EPM2210F324I8N - MAX II CPLD 2210 LE F324 Industrial | Altera
N.º da peça: EPM2210F324I8N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.9 | $2.890,00 |
| 500 | $24.5 | $12.250,00 |
| 1.000 | $21.8 | $21.800,00 |
EPM2210F324I8N Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that retains its configuration without an external boot PROM. MAX II devices are built on a 0.18-micron process and pair LUT-based logic with on-chip Flash configuration memory. They sit below FPGAs in the programmable logic hierarchy (CPLD -> programmable logic -> logic IC -> semiconductor), offering deterministic timing, low quiescent current, and instant-on behavior for system control, bus bridging, and power-sequencing tasks.
Key features of the EPM2210F324I8N include 2210 logic elements (LEs), 272 user I/O pins, on-chip user flash memory, 8 Kbits of configuration memory in the same die, support for multiple I/O standards (LVTTL, LVCMOS, PCI, SSTL), and an internal oscillator. The instant-on, non-volatile architecture eliminates boot PROM cost and enables configuration in <1 ms. Multi-voltage I/O banks allow the part to bridge 1.5V, 1.8V, 2.5V, 3.3V, and 5.0V domains on the same board.
Architecturally, MAX II uses a four-input LUT fabric with 16 macrocell Logic Array Blocks (LABs) connected through a MultiTrack interconnect. The integrated Flash and SRAM block stores both configuration and user data, supporting in-system programmability via JTAG. Compared with older MAX 3000/7000 families, MAX II cuts standby current by an order of magnitude while preserving JTAG and IEEE 1149.1 boundary-scan compatibility.
Typical applications include I/O expansion and bus bridging, power-up sequencing and reset distribution, industrial control boards, motor drive interface logic, and LED display drivers. The 324-pin package and 272 user I/Os support designs that require many LVCMOS channels with deterministic propagation delays.
When designing with this device, allocate JTAG pins (TCK, TMS, TDI, TDO) carefully and provide at least four general-purpose I/Os for ISP updates. For high-toggle-rate outputs, derate bank current per the Quartus II power-play estimator and verify pin-to-pin timing via TimeQuest before sign-off.
This page synthesizes distributor pricing, MAX II family drop-in alternatives, and practical Quartus II design notes not found in the manufacturer datasheet, helping engineers select, source, and implement the EPM2210F324I8N with confidence.
Alternativas drop-in para EPM2210F324I8N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM2210F324I8N (mesmo formato e footprint) — diferindo em Package, Process Technology, RoHS Status, Programming Interface, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM2210F324C3N
✅ Drop-In✓ Em estoque
$65.2 / unidade
Ver ficha técnica →EPM2210F324C5N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM2210F324C8N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM2210F324I5N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM2210F324C4N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM2210F324I8N Classificações máximas e características elétricas
| Family | MAX II |
| Device Logic Elements | 2210 LEs |
| User I/O Count | 272 |
| Encapsulamento | FBGA-324 (F324) |
| Faixa de temperatura de operação | -40C to +100C (Industrial, I8N) |
| Supply Voltage (Core) | 1.8 V |
| Standby Current | 25 uA typical |
| Configuration Memory | On-chip Flash, instant-on |
| Process Technology | 0.18 micron |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, SSTL |
| Programming Interface | JTAG (IEEE 1149.1) |
| Internal Oscillator | Yes |
Guia de Configuração de Pinos do EPM2210F324I8N fbga-324 (f324)
Configuração de pinos para EPM2210F324I8N (pacote fbga-324 (f324)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EPM2210F324I8N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EPM2210F324I8N é adequado para 7 aplicaçãos: Industrial I/O Expansion and Bus Bridging, Power-Up Sequencing and Reset Distribution, LED Display Driver and Video Timing Control, Motor Drive Interface Logic, Automotive Body Control and Telematics, Test and Measurement Instrumentation Front-End, Networking and Telecom Glue Logic.
Industrial I/O Expansion and Bus Bridging
The EPM2210F324I8N is ideal for industrial I/O expansion and bus bridging designs. With 272 user I/Os in the F324 FineLine BGA package and multi-voltage I/O bank support (1.5V/1.8V/2.5V/3.3V/5.0V), the part can bridge legacy 5V peripheral buses to modern 1.8V processors without external level shifters. The instant-on, non-volatile architecture ensures deterministic <1 ms wake-up, critical for PLC backplanes and industrial controllers requiring deterministic boot behavior. Pair with the EPCQ configuration family or use on-chip flash to store user data alongside configuration.
Recomendado
Power-Up Sequencing and Reset Distribution
The EPM2210F324I8N excels at power-up sequencing and reset distribution in multi-rail systems. Its 25 uA typical standby current means the CPLD can remain always-on to monitor incoming supplies, then sequence processor and memory rails in a defined order using programmable macrocell logic. The instant-on behavior eliminates the need for an external reset controller. The 324-pin BGA package supports designs with many discrete reset outputs and watchdog timers, while Quartus II TimeQuest gives deterministic propagation delay for sequencing accuracy.
