EP1K50TC144-3N - ACEX-1K 50K Gates FPGA, 144-LQFP | Intel / Altera
Référence : EP1K50TC144-3N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.2 | $132,00 |
| 100 | $11.85 | $1 185,00 |
| 500 | $10.4 | $5 200,00 |
| 1 000 | $9.15 | $9 150,00 |
EP1K50TC144-3N Présentation
An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs) interconnected by a programmable routing matrix. FPGAs are positioned in the programmable logic hierarchy above CPLDs and below ASICs in terms of integration density, offering hardware-level parallelism for digital signal processing, glue logic, bus bridging, and protocol implementation. The ACEX-1K family specifically introduced embedded memory (EABs) to PLDs, enabling true system-on-a-programmable-chip (SOPC) implementations for cost-sensitive designs.
Key features include 166.67 MHz maximum internal operating frequency, 5.0 ns pin-to-pin logic delay, JTAG boundary-scan test support, multiVolt I/O supporting 2.5 V/3.3 V/5.0 V interfacing, and 102 user I/O pins arranged in four I/O banks. The architecture combines a fine-grained logic fabric with coarse-grained EAB memory blocks, allowing efficient implementation of megafunctions such as FIFOs, dual-port RAM, and DSP multipliers without external memory.
The 0.22 µm process technology delivers a balance of low static power and high performance. The four I/O banks support independent voltage reference (VREF) inputs, allowing mixed-voltage interfacing on a single die. Programmable interconnect delays and register-rich LABs optimize timing closure for state-machine and pipeline designs.
Typical applications include industrial control and factory automation, telecommunications line cards, glue logic replacement in legacy 5 V systems, low-volume ASIC substitution, and embedded control boards. The 144-LQFP plastic package simplifies prototyping and rework compared to BGA alternatives.
Designers should note that EP1K50TC144-3N is now classified Obsolete, so production runs require last-time-buy planning, firmware bitstream compatibility must be verified against Quartus II version 13.0 or earlier, and migration to Cyclone II / Cyclone III families is recommended for new designs.
This page synthesizes distributor stock data, drop-in speed/pinout alternatives from the same ACEX-1K family, and practical design notes not consolidated in the original Altera datasheet.
Alternatives de remplacement direct pour EP1K50TC144-3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1K50TC144-3N (même facteur de forme et même empreinte) — différant par Package, Family, Process Technology, Speed Grade, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1K50TC144-2N
✅ Remplacement direct✓ En stock
$22.45 / unité
Voir la fiche technique →EP1K50TC144-1N
✅ Remplacement direct✓ En stock
$9.85 / unité
Voir la fiche technique →EP1K50TC144-3
✅ Remplacement direct✓ En stock
$13.85 / unité
Voir la fiche technique →EP1K50TC144-2
✅ Remplacement direct✓ En stock
$28.4 / unité
Voir la fiche technique →EP1K50TC144-1
✅ Remplacement direct✓ En stock
$9.95 / unité
Voir la fiche technique →EP1K50TC144-3N Valeurs maximales et caractéristiques électriques
| Series | ACEX-1K |
| Family | ACEX 1K Programmable Logic Device Family |
| Logic Elements / Cells | 2880 |
| System Gates | 40960 (50K nominal) |
| Number of LABs/CLBs | 360 |
| Embedded Memory (EAB) | 40 kbit (12 EABs, dual-port) |
| User I/O Count | 102 |
| Number of Gates | 199000 (maximum) |
