EPM2210GF324I5 - 2210 LE MAX II CPLD, 212 I/O, FBGA-324 | Altera / Intel
N.º da peça: EPM2210GF324I5 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $48.5 | $48,50 |
| 10 | $43.2 | $432,00 |
| 100 | $36.85 | $3.685,00 |
| 250 | $32.4 | $8.100,00 |
| 500 | $28.95 | $14.475,00 |
EPM2210GF324I5 Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-like macrocell arrays with a central interconnect matrix. In the system hierarchy it sits between simple SPLDs and full FPGAs, offering instant-on non-volatile configuration, deterministic timing, and robust pin-locking for glue-logic, bus-interface, and power-sequencing tasks. The MAX II family specifically targets low-cost, low-power applications where FPGAs would be overkill.
Key features include a worst-case pin-to-pin propagation delay of approximately 7 ns (tPD1), an 8 Kbit user flash memory (UFM) block that can store user data or serve as an SPI/I2C master, IEEE 1149.1 JTAG boundary-scan and in-system programmability (ISP) via JTAG, and an internal oscillator. The 324-ball FBGA package provides 272 usable user I/Os and supports vertical migration with the smaller EPM570 and EPM1270 in the same package outline.
The EPM2210GF324I5 uses a non-volatile flash configuration cell, so it behaves like an ASIC at power-up with no external boot PROM required. Its MultiVolt I/O architecture allows mixed-voltage interfacing on a per-bank basis, while its low standby current (typically <100 µA for the core) makes it attractive for battery-backed designs. The MAX II architecture is also uniquely characterized by its fast propagation delay and deterministic timing, which simplifies static timing closure in safety-relevant designs.
Typical applications include I/O expansion and bus bridging (for example, I2C/SPI to parallel GPIO), configuration and power-sequencing control in Intel/Altera FPGA designs, industrial control boards requiring glue logic, and LED display drivers. Its instant-on behavior also makes it suitable for safety-critical systems where the logic must be operational before any processor boots.
When designing with the EPM2210GF324I5, observe FBGA-324 PCB layout rules: 1.0 mm pitch requires laser-drilled micro vias or via-in-pad, and at least four layers are recommended for clean reference-plane return paths. Decouple every VCCIO/VCCINT pair with 0.1 µF and 10 µF capacitors placed within 100 mils of the balls, and route JTAG TMS/TCK/TDO/TDI as a 4-wire bus with one stub per device.
This page synthesizes distributor stock, same-family Altera drop-in alternatives, and FBGA-324 layout guidance that is not duplicated on the manufacturer product page or standard distributor listings.
Alternativas drop-in para EPM2210GF324I5 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM2210GF324I5 (mesmo formato e footprint) — diferindo em Package, Process Technology, RoHS Status, Operating Temperature, Programming Interface.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM2210GF324C5N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$17.9 / unidade
Ver ficha técnica →EPM2210GF324C5
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$13.6 / unidade
Ver ficha técnica →EPM2210GF324C4N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$25.6 / unidade
Ver ficha técnica →EPM2210F324I8N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$21.8 / unidade
Ver ficha técnica →EPM2210F324C3N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$65.2 / unidade
Ver ficha técnica →EPM2210GF324I5N
✅ Drop-In✓ Em estoque
$42 / unidade
Ver ficha técnica →EPM2210GF324I5 Classificações máximas e características elétricas
| Family | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Logic Elements (LEs) | 2,210 |
| Equivalent Macrocells | 1,700 |
| User I/Os (max) | 272 |
| User Flash Memory (UFM) | 8 Kbits |
| Propagation Delay (tPD1, max) | 7 ns (industrial speed grade I5) |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Temperatura de operação | -40 °C to +100 °C (industrial grade, suffix I) |
| Encapsulamento | FBGA-324 (FineLine BGA, 19 x 19 mm, 1.0 mm pitch) |
| Tipo de montagem | Surface Mount |
| Process Technology | 0.18 µm 6-layer-metal flash CMOS |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
| Status RoHS | Compliant (Pb-free) |
Configuração de pinos do EPM2210GF324I5
| Pino A1 | I/O — General-purpose user I/O bank 1 |
| Pino A2 | I/O — General-purpose user I/O bank 1 |
| Pino A3 | I/O — General-purpose user I/O bank 1 |
| Pino A4 | I/O — General-purpose user I/O bank 1 |
| Pino A5 | VCCIO1 — I/O bank 1 supply voltage (1.5/1.8/2.5/3.3 V) |
| Pino A6 | I/O — General-purpose user I/O bank 1 |
| Pino A7 | I/O — General-purpose user I/O bank 1 |
| Pino A8 | I/O — General-purpose user I/O bank 1 |
| Pino A9 | I/O — General-purpose user I/O bank 1 |
| Pino A10 | I/O — General-purpose user I/O bank 1 |
| Pino B1 | I/O — General-purpose user I/O bank 1 |
| Pino B2 | I/O — General-purpose user I/O bank 1 |
| Pino B3 | I/O — General-purpose user I/O bank 1 |
| Pino B4 | I/O — General-purpose user I/O bank 1 |
| Pino B5 | I/O — General-purpose user I/O bank 1 |
| Pino B6 | I/O — General-purpose user I/O bank 1 |
| Pino B7 | I/O — General-purpose user I/O bank 1 |
| Pino B8 | I/O — General-purpose user I/O bank 1 |
| Pino B9 | I/O — General-purpose user I/O bank 1 |
| Pino B10 | GND — Ground reference |
Aplicações típicas
EPM2210GF324I5 é adequado para 7 aplicaçãos: I/O Expansion and Bus Bridging, FPGA Configuration and Power Sequencing, Industrial Control Boards, LED Display Drivers and Signage, Automotive Infotainment and Body Electronics, Telecom Line-Card Glue Logic, Medical Device Interface Boards.
