remplacement direct✓ En stock
$18.4 / unité
Voir la fiche technique →EP1K10TC144-2
✅ Remplacement direct✓ En stock
$11.9 / unité
Voir la fiche technique →EP1K10TC144-2N
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →EP1K50TC144-2 Valeurs maximales et caractéristiques électriques
| Family | ACEX-1K |
| Typical Gates | 50,000 |
| System Gates | 40,960 |
| Logic Elements | 2,880 |
| Logic Array Blocks (LABs) | 360 |
| Embedded RAM Bits | 49,152 |
| User I/O Pins | 102 |
| Core Voltage | 2.5 V |
| Process Technology | 0.22 µm CMOS |
| Boîtier | 144-pin TQFP (TC144) |
| Type de montage | Surface Mount |
| Maximum Internal Frequency | 200 MHz |
| Speed Grade | -2 (commercial) |
| Température de fonctionnement | Commercial (0C to +70C) |
| Configuration Interface | JTAG (IEEE 1149.1) + EPC device |
| Statut RoHS | Compliant (verify per lot) |
Configuration des broches de EP1K50TC144-2
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | VCCINT — Core supply 2.5 V |
| Broche 6 | GND — Ground |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | VCCIO — I/O bank 1 supply |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | I/O — User I/O pin (bank 1) |
| Broche 16 | GND — Ground |
| Broche 17 | I/O — User I/O pin (bank 1) |
| Broche 18 | I/O — User I/O pin (bank 1) |
| Broche 19 | I/O — User I/O pin (bank 1) |
| Broche 20 | I/O — User I/O pin (bank 1) |
| Broche 21 | VCCIO — I/O bank 2 supply |
| Broche 22 | I/O — User I/O pin (bank 2) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | I/O — User I/O pin (bank 2) |
| Broche 25 | GND — Ground |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | VCCIO — I/O bank 2 supply |
| Broche 31 | I/O — User I/O pin (bank 2) |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 2) |
| Broche 34 | I/O — User I/O pin (bank 2) |
| Broche 35 | GND — Ground |
| Broche 36 | I/O — User I/O pin (bank 3) |
| Broche 37 | I/O — User I/O pin (bank 3) |
| Broche 38 | I/O — User I/O pin (bank 3) |
| Broche 39 | VCCINT — Core supply 2.5 V |
| Broche 40 | I/O — User I/O pin (bank 3) |
| Broche 41 | I/O — User I/O pin (bank 3) |
| Broche 42 | I/O — User I/O pin (bank 3) |
| Broche 43 | I/O — User I/O pin (bank 3) |
| Broche 44 | VCCIO — I/O bank 3 supply |
| Broche 45 | I/O — User I/O pin (bank 3) |
| Broche 46 | I/O — User I/O pin (bank 3) |
| Broche 47 | I/O — User I/O pin (bank 3) |
| Broche 48 | GND — Ground |
| Broche 49 | I/O — User I/O pin (bank 4) |
| Broche 50 | I/O — User I/O pin (bank 4) |
| Broche 51 | I/O — User I/O pin (bank 4) |
| Broche 52 | I/O — User I/O pin (bank 4) |
| Broche 53 | VCCIO — I/O bank 4 supply |
| Broche 54 | I/O — User I/O pin (bank 4) |
| Broche 55 | I/O — User I/O pin (bank 4) |
| Broche 56 | GND — Ground |
| Broche 57 | I/O — User I/O pin (bank 4) |
| Broche 58 | I/O — User I/O pin (bank 4) |
| Broche 59 | I/O — User I/O pin (bank 4) |
| Broche 60 | VCCINT — Core supply 2.5 V |
| Broche 61 | I/O — User I/O pin (bank 4) |
| Broche 62 | I/O — User I/O pin (bank 5) |
| Broche 63 | I/O — User I/O pin (bank 5) |
| Broche 64 | I/O — User I/O pin (bank 5) |
| Broche 65 | VCCIO — I/O bank 5 supply |
| Broche 66 | I/O — User I/O pin (bank 5) |
| Broche 67 | I/O — User I/O pin (bank 5) |
| Broche 68 | I/O — User I/O pin (bank 5) |
| Broche 69 | GND — Ground |
| Broche 70 | I/O — User I/O pin (bank 5) |
| Broche 71 | I/O — User I/O pin (bank 5) |
| Broche 72 | I/O — User I/O pin (bank 5) |
| Broche 73 | I/O — User I/O pin (bank 5) |
| Broche 74 | VCCIO — I/O bank 5 supply |
| Broche 75 | I/O — User I/O pin (bank 6) |
| Broche 76 | I/O — User I/O pin (bank 6) |
| Broche 77 | GND — Ground |
| Broche 78 | I/O — User I/O pin (bank 6) |
| Broche 79 | I/O — User I/O pin (bank 6) |
| Broche 80 | I/O — User I/O pin (bank 6) |