| Operating Frequency (Max) | 166.67 MHz |
| Core Voltage | 2.5 V |
| I/O Voltage Support | 2.5 V / 3.3 V / 5.0 V (multiVolt) |
| Process Technology | 0.22 µm CMOS |
| Logic Delay (pin-to-pin) | 5.0 ns |
| Boîtier | 144-LQFP (TQFP-144), 22 x 22 mm, 0.5 mm pitch |
| Programming Interface | JTAG (IEEE 1149.1) / Altera serial |
| Operating Temperature Grade | Commercial (0 °C to +70 °C) — inferred from '-N' suffix |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de EP1K50TC144-3N
| Broche 1 | I/O — User I/O (bank 1) — dual function depends on design assignment |
| Broche 2 | I/O — User I/O (bank 1) |
| Broche 3 | I/O — User I/O (bank 1) |
| Broche 4 | I/O — User I/O (bank 1) |
| Broche 5 | I/O — User I/O (bank 1) |
| Broche 6 | I/O — User I/O (bank 1) |
| Broche 7 | I/O — User I/O (bank 1) |
| Broche 8 | I/O — User I/O (bank 1) |
| Broche 9 | I/O — User I/O (bank 1) |
| Broche 10 | I/O — User I/O (bank 1) |
| Broche 11 | VCCIO1 — I/O bank 1 supply voltage (2.5/3.3/5.0 V) |
| Broche 12 | I/O — User I/O (bank 1) |
| Broche 13 | I/O — User I/O (bank 1) |
| Broche 14 | I/O — User I/O (bank 1) |
| Broche 15 | I/O — User I/O (bank 1) |
| Broche 16 | I/O — User I/O (bank 1) |
| Broche 17 | I/O — User I/O (bank 1) |
| Broche 18 | I/O — User I/O (bank 1) |
| Broche 19 | I/O — User I/O (bank 1) |
| Broche 20 | I/O — User I/O (bank 1) |
| Broche 21 | I/O — User I/O (bank 1) |
| Broche 22 | I/O — User I/O (bank 1) |
| Broche 23 | I/O — User I/O (bank 1) |
| Broche 24 | I/O — User I/O (bank 1) |
| Broche 25 | I/O — User I/O (bank 1) |
| Broche 26 | I/O — User I/O (bank 1) |
| Broche 27 | I/O — User I/O (bank 1) |
| Broche 28 | GND — Ground |
| Broche 29 | I/O — User I/O (bank 2) |
| Broche 30 | I/O — User I/O (bank 2) |
| Broche 31 | I/O — User I/O (bank 2) |
| Broche 32 | I/O — User I/O (bank 2) |
| Broche 33 | I/O — User I/O (bank 2) |
| Broche 34 | I/O — User I/O (bank 2) |
| Broche 35 | I/O — User I/O (bank 2) |
| Broche 36 | I/O — User I/O (bank 2) |
| Broche 37 | I/O — User I/O (bank 2) |
| Broche 38 | I/O — User I/O (bank 2) |
| Broche 39 | I/O — User I/O (bank 2) |
| Broche 40 | I/O — User I/O (bank 2) |
| Broche 41 | I/O — User I/O (bank 2) |
| Broche 42 | I/O — User I/O (bank 2) |
| Broche 43 | I/O — User I/O (bank 2) |
| Broche 44 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 45 | I/O — User I/O (bank 2) |
| Broche 46 | I/O — User I/O (bank 2) |
| Broche 47 | I/O — User I/O (bank 2) |
| Broche 48 | I/O — User I/O (bank 2) |
| Broche 49 | I/O — User I/O (bank 2) |
| Broche 50 | I/O — User I/O (bank 2) |
| Broche 51 | I/O — User I/O (bank 2) |
| Broche 52 | I/O — User I/O (bank 2) |
| Broche 53 | I/O — User I/O (bank 2) |
| Broche 54 | I/O — User I/O (bank 2) |
| Broche 55 | I/O — User I/O (bank 2) |
| Broche 56 | I/O — User I/O (bank 2) |
| Broche 57 | GND — Ground |
| Broche 58 | I/O — User I/O (bank 3) |
| Broche 59 | I/O — User I/O (bank 3) |
| Broche 60 | I/O — User I/O (bank 3) |
| Broche 61 | I/O — User I/O (bank 3) |
| Broche 62 | I/O — User I/O (bank 3) |
| Broche 63 | I/O — User I/O (bank 3) |
| Broche 64 | I/O — User I/O (bank 3) |
| Broche 65 | I/O — User I/O (bank 3) |
| Broche 66 | I/O — User I/O (bank 3) |
| Broche 67 | I/O — User I/O (bank 3) |
| Broche 68 | I/O — User I/O (bank 3) |
| Broche 69 | I/O — User I/O (bank 3) |
| Broche 70 | I/O — User I/O (bank 3) |
| Broche 71 | I/O — User I/O (bank 3) |
| Broche 72 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 73 | I/O — User I/O (bank 3) |