I/O Expansion and Bus Bridging
The EPM2210GF324I5's 272 user I/Os and 7 ns propagation delay make it ideal for I/O expansion and bus-bridging tasks such as SPI-to-parallel GPIO, I2C-to-LED matrix, or asynchronous SRAM/parallel-NOR glue logic. Its MultiVolt I/O banks (1.5 V to 3.3 V) allow direct connection to mixed-voltage peripherals without external level shifters, reducing BOM cost and PCB area. The non-volatile flash configuration also means the bridge is operational at the first clock cycle after power-up, which is critical for system bring-up. Designers typically instantiate a small state machine plus a few latched register banks and fit the entire design into a fraction of the 2,210 logic elements available.
Recomendado
FPGA Configuration and Power Sequencing
The EPM2210GF324I5 is widely used as a companion configuration and power-sequencing controller for Altera/Intel FPGAs (Cyclone, Arria, MAX 10). Its deterministic timing drives power-good signals, FPGA MSEL pins, and hold-time circuits with sub-10 ns accuracy, and the JTAG chain can be shared between the CPLD and the FPGA for in-system programming. The 8 Kbit UFM block stores non-volatile configuration such as board revision, serial numbers, and calibration data. Using a MAX II CPLD instead of discrete sequencer ICs reduces board area and gives designers full flexibility to update sequencing logic via JTAG.
Recomendado
Industrial Control Boards
Industrial PLC and motor-control boards use the EPM2210GF324I5 to implement deterministic glue logic between microcontrollers, ADCs, and high-voltage gate drivers. The industrial temperature grade (-40 °C to +100 °C) and 1.8 V core with 3.3 V-tolerant I/O suit factory-floor environments, while the 324-ball BGA package's 19 x 19 mm body fits standard 4-layer PCBs. The CPLD's instant-on behavior eliminates the boot delay of an MCU-based sequencer, which improves safety-loop response time. Designers frequently use the UFM to log fault counters or motor calibration constants that must survive power cycles.
Recomendado
LED Display Drivers and Signage
Large LED video walls and stadium-scoreboard controllers use the EPM2210GF324I5 to refresh shift-register chains, generate blanking intervals, and PWM-modulate scan currents with deterministic timing. The 272 user I/Os drive dozens of 16-bit shift registers in parallel, and the 7 ns tPD ensures glitch-free multiplexing between scan rows. MultiVolt I/O allows direct connection to 3.3 V LED driver ICs as well as legacy 5 V logic through external resistors. The on-chip UFM can store gamma-correction tables or brightness presets that the host processor reads at boot.
Recomendado
Automotive Infotainment and Body Electronics
Although the EPM2210GF324I5 is not AEC-Q100 qualified, its industrial temperature range and robust FBGA package make it acceptable for non-safety automotive subsystems such as infotainment head units, instrument-cluster backlight drivers, and body-control modules where cost is critical. The deterministic timing drives CAN/LIN transceivers' enable lines and backlight PWM at sub-microsecond resolution. MultiVolt I/O interfaces 1.8 V application processors and 3.3 V transceivers without level shifters, saving board space. Designers use the UFM to store vehicle-specific options and dealer configuration.
Recomendado
Telecom Line-Card Glue Logic
Telecom line cards and base-station RF front-ends use the EPM2210GF324I5 to implement JESD204B/C link synchronization, clock distribution, and front-panel LED management. The 7 ns propagation delay meets JESD204B subclass-1 deterministic-latency requirements for deterministic SYSREF distribution. JTAG/ISP allows remote firmware updates via the system's existing JTAG scan chain, and the UFM stores card identity, calibration constants, and alarm thresholds. The 272 I/Os comfortably handle 12+ JESD204B lanes plus GPIO and supervisory signals on a single CPLD.
