EP1S10F484C5N - Stratix 10570 LEs FPGA 484-FBGA | Intel / Altera
MPN: EP1S10F484C5N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72 | $720.00 |
| 100 | $65 | $6,500.00 |
| 500 | $58.5 | $29,250.00 |
| 1,000 | $52 | $52,000.00 |
Drop-in alternatives for EP1S10F484C5N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP1S10F484C6N
β Drop-Inβ In Stock
$226.31 / Unit
View Datasheet βEP1S10F484C7N
β Drop-Inβ In Stock
$162 / Unit
View Datasheet βEP1S10F484I5N
β Drop-Inπ Reference alternative (not in catalog)
EP1S10F484C5N-ES
β Drop-Inπ Reference alternative (not in catalog)
EP1S10B672C7N
β Drop-Inβ In Stock
$67.9 / Unit
View Datasheet βEP1S10F484C8N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP1S10F484C5N Maximum Ratings & Electrical Characteristics
| Series | Stratix |
| Family | Stratix (original) |
| Logic Elements (LEs) | 10,570 |
| Logic Array Blocks (LABs) | 1,057 |
| Embedded Memory Bits | 920,448 |
| TriMatrix Memory Blocks | 14 |
| Embedded DSP Blocks | 6 (β48 9-bit multipliers) |
| PLLs | 4 |
| Global Clock Networks | 12 |
| Maximum User I/O | 335 |
| User I/O Standard Support | LVDS, LVPECL, PCI-X, RapidIO, DDR |
| Process Technology | 0.13 Β΅m CMOS |
| Core Voltage (VCCINT) | 1.5 V |
| Maximum Internal Frequency | 500 MHz (per Stratix datasheet) |
| Operating Temperature (TJ) | 0 Β°C to 85 Β°C (Commercial) |
| Package | 484-ball FCBGA (F484), 23 x 23 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Configuration Method | JTAG / Passive Serial / Active Serial |
| Device Status | Obsolete - last time buy completed |
| Design Toolchain | Quartus II (β€ v13.0) |
EP1S10F484C5N Pin Configuration
| Pin A1 | IO β User I/O (bank 1) |
| Pin A2 | IO β User I/O (bank 1) |
| Pin B1 | VCCIO1 β I/O bank 1 supply |
| Pin B2 | GND β Ground |
| Pin C1 | IO β User I/O (bank 2) |
| Pin C2 | VCCINT β Core supply 1.5 V |
| Pin D1 | GND β Ground |
| Pin D2 | IO β User I/O (bank 2) |
| Pin E1 | IO β User I/O (bank 3) |
| Pin E2 | GND β Ground |
| Pin F1 | VCCIO2 β I/O bank 2 supply |
| Pin F2 | IO β User I/O (bank 3) |
| Pin G1 | IO β User I/O (bank 4) |
| Pin G2 | GND β Ground |
| Pin H1 | VCCINT β Core supply 1.5 V |
| Pin H2 | IO β User I/O (bank 4) |
| Pin J1 | IO β User I/O (bank 5) |
| Pin J2 | VCCIO3 β I/O bank 3 supply |
| Pin K1 | GND β Ground |
| Pin K2 | IO β User I/O (bank 5) |
| Pin L1 | IO β User I/O (bank 6) |
| Pin L2 | GND β Ground |
| Pin M1 | VCCINT β Core supply 1.5 V |
| Pin M2 | IO β User I/O (bank 6) |
| Pin N1 | IO β User I/O (bank 7) |
| Pin N2 | VCCIO4 β I/O bank 4 supply |
| Pin P1 | GND β Ground |
| Pin P2 | IO β User I/O (bank 7) |
| Pin R1 | IO β User I/O (bank 8) |
| Pin R2 | GND β Ground |
| Pin T1 | VCCINT β Core supply 1.5 V |
| Pin T2 | IO β User I/O (bank 8) |
| Pin U1 | IO β User I/O (bank 9) |
| Pin U2 | VCCIO5 β I/O bank 5 supply |
| Pin V1 | GND β Ground |
| Pin V2 | IO β User I/O (bank 9) |
| Pin W1 | IO β User I/O (bank 10) |
| Pin W2 | GND β Ground |
| Pin Y1 | VCCINT β Core supply 1.5 V |
| Pin Y2 | IO β User I/O (bank 10) |
| Pin AA1 | IO β User I/O (bank 11) |
| Pin AA2 | VCCIO6 β I/O bank 6 supply |
| Pin AB1 | GND β Ground |