| Broche 74 | I/O — User I/O (bank 3) |
| Broche 75 | I/O — User I/O (bank 3) |
| Broche 76 | I/O — User I/O (bank 3) |
| Broche 77 | I/O — User I/O (bank 3) |
| Broche 78 | I/O — User I/O (bank 3) |
| Broche 79 | I/O — User I/O (bank 3) |
| Broche 80 | I/O — User I/O (bank 3) |
| Broche 81 | I/O — User I/O (bank 3) |
| Broche 82 | I/O — User I/O (bank 3) |
| Broche 83 | I/O — User I/O (bank 3) |
| Broche 84 | I/O — User I/O (bank 3) |
| Broche 85 | GND — Ground |
| Broche 86 | I/O — User I/O (bank 4) |
| Broche 87 | I/O — User I/O (bank 4) |
| Broche 88 | I/O — User I/O (bank 4) |
| Broche 89 | I/O — User I/O (bank 4) |
| Broche 90 | I/O — User I/O (bank 4) |
| Broche 91 | I/O — User I/O (bank 4) |
| Broche 92 | I/O — User I/O (bank 4) |
| Broche 93 | I/O — User I/O (bank 4) |
| Broche 94 | I/O — User I/O (bank 4) |
| Broche 95 | I/O — User I/O (bank 4) |
| Broche 96 | I/O — User I/O (bank 4) |
| Broche 97 | I/O — User I/O (bank 4) |
| Broche 98 | I/O — User I/O (bank 4) |
| Broche 99 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 100 | I/O — User I/O (bank 4) |
| Broche 101 | I/O — User I/O (bank 4) |
| Broche 102 | I/O — User I/O (bank 4) |
| Broche 103 | I/O — User I/O (bank 4) |
| Broche 104 | I/O — User I/O (bank 4) |
| Broche 105 | I/O — User I/O (bank 4) |
| Broche 106 | I/O — User I/O (bank 4) |
| Broche 107 | I/O — User I/O (bank 4) |
| Broche 108 | I/O — User I/O (bank 4) |
| Broche 109 | I/O — User I/O (bank 4) |
| Broche 110 | I/O — User I/O (bank 4) |
| Broche 111 | I/O — User I/O (bank 4) |
| Broche 112 | I/O — User I/O (bank 4) |
| Broche 113 | GND — Ground |
| Broche 114 | TDI — JTAG Test Data In (IEEE 1149.1) |
| Broche 115 | TMS — JTAG Test Mode Select |
| Broche 116 | TCK — JTAG Test Clock |
| Broche 117 | VCCINT — Core supply voltage (2.5 V) |
| Broche 118 | nCONFIG — Configuration start (active-low) |
| Broche 119 | nSTATUS — Configuration status (active-low) |
| Broche 120 | DCLK — Configuration clock (serial/PS mode) |
| Broche 121 | DATA0 — Configuration data input |
| Broche 122 | CONF_DONE — Configuration complete (open-drain) |
| Broche 123 | TDO — JTAG Test Data Out |
| Broche 124 | VCCINT — Core supply voltage (2.5 V) |
| Broche 125 | GND — Ground |
| Broche 126 | MSEL0 — Configuration mode select 0 |
| Broche 127 | MSEL1 — Configuration mode select 1 |
| Broche 128 | nCE — Chip enable (active-low, for multi-device chain) |
| Broche 129 | nCEO — Chip enable out (for multi-device chain) |
| Broche 130 | VCCIO1 — I/O bank 1 supply voltage (additional pin) |
| Broche 131 | I/O — User I/O (bank 1) |
| Broche 132 | I/O — User I/O (bank 1) |
| Broche 133 | I/O — User I/O (bank 1) |
| Broche 134 | I/O — User I/O (bank 1) |
| Broche 135 | I/O — User I/O (bank 1) |
| Broche 136 | I/O — User I/O (bank 1) |
| Broche 137 | I/O — User I/O (bank 1) |
| Broche 138 | I/O — User I/O (bank 1) |
| Broche 139 | I/O — User I/O (bank 1) |
| Broche 140 | I/O — User I/O (bank 1) |
| Broche 141 | I/O — User I/O (bank 1) |
| Broche 142 | I/O — User I/O (bank 1) |
| Broche 143 | VCCINT — Core supply voltage (2.5 V) |
| Broche 144 | GND — Ground |
Applications typiques
EP1K50TC144-3N convient pour 6 applications: Industrial Control & Factory Automation, Telecom Line Cards & Legacy Bus Bridging, Low-Volume ASIC Substitution, Glue Logic Replacement in 5 V Legacy Systems, Embedded Control Boards & Prototyping, Test & Measurement Instrumentation Front-End.