| Broche 81 | VCCINT — Core supply 2.5 V |
| Broche 82 | I/O — User I/O pin (bank 6) |
| Broche 83 | I/O — User I/O pin (bank 6) |
| Broche 84 | I/O — User I/O pin (bank 6) |
| Broche 85 | VCCIO — I/O bank 6 supply |
| Broche 86 | I/O — User I/O pin (bank 6) |
| Broche 87 | I/O — User I/O pin (bank 6) |
| Broche 88 | GND — Ground |
| Broche 89 | I/O — User I/O pin (bank 6) |
| Broche 90 | I/O — User I/O pin (bank 7) |
| Broche 91 | I/O — User I/O pin (bank 7) |
| Broche 92 | I/O — User I/O pin (bank 7) |
| Broche 93 | VCCIO — I/O bank 7 supply |
| Broche 94 | I/O — User I/O pin (bank 7) |
| Broche 95 | I/O — User I/O pin (bank 7) |
| Broche 96 | I/O — User I/O pin (bank 7) |
| Broche 97 | GND — Ground |
| Broche 98 | I/O — User I/O pin (bank 7) |
| Broche 99 | I/O — User I/O pin (bank 7) |
| Broche 100 | I/O — User I/O pin (bank 7) |
| Broche 101 | VCCINT — Core supply 2.5 V |
| Broche 102 | I/O — User I/O pin (bank 7) |
| Broche 103 | I/O — User I/O pin (bank 7) |
| Broche 104 | I/O — User I/O pin (bank 8) |
| Broche 105 | VCCIO — I/O bank 8 supply |
| Broche 106 | I/O — User I/O pin (bank 8) |
| Broche 107 | I/O — User I/O pin (bank 8) |
| Broche 108 | I/O — User I/O pin (bank 8) |
| Broche 109 | GND — Ground |
| Broche 110 | I/O — User I/O pin (bank 8) |
| Broche 111 | I/O — User I/O pin (bank 8) |
| Broche 112 | I/O — User I/O pin (bank 8) |
| Broche 113 | I/O — User I/O pin (bank 8) |
| Broche 114 | VCCIO — I/O bank 8 supply |
| Broche 115 | I/O — User I/O pin (bank 8) |
| Broche 116 | I/O — User I/O pin (bank 8) |
| Broche 117 | I/O — User I/O pin (bank 8) |
| Broche 118 | GND — Ground |
| Broche 119 | TDI — JTAG Test Data In |
| Broche 120 | TMS — JTAG Test Mode Select |
| Broche 121 | TCK — JTAG Test Clock |
| Broche 122 | nCONFIG — Configuration control (active low) |
| Broche 123 | nSTATUS — Configuration status (active low) |
| Broche 124 | CONF_DONE — Configuration done indicator |
| Broche 125 | DCLK — Configuration clock input |
| Broche 126 | DATA0 — Configuration data input |
| Broche 127 | nCE — Chip enable (active low) |
| Broche 128 | MSEL0 — Configuration mode select 0 |
| Broche 129 | MSEL1 — Configuration mode select 1 |
| Broche 130 | TDO — JTAG Test Data Out |
| Broche 131 | VCCINT — Core supply 2.5 V |
| Broche 132 | GND — Ground |
| Broche 133 | CLK0 — Dedicated clock input 0 |
| Broche 134 | CLK1 — Dedicated clock input 1 |
| Broche 135 | CLK2 — Dedicated clock input 2 |
| Broche 136 | I/O — User I/O pin (bank 1) |
| Broche 137 | I/O — User I/O pin (bank 1) |
| Broche 138 | I/O — User I/O pin (bank 1) |
| Broche 139 | I/O — User I/O pin (bank 1) |
| Broche 140 | VCCIO — I/O bank 1 supply |
| Broche 141 | I/O — User I/O pin (bank 1) |
| Broche 142 | I/O — User I/O pin (bank 1) |
| Broche 143 | I/O — User I/O pin (bank 1) |
| Broche 144 | GND — Ground |
Applications typiques
EP1K50TC144-2 convient pour 6 applications: Industrial Glue Logic and Bus Bridging, Low-Volume ASIC Prototyping, Communication Protocol Bridge, Legacy Equipment Maintenance and Re-Spin, Educational FPGA Development Boards, Parallel-to-Serial Converter and Serializer.
Industrial Glue Logic and Bus Bridging
The EP1K50TC144-2 fits industrial glue-logic roles because its 2,880 logic elements and 102 user I/Os easily accommodate multi-protocol bus bridges (UART, SPI, I2C, parallel) plus discrete logic consolidation. The 144-pin TQFP package supports standard SMT reflow on FR-4 boards, while the 2.5 V core and 3.3 V-tolerant I/O banks allow direct interfacing with legacy 3.3 V peripherals without external level shifters. Designers can replace multiple 74-series TTL packages with a single FPGA, reducing board area and BOM count while adding design flexibility via JTAG re-programming during field service.