| Pin AB2 | IO β User I/O (bank 11) |
| Pin AC1 | IO β User I/O (bank 12) |
| Pin AC2 | GND β Ground |
| Pin AD1 | VCCINT β Core supply 1.5 V |
| Pin AD2 | IO β User I/O (bank 12) |
| Pin AE1 | IO β User I/O (bank 12) |
| Pin AE2 | VCCIO7 β I/O bank 7 supply |
| Pin AF1 | GND β Ground |
| Pin AF2 | IO β User I/O (bank 12) |
| Pin AG1 | TDI β JTAG TDI (bank 12) |
| Pin AG2 | GND β Ground |
| Pin AH1 | TCK β JTAG TCK (bank 12) |
| Pin AH2 | TMS β JTAG TMS (bank 12) |
| Pin AJ1 | TDO β JTAG TDO (bank 12) |
| Pin AJ2 | VCCIO8 β I/O bank 8 supply |
| Pin AK1 | nSTATUS β Configuration status (bank 8) |
| Pin AK2 | nCONFIG β Configuration control (bank 8) |
| Pin AL1 | DCLK β Configuration clock (bank 8) |
| Pin AL2 | DATA0 β Configuration data 0 (bank 8) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S10F484C5N is suitable for 6 applications: High-Performance Digital Signal Processing, Telecom Line Card / Backplane Bridging, ASIC Prototyping and Emulation, Industrial Machine Vision / Video Processing, Test & Measurement Instrumentation, Legacy Board Support / Form-Fit-Function Replacement.
High-Performance Digital Signal Processing
The EP1S10F484C5N fits mid-range DSP designs such as software-defined radio baseband, radar pulse compression, and digital video processing. Its 6 embedded DSP blocks deliver roughly 48 9-bit multipliers that operate at the 500 MHz core rate, giving a sustained MAC throughput sufficient for 100 MHz-class filter and FFT pipelines. The 920 Kbits of TriMatrix memory provides M512/M4K/MRAM blocks ideal for storing FFT twiddle factors, FIR coefficients, and line buffers without off-chip SRAM access latency. Designers wire the EP1S10F484C5N directly to external ADC/DAC LVDS pairs on the 335 available I/O pins. Compared to a DSP processor, the parallel architecture achieves deterministic latency and per-sample throughput impossible on Von-Neumann DSPs. Quartus II 13.0 DSP Builder blocks accelerate model-based design entry. The trade-off vs newer Cyclone V SoC is obsolete status, but the EP1S10 remains the lowest-risk path when an existing Stratix bitstream must be reproduced.
Recommended
Telecom Line Card / Backplane Bridging
The 335 user I/O and RapidIO / SPI-4.2 / UTOPIA interface support of the EP1S10F484C5N make it well suited for telecom line cards aggregating multiple E1/T1, SERDES, or Ethernet PHY streams onto a backplane. The 484-ball FCBGA exposes enough pins to wire 8-12 SERDES channels plus LVDS control planes without external muxes. Four PLLs provide independent clock synthesis for the line side, the system side, and the backplane, eliminating external PLL ICs. The 1.5 V core simplifies power-tree design versus multi-rail FPGAs, while the 0.13 Β΅m process delivers predictable timing closure in Quartus II. The TriMatrix memory is large enough for 16 Kbyte packet buffers per channel. Engineers typically pair the EP1S10F484C5N with external PHY transceivers such as the TLK1501 or VSC8211. Designers should treat the part as legacy for new designs, but it remains a strong fit for maintaining installed-base line cards that must interoperate with field-deployed firmware.