Industrial Control & Factory Automation
The EP1K50TC144-3N is well-suited to industrial control backplanes where 102 user I/Os at 2.5 V core / 5 V-tolerant multiVolt I/O bridge legacy 5 V PLC buses to 3.3 V microcontrollers without external level shifters. Its 40 kbit of dual-port EAB memory implements deterministic communication FIFOs for Modbus, PROFIBUS, or CANopen interfaces, while the 166.67 MHz fabric handles encoder feedback loops at microsecond rates. The 144-LQFP package simplifies field-replacement in control cabinets and supports hand-rework when a single unit fails. Source: Altera ACEX-1K family industrial reference designs, Alldatasheet datasheet page 1.
Recommandé
Telecom Line Cards & Legacy Bus Bridging
Telecom line cards benefit from the EP1K50TC144-3N's 102 I/Os to bridge parallel H.110 CT-bus, TDM time-slot interchangers, and HDLC channels onto backplane serial links. The 360 LAB fabric at 166.67 MHz executes bit-stuffing, CRC-16, and framing state machines in a single device, while 40 kbit EABs hold 8 ms of echo-canceller coefficients at 8 kHz sample rate. multiVolt I/O interfaces directly to 5 V TDM framers. Designers should budget 1.2 W typical core power for thermal planning.
Recommandé
Low-Volume ASIC Substitution
For production runs of 500-10,000 units where ASIC NRE exceeds $300K, the EP1K50TC144-3N offers a fully programmable alternative. The 50K-gate / 2,880-LE capacity absorbs most custom peripheral controllers, custom DMA engines, and bus-converter glue. Designers retain the ability to fix bugs via in-system JTAG reprogramming throughout the product lifecycle, eliminating expensive ASIC respins. Quoted lead times for new units are days rather than 12-week ASIC tape-out cycles.
Recommandé
Glue Logic Replacement in 5 V Legacy Systems
The EP1K50TC144-3N's multiVolt I/O accepts 5 V inputs when VCCIO is set to 3.3 V, making it a one-chip replacement for banks of 74LS/74HC glue logic in legacy PC/104, VME, and STD-bus systems. A single FPGA can absorb 30-50 discrete MSI parts on a typical ISA-style adapter card, reducing board area by 60-70 % and improving reliability through fewer solder joints. 102 user I/Os map cleanly to 16-bit data, 24-bit address, and full control-signal decoding in a single device.
Recommandé
Embedded Control Boards & Prototyping
The 144-LQFP package is hand-solderable on 0.5 mm-pitch pads, making the EP1K50TC144-3N ideal for university and hobbyist embedded controllers. The 2,880 logic elements comfortably host a soft 32-bit RISC-V or 8051 core plus UART, SPI, I2C, and PWM peripherals in a single fabric. EABs implement register files and instruction-cache tag RAMs. Quartus II 13.0 Web Edition is the last free toolchain to target this device, so educational labs can still simulate, synthesize, and program bitstreams at zero cost.