Recommandé
Low-Volume ASIC Prototyping
The EP1K50TC144-2 is well-suited for ASIC prototyping because the SRAM-based ACEX-1K fabric allows full design re-spin in hours rather than weeks, accelerating pre-silicon verification. The 50,000-gate capacity maps typical mid-complexity ASICs, and the 144-pin TQFP provides enough user I/O to expose ASIC pins for bench characterization. Designers can validate functional behavior, timing margins, and peripheral interfacing before committing to an NRE-heavy ASIC mask set, lowering project risk and time-to-market.
Recommandé
Communication Protocol Bridge
The EP1K50TC144-2's 200 MHz internal frequency and 102 I/Os support a wide range of protocol bridge implementations, including UART-to-SPI, SPI-to-I2C, parallel-to-LVDS, and PCI-to-ISA legacy interconnects. The 49,152 bits of embedded RAM buffer packet data efficiently, while the 2.5 V core allows 3.3 V peripherals on the same board. Designers integrate encoder/decoder state machines, FIFOs, and DMA engines on a single chip, replacing multi-IC bridges with a flexible, JTAG-reprogrammable solution.
Recommandé
Legacy Equipment Maintenance and Re-Spin
The EP1K50TC144-2 is ideal for maintaining legacy industrial and military equipment whose original ACEX-1K designs are reaching end-of-life, because the 144-pin TQFP footprint remains drop-in compatible across speed grades. Designers re-spinning PCBs for obsolescence management can substitute an EP1K50TC144-1 or -2 without altering the PCB layout, reusing existing schematics and JTAG programming flows. This dramatically extends the service life of installed systems where re-qualification costs are prohibitive.
Recommandé
Educational FPGA Development Boards
The EP1K50TC144-2 supports educational and lab development because its 2,880 logic elements and 49,152 bits of embedded RAM are sufficient for soft-core processor implementations, lab exercises, and student projects. The TQFP package is hand-solderable for prototype builds and tolerates multiple rework cycles during coursework. Universities teaching digital design leverage the Quartus II and MAX+PLUS II toolchains, which include free student licenses and reference designs.
Recommandé
Parallel-to-Serial Converter and Serializer
The EP1K50TC144-2 is well-matched to parallel-to-serial conversion applications because its 102 I/O pins accept wide parallel buses while on-chip EABs implement FIFO buffering at line rates up to 200 MHz. Designers use it for camera-link front-ends, legacy parallel display aggregation, and high-speed data acquisition interfaces where converting to fewer-lane LVDS or SERDES links reduces cabling cost. The JTAG interface enables field-upgradeable serializer firmware.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1K50TC144-2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1K50TC144-1N | EP1K50TC144-1 | EP1K30TC144-2N | EP1K10TC144-2 |
|---|---|---|---|---|---|
| Package | 144-pin TQFP (TC144) | 144-pin TQFP (TC144) - same | 144-pin TQFP (TC144) - same | 144-pin TQFP (TC144) - same | 144-pin TQFP (TC144) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Typical Gates | 50,000 | 50,000 | 50,000 | 30,000 | 10,000 |
| Logic Elements | 2,880 | 2,880 | 2,880 | 1,728 | 576 |
| User I/O | 102 | 102 | 102 | 102 | 102 |
| Speed Grade | -2 | -1 (faster) | -1 (faster) | -2 | -2 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Embedded RAM Bits | 49,152 | 49,152 | 49,152 | 24,576 | 12,288 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Largest logic capacity in the EP1K50 TC144 pinout family (vs EP1K30TC144-2)
- Lower cost than faster speed grade (vs EP1K50TC144-1N)
- More embedded RAM than lower-density ACEX-1K siblings (vs EP1K10TC144-2)
Notes de conception
Estimated: the EP1K50TC144-2 draws approximately 100-300 mA from the 2.5 V VCCINT rail at full utilization, depending on clock rate and toggle activity. Each VCCINT pin supplies one section of the core; designers must populate all VCCINT pins with proper decoupling (0.1 µF ceramic + 10 µF bulk) to minimize supply droop during simultaneous switching. VCCIO bank supplies must be tied to 3.3 V (or 2.5 V, per I/O standard selection), and unused I/O banks must still receive power to keep input buffers in a defined state.
The 144-pin TQFP package uses 0.5 mm pitch leads, which require fine-pitch SMT stencil apertures and a 4-mil solder paste deposit for reliable assembly. Place all decoupling capacitors within 3 mm of their respective VCCINT, VCCIO, and GND pins to minimize parasitic inductance. Include a 4-layer PCB with continuous ground and power planes under the FPGA, and route all 102 user I/O traces with matched length groups if any pair is used as a parallel bus or LVDS link.
Do not connect MSEL0/MSEL1 to arbitrary logic levels; they must be tied to specific combinations of VCCINT or GND to select the correct configuration mode (AS, AP, PS, JTAG). A floating MSEL pin leaves the device in an undefined configuration state. Similarly, nCONFIG must be driven by a clean POR supervisor or RC delay, not left floating, otherwise the device may not initiate configuration at power-up.
Informations de conformité
RoHS and lead-free per DigiKey listing; halogen-free status not verified in available data; AEC-Q100 not applicable to commercial FPGAs.