Recomendado
Medical Device Interface Boards
Medical imaging and patient-monitoring equipment use the EPM2210GF324I5 as deterministic glue logic between image sensors, FPGAs, and high-speed ADCs. The CPLD generates precise pixel-clock, line-sync, and frame-sync signals with sub-10 ns accuracy, which is essential for clean image capture. The 8 Kbit UFM stores factory calibration data and device serial numbers required for FDA traceability. MultiVolt I/O allows direct interface with both 1.8 V image sensors and 3.3 V ADCs without external level shifters, reducing BOM cost and improving reliability for medical-grade designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM2210GF324I5 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM2210GF324C5N | EPM2210GF324C5 | EPM2210GF324C4N | EPM2210F324I8N | EPM2210F324C3N | EPM2210GF324I5N |
|---|---|---|---|---|---|---|---|
| Package | FBGA-324 (19 x 19 mm, 1.0 mm pitch) | FBGA-324 - same | FBGA-324 - same | FBGA-324 - same | FBGA-324 - same | FBGA-324 - same | FBGA-324 - same |
| Brand | Altera (Intel) | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 2,210 LEs | 2,210 LEs - same | 2,210 LEs - same | 2,210 LEs - same | 2,210 LEs - same | 2,210 LEs - same | 2,210 LEs - same |
| Speed Grade | I5 (~7 ns tPD) | C5 (~7 ns tPD) - same | C5 (~7 ns tPD) - same | C4 (~9 ns tPD) - slower | I8 (~10 ns tPD) - slower | C3 (~6 ns tPD) - faster | I5 (~7 ns tPD) - same |
| Operating Temperature | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) - same |
| Lead-Free (Pb-free) Finish | G prefix (RoHS) | G + N (RoHS Pb-free) - same | G (RoHS) - same | G + N (RoHS Pb-free) - same | F + N (RoHS Pb-free) | F + N (RoHS Pb-free) | G + N (RoHS Pb-free) - same |
| User I/Os (max) | 272 | 272 - same | 272 - same | 272 - same | 272 - same | 272 - same | 272 - same |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbit - same | 8 Kbit - same | 8 Kbit - same | 8 Kbit - same | 8 Kbit - same | 8 Kbit - same |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V - same | 1.8 V - same | 1.8 V - same | 1.8 V - same | 1.8 V - same | 1.8 V - same |
Principais diferenciais
- Highest logic density in MAX II family (vs EPM1270F256I5N)
- Industrial temperature grade with Pb-free finish (vs EPM2210GF324C5N)
- Industry-standard 7 ns I5 speed grade (vs EPM2210F324I8N)
- Non-volatile flash configuration - instant-on (vs EPM1270T144C5N)
Notas de projeto
The EPM2210GF324I5's 1.0 mm pitch FBGA-324 requires a 4-layer (minimum) PCB stack-up with laser-drilled micro vias or via-in-pad technology to fan out the inner balls. Use a 0.4 mm via pad with 0.2 mm finished hole, and place a continuous reference plane (GND) directly under the BGA to control impedance and provide a return path. Keep all decoupling capacitors within 100 mils (2.5 mm) of their respective VCCINT/VCCIO balls. Avoid routing high-speed signals (faster than 50 MHz) through the inner ball rows - escape them on the outer rows first to minimize stubs.
Estimated: At 100% resource utilization (2,210 LEs) and 100 MHz toggling, the EPM2210GF324I5 draws approximately 200-300 mA from VCCINT and 50-100 mA per active VCCIO bank. Decouple every VCCINT ball with a 0.1 µF X7R ceramic plus a 10 µF bulk capacitor, and each VCCIO bank with one 0.1 µF per 4 balls plus one 4.7 µF bulk. Connect all GND balls to a low-impedance ground plane with at least 2 vias per ball to reduce ground bounce. Estimated: peak inrush at power-up is below 500 mA due to internal soft-start on VCCINT.
MultiVolt I/O banks must be powered even if unused - per the MAX II datasheet, unpowered VCCIO banks can back-feed through I/O pins and cause latch-up. Tie unused I/O pins to logic high or low through Quartus II pin assignments to enable the internal weak pull-up. For JTAG, route TMS/TCK as a daisy-chain with one stub per device and place a 10 kΩ pull-up on TMS and TCK to keep the chain in a known state during power-up. Use the TCK buffer to drive at most 4 devices to stay within the 50 MHz/10 pF JTAG specification.
Do not confuse EPM2210GF324I5 (industrial temp, G = RoHS Pb-free green) with EPM2210F324I5N (older lead-finish code F, N suffix = Pb-free). Although both share the FBGA-324 footprint, the G prefix is the modern RoHS-marked variant and is preferred for new designs. Also note that MAX II CPLDs are NOT 5 V tolerant - exceed 3.3 V on any I/O pin and you will damage the device. For 5 V systems, use an external resistor divider or level-shifter IC. Finally, do not migrate between FBGA-324 and TQFP-144 footprints without a board rework; vertical migration is supported only within the same package outline.
Informações de conformidade
RoHS and REACH compliant per Altera/Intel product page. Industrial temperature grade (suffix I) but not AEC-Q100 qualified - not for automotive safety-critical applications. Halogen-free and conflict-mineral status not explicitly stated in the provided data - set to 'unknown'.