Recomendado
LED Display Driver and Video Timing Control
The EPM2210F324I8N suits LED display drivers and video timing controller roles. The 272 user I/Os drive multi-segment LED panels or LVDS display interfaces with deterministic propagation delay. The 4-input LUT fabric implements PWM dimming, gamma correction, and refresh-rate generation in a single chip. The F324 BGA package accommodates the high pin count needed for RGB matrix multiplexing, and on-chip UFM stores gamma lookup tables across power cycles.
Recomendado
Motor Drive Interface Logic
The EPM2210F324I8N serves as motor drive interface logic in industrial motion control. Its industrial temperature grade (-40C to +100C) handles factory floor thermal envelopes, while the 2210 LEs implement encoder decoding, Hall-sensor commutation, and PWM generation. Multi-voltage I/O banks allow direct interface to 3.3V MCUs and 5V gate drivers on the same board. Compared with discrete logic, this CPLD saves PCB area and improves timing accuracy for high-speed current-loop feedback paths.
Recomendado
Automotive Body Control and Telematics
The EPM2210F324I8N fits non-safety automotive body control and telematics subsystems. While not AEC-Q100 qualified, its industrial temperature grade meets most cabin and trunk-mounted module requirements. The 272 I/Os handle body control tasks such as lighting drivers, mirror control, and LIN/CAN bus bridging, while the 2210 LEs run state machines for power management. Designers needing AEC-Q100 should consider the dedicated automotive-grade MAX II variants or migrate to MAX V with AEC-Q100 documentation.
Recomendado
Test and Measurement Instrumentation Front-End
The EPM2210F324I8N is well suited for test and measurement instrumentation front-end logic. Its deterministic pin-to-pin timing supports precise event sequencing, trigger routing, and handshake management between ADCs, DACs, and the host processor. The on-chip Flash and UFM store calibration constants and test patterns without external EEPROM. The F324 BGA's 272 I/Os accommodate multi-channel data acquisition boards while the multi-voltage banks interface to both 1.8V ADCs and 5V analog front-ends.
Recomendado
Networking and Telecom Glue Logic
The EPM2210F324I8N serves as glue logic in networking and telecom equipment. The 2210 LEs and 272 I/Os implement MDIO/Management bus controllers, SFP/I2C interface bridges, and timing-critical reset distribution across switch line cards. The instant-on architecture ensures deterministic board bring-up across power cycles, while the on-chip UFM stores MAC addresses, serial numbers, and inventory data. JTAG ISP supports field upgrades without removing line cards from service.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM2210F324I8N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM2210F324C3N | EPM2210F324C5N | EPM2210F324C8N | EPM2210F324I5N | EPM2210F324C4N |
|---|---|---|---|---|---|---|
| Package | FBGA-324 (F324) | FBGA-324 (F324) - same | FBGA-324 (F324) - same | FBGA-324 (F324) - same | FBGA-324 (F324) - same | FBGA-324 (F324) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 2210 LEs | 2210 LEs | 2210 LEs | 2210 LEs | 2210 LEs | 2210 LEs |
| User I/O | 272 | 272 | 272 | 272 | 272 | 272 |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C |
| Speed Grade | I8 (slowest industrial) | C3 | C5 | C8 (fastest) | I5 | C4 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Configuration Memory | On-chip Flash (instant-on) | On-chip Flash (instant-on) | On-chip Flash (instant-on) | On-chip Flash (instant-on) | On-chip Flash (instant-on) | On-chip Flash (instant-on) |
Principais diferenciais
- Widest operating temperature in the MAX II 324-pin family (vs EPM2210F324C5N)
- Instant-on, non-volatile configuration without external PROM (vs EPF8820ATC144-3)
- 272 user I/Os in mid-density CPLD envelope (vs EPM1270F256C5N)
Notas de projeto
The F324 FineLine BGA package requires 4-layer PCB minimum with controlled-impedance routing for JTAG and clock nets. Use 0.5 mm pitch BGA fanout with via-in-pad or dog-bone fanout. Maintain at least one solid ground plane reference under the device for signal integrity. Decoupling: place 0.1 uF X7R capacitors adjacent to every VCCINT and VCCIO power pin, with 10 uF bulk capacitors at board entry.
Do not confuse the speed-grade suffix with the temperature-grade suffix. 'I' indicates industrial temperature range; the digit following indicates the speed grade. I8 is the slowest industrial speed grade; I5 is faster. Always verify both temperature and speed grade when substituting. Confirm the part number with the Altera (Intel FPGA) ordering information PDF before placing production orders.
Reserve JTAG pins (TCK, TMS, TDI, TDO) and at least one general-purpose I/O for ISP updates. Provide a JTAG header or test pad cluster accessible without removing the board from its enclosure. For multi-voltage I/O banks, group voltage pins with their respective bank supply and avoid mixing voltage domains on the same bank without the bank VREF properly configured.
MAX II outputs have edge rates that can couple into adjacent nets in the F324 BGA. Estimate: estimated SSO (Simultaneous Switching Output) noise budget using the Altera SSO calculator; de-rate bank current per device DC specifications when more than 16 outputs toggle simultaneously. Place series damping resistors on heavily loaded clock outputs to reduce ground bounce.
Informações de conformidade
Compliance status not confirmed in the Verified Web Data provided. Industrial temperature grade ('I' suffix) does not imply AEC-Q100 automotive qualification. Contact XAIPART for RoHS/REACH certificates of compliance for specific date codes.