Recommended
ASIC Prototyping and Emulation
The EP1S10F484C5N is frequently used as a building block in ASIC/ASSP prototyping because its 10,570 logic elements map cleanly to the gate-equivalent density of mid-complexity ASICs (roughly 200-300 K ASIC gates). Quartus II 13.0 supports incremental compilation and LogicLock regions that allow RTL partitioning identical to ASIC synthesis scripts, easing re-targeting. Multiple EP1S10F484C5N devices can be chained on a prototyping board with LVDS point-to-point links to emulate a larger ASIC. The 484-ball FCBGA allows escape routing on 6-layer PCBs with 0.5 mm pitch via-in-pad designs. The embedded DSP and memory blocks let designers validate arithmetic and on-chip bus architectures before tap-out. Modern ASIC prototyping usually moves to Cyclone V or Kintex-7, but the EP1S10F484C5N is still in service in installed emulation systems. Engineers should note that Quartus II 13.0 must remain available in the build pipeline.
Recommended
Industrial Machine Vision / Video Processing
The EP1S10F484C5N provides adequate logic, memory, and LVDS I/O for line-scan or area-scan machine vision pipelines operating at Camera Link or LVDS rates. The 335 user I/O pins are sufficient to receive 24-bit RGB + sync + clock from a Camera Link interface plus drive a DVI/HDMI output. The TriMatrix memory holds a full frame buffer for image rotation, color-space conversion, and defect detection algorithms. The 6 embedded DSP blocks accelerate Sobel, Laplacian, and convolution kernels at line rate, eliminating the need for external DSP ICs. Designers pair the EP1S10F484C5N with an LVDS deserializer such as the DS90CR288A on the input and a DVI transmitter like the TFP401 on the output. The 0.13 Β΅m process and 1.5 V core simplify thermal design for enclosed industrial cabinets. Production-volume industrial OEMs now prefer Cyclone IV/V for cost reasons, but the EP1S10F484C5N remains common in existing installed systems.
Recommended
Test & Measurement Instrumentation
The EP1S10F484C5N is well matched to bench-top test and measurement instruments such as logic analyzers, protocol analyzers, and arbitrary waveform generators. Its 335 user I/O can sample multiple digital buses simultaneously, while the 14 TriMatrix memory blocks provide deep capture buffers at full sample rate without external SRAM. The 4 PLLs synthesize independent sample clocks from a 10 MHz TCXO reference, supporting non-standard baud rates in protocol analyzers. Designers can implement 200 MSPS equivalent-time sampling on the LVDS I/O, with the 500 MHz core rate handling deserialization and trigger logic in real time. The 1.5 V core simplifies the analog/digital power tree when the FPGA is paired with high-speed ADCs like the AD9214. Quartus II 13.0 supports SignalTap II embedded logic analyzer for real-time verification. Field-deployed T&M instruments still ship with EP1S10F484C5N parts; production of new T&M designs usually targets Cyclone V or Artix-7 to extend lifecycle.
Recommended
Legacy Board Support / Form-Fit-Function Replacement
The EP1S10F484C5N is commonly used as a form-fit-function replacement on legacy boards where the original FPGA failed and the system cannot be redesigned. Its 484-ball FCBGA footprint and Stratix die architecture are identical to other Stratix family members in the F484 package, so a same-package faster speed grade (C6 or C7) is the preferred upgrade. Engineers designing drop-in replacements must validate the Quartus II version because timing models changed across Quartus 9.x and 13.x; recompiling the original RTL against the same Quartus build is recommended. For boards that can accept a layout change, the EP1S25F484C5N adds logic and memory but is NOT a true drop-in (different configuration scheme). Independent brokers supply date-coded EP1S10F484C5N parts but counterfeit risk is high; decapsulation and JTAG ID verification are advised. Lifecycle extension via -I5N industrial temperature variant is also a common practice for harsh environment field repairs.