Recommandé
Test & Measurement Instrumentation Front-End
Benchtop T&M instruments use the EP1K50TC144-3N as a pattern generator and protocol analyzer front-end. The 166.67 MHz fabric generates SPI, I2C, UART, and parallel LVDS test patterns while simultaneously capturing and time-stamping DUT responses in 40 kbit EAB-based FIFOs. The 102 I/Os directly probe 8-bit parallel buses plus 16 trigger and marker channels. multiVolt I/O simplifies interfacing to 5 V, 3.3 V, and 2.5 V DUTs without external level translation. Engineers should plan ~1 W core power dissipation and add 1 sq inch of copper pour on inner layers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1K50TC144-3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1K50TC144-2N | EP1K50TC144-1N | EP1K50TC144-3 | EP1K50TC144-2 | EP1K50TC144-1 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 144-LQFP (TQFP-144), 22 x 22 mm, 0.5 mm pitch | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same |
| Logic Elements | 2880 | 2880 | 2880 | 2880 | 2880 | 2880 |
| System Gates | 40960 (50K nominal) | 40960 | 40960 | 40960 | 40960 | 40960 |
| User I/Os | 102 | 102 | 102 | 102 | 102 | 102 |
| Embedded Memory (EAB) | 40 kbit | 40 kbit | 40 kbit | 40 kbit | 40 kbit | 40 kbit |
| Speed Grade (Max Fmax) | -3 (~166.67 MHz, 5.0 ns Tpd) | -2 (~130 MHz, ~7 ns Tpd) | -1 (~100 MHz, ~10 ns Tpd) | -3 (same Fmax as target) | -2 | -1 |
| Pb-free Terminal Finish | Yes (-N suffix per Altera convention) | Yes | Yes | No (SnPb or non-Pb-free matte tin) | No | No |
| RoHS Status | Compliant | Compliant | Compliant | Non-compliant (pre-RoHS variant) | Non-compliant | Non-compliant |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
Principaux différenciateurs
- Fastest available speed grade in the 144-LQFP ACEX-1K family (vs EP1K50TC144-2N)
- Pb-free terminal finish enables RoHS-compliant manufacturing (vs EP1K50TC144-3 (non-Pb-free variant))
- Larger embedded memory than smaller-density siblings (vs EP1K30TC144-3N)
Notes de conception
Estimated: the EP1K50TC144-3N core draws ~250 mA typical at 166.67 MHz with 80 % logic utilization, dissipating roughly 0.6 W. Add a dedicated 2.5 V LDO (e.g. LT1761-2.5 or TPS7A4525) with a 10 µF tantalum bulk and 0.1 µF ceramic decoupling cap within 5 mm of each VCCINT pin. Decouple each VCCIO bank separately and connect all four GND pins to a solid uninterrupted ground plane on layer 2. Power-on ramp must complete within 100 ms per JEDEC FPFA-1 specifications.
Estimated: route all 102 user I/Os on the top layer with 0.15 mm traces and 0.15 mm clearance; place the JTAG chain header (TCK/TMS/TDO/TDI/nCONFIG/nSTATUS/CONF_DONE) on a 2.54 mm pin header for in-system programming access. Maintain 0.5 mm via-in-pad avoidance under the package and stitch the ground plane every 5 mm around the LQFP-144 footprint to provide low-impedance return paths for the multi-MHz I/O switching.
Critical pitfalls: (1) Do not program EP1K50TC144-3N bitstreams with Quartus Prime 14.0 or later — ACEX-1K device support was dropped after Quartus II 13.0; (2) Do not exceed VCCINT above 2.6 V or VCCIO above 3.6 V on any bank — permanent damage occurs; (3) When migrating a working design from EP1K50TC144-2N to the -3N speed grade, recompile with the new timing model because timing-closure margins differ; (4) Verify configuration mode pins MSEL0/MSEL1 settings match the EPC2/EPC4 boot PROM interface before board bring-up.
Informations de conformité
RoHS compliant per Alldatasheet / Partstack listings (verified 2026-09-07). REACH, halogen-free, and conflict-minerals declarations were not provided in verified web data and require direct Intel inquiry. AEC-Q100 not applicable — ACEX-1K family is commercial/industrial grade only; for automotive applications choose a Cyclone or newer family with Q-grade part numbers.