Recommended
Recommended Products Summary
Engineering reference data for EP1S10F484C5N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S10F484C6N | EP1S10F484C7N | EP1S10F484I5N | EP1S10B672C7N |
|---|---|---|---|---|---|
| Package | 484-FCBGA (F484), 23x23 mm, 1.0 mm pitch | 484-FCBGA (F484), 23x23 mm, 1.0 mm pitch - same | 484-FCBGA (F484), 23x23 mm, 1.0 mm pitch - same | 484-FCBGA (F484), 23x23 mm, 1.0 mm pitch - same | 672-BGA (B672), 35x35 mm, 1.0 mm pitch - larger |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 10,570 | 10,570 - identical | 10,570 - identical | 10,570 - identical | 10,570 - identical |
| Speed Grade | -5 | -6 (faster) | -7 (fastest) | -5 (same, industrial temp) | -7 (fastest) |
| Embedded Memory | 920,448 bits | 920,448 bits - identical | 920,448 bits - identical | 920,448 bits - identical | 920,448 bits - identical |
| User I/O | 335 | 335 | 335 | 335 | 488 (larger package) |
| Operating Temperature | 0 Β°C to 85 Β°C (Commercial) | 0 Β°C to 85 Β°C (Commercial) | 0 Β°C to 85 Β°C (Commercial) | -40 Β°C to 100 Β°C (Industrial) | 0 Β°C to 85 Β°C (Commercial) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Speed grade upgrade path within same footprint (vs EP1S10F484C7N)
- Industrial temperature option in same package (vs EP1S10F484I5N)
- Higher I/O count option in larger package (vs EP1S10B672C7N)
Design Notes
The EP1S10F484C5N core rail (VCCINT) requires 1.5 V with a tolerance of Β±5% and a transient current that can exceed 2 A during configuration. Decoupling must include 4-6 Γ 0.1 Β΅F X7R ceramics placed within 5 mm of the BGA, plus 4 Γ 10 Β΅F tantalum or polymer bulk caps on the same plane. Estimated: VCCINT power at 500 MHz toggle rate is approximately 1.5 W (typical) and up to 2.5 W (worst-case). I/O banks can run at 1.5/1.8/2.5/3.3 V - use a separate LDO per VCCIO bank if any bank drives a non-3.3 V bus. Sequencing: VCCINT must reach 1.0 V within 100 ms and VCCIO must not exceed VCCINT + 0.5 V during ramp to avoid I/O latch-up.
Estimated: at full toggle activity (500 MHz core, 335 I/O at 50% utilization), the EP1S10F484C5N dissipates approximately 2.5 W. The 484-ball FCBGA has a theta_JA around 18 Β°C/W with a 4-layer PCB and 64 thermal vias to a 100x100 mm copper spreader. This yields a junction temperature rise of 45 Β°C above ambient - acceptable for commercial (85 Β°C) operation. The industrial -I5N variant operates up to 100 Β°C junction; designers must reduce ambient to 55 Β°C maximum at the same power level, or add a heatsink on the BGA top side. The BGA die is exposed on the top surface (no lid), so thermal interface material (TIM) can be applied directly with a clip-mounted heatsink.
The 484-ball FCBGA at 1.0 mm pitch requires via-in-pad (VIP) escape routing on at least a 6-layer PCB. Use 0.30 mm (12 mil) pad diameter with 0.20 mm (8 mil) drilled vias and 0.10 mm (4 mil) annular ring; fill and plate the vias to a flat surface for BGA attachment. Reference the Stratix Device Family Data Sheet Chapter 4 for the exact land pattern dimensions. Differential pair traces (LVDS, LVPECL) must be length-matched within 5 ps and routed on the layer immediately below the BGA. Break-out signals on the top layer, then via to inner stripline for longer routes. Maintain a continuous ground plane on layer 2 and a 1.5 V power plane on layer 3 directly under the BGA. Layer 6 should be the secondary ground for return path continuity.
Common pitfalls with the EP1S10F484C5N include: (1) using a newer Quartus II release (β₯ v14.0) which dropped support for original Stratix - the last supported version is Quartus II 13.0; (2) confusing the F484 FineLine BGA pinout with the B672 pinout - they are NOT compatible and a wrong footprint will short VCCINT to GND; (3) allowing VCCIO to rise before VCCINT during power-up, which can latch the I/O ring; (4) sourcing parts from brokers without verifying date code and JTAG ID, leading to counterfeit or pre-programmed devices. Always validate the bitstream against the JTAG IDCODE 0x020F00DD before PCB release.
Compliance Information
Lead-free assembly per 'N' suffix in MPN. Original Altera / Intel datasheet declares RoHS compliance. Halogen-free status not explicitly stated in available datasheet copies.
