EPM2210F324I8N - MAX II CPLD 2210 LE F324 Industrial | Altera
MPN: EPM2210F324I8N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.9 | $2,890.00 |
| 500 | $24.5 | $12,250.00 |
| 1,000 | $21.8 | $21,800.00 |
Drop-in alternatives for EPM2210F324I8N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPM2210F324C3N
β Drop-Inβ In Stock
$65.2 / Unit
View Datasheet βEPM2210F324C5N
β Drop-Inπ Reference alternative (not in catalog)
EPM2210F324C8N
β Drop-Inπ Reference alternative (not in catalog)
EPM2210F324I5N
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EPM2210F324C4N
β Drop-Inπ Reference alternative (not in catalog)
EPM2210F324I8N Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Device Logic Elements | 2210 LEs |
| User I/O Count | 272 |
| Package | FBGA-324 (F324) |
| Operating Temperature Range | -40C to +100C (Industrial, I8N) |
| Supply Voltage (Core) | 1.8 V |
| Standby Current | 25 uA typical |
| Configuration Memory | On-chip Flash, instant-on |
| Process Technology | 0.18 micron |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, SSTL |
| Programming Interface | JTAG (IEEE 1149.1) |
| Internal Oscillator | Yes |
EPM2210F324I8N fbga-324 (f324) Pin Configuration Guide
Complete pinout information for EPM2210F324I8N (fbga-324 (f324) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM2210F324I8N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM2210F324I8N is suitable for 7 applications: Industrial I/O Expansion and Bus Bridging, Power-Up Sequencing and Reset Distribution, LED Display Driver and Video Timing Control, Motor Drive Interface Logic, Automotive Body Control and Telematics, Test and Measurement Instrumentation Front-End, Networking and Telecom Glue Logic.
Industrial I/O Expansion and Bus Bridging
The EPM2210F324I8N is ideal for industrial I/O expansion and bus bridging designs. With 272 user I/Os in the F324 FineLine BGA package and multi-voltage I/O bank support (1.5V/1.8V/2.5V/3.3V/5.0V), the part can bridge legacy 5V peripheral buses to modern 1.8V processors without external level shifters. The instant-on, non-volatile architecture ensures deterministic <1 ms wake-up, critical for PLC backplanes and industrial controllers requiring deterministic boot behavior. Pair with the EPCQ configuration family or use on-chip flash to store user data alongside configuration.
Recommended
Power-Up Sequencing and Reset Distribution
The EPM2210F324I8N excels at power-up sequencing and reset distribution in multi-rail systems. Its 25 uA typical standby current means the CPLD can remain always-on to monitor incoming supplies, then sequence processor and memory rails in a defined order using programmable macrocell logic. The instant-on behavior eliminates the need for an external reset controller. The 324-pin BGA package supports designs with many discrete reset outputs and watchdog timers, while Quartus II TimeQuest gives deterministic propagation delay for sequencing accuracy.
Recommended
LED Display Driver and Video Timing Control
The EPM2210F324I8N suits LED display drivers and video timing controller roles. The 272 user I/Os drive multi-segment LED panels or LVDS display interfaces with deterministic propagation delay. The 4-input LUT fabric implements PWM dimming, gamma correction, and refresh-rate generation in a single chip. The F324 BGA package accommodates the high pin count needed for RGB matrix multiplexing, and on-chip UFM stores gamma lookup tables across power cycles.
Recommended
Motor Drive Interface Logic
The EPM2210F324I8N serves as motor drive interface logic in industrial motion control. Its industrial temperature grade (-40C to +100C) handles factory floor thermal envelopes, while the 2210 LEs implement encoder decoding, Hall-sensor commutation, and PWM generation. Multi-voltage I/O banks allow direct interface to 3.3V MCUs and 5V gate drivers on the same board. Compared with discrete logic, this CPLD saves PCB area and improves timing accuracy for high-speed current-loop feedback paths.
Recommended
Automotive Body Control and Telematics
The EPM2210F324I8N fits non-safety automotive body control and telematics subsystems. While not AEC-Q100 qualified, its industrial temperature grade meets most cabin and trunk-mounted module requirements. The 272 I/Os handle body control tasks such as lighting drivers, mirror control, and LIN/CAN bus bridging, while the 2210 LEs run state machines for power management. Designers needing AEC-Q100 should consider the dedicated automotive-grade MAX II variants or migrate to MAX V with AEC-Q100 documentation.
Recommended
Test and Measurement Instrumentation Front-End
The EPM2210F324I8N is well suited for test and measurement instrumentation front-end logic. Its deterministic pin-to-pin timing supports precise event sequencing, trigger routing, and handshake management between ADCs, DACs, and the host processor. The on-chip Flash and UFM store calibration constants and test patterns without external EEPROM. The F324 BGA's 272 I/Os accommodate multi-channel data acquisition boards while the multi-voltage banks interface to both 1.8V ADCs and 5V analog front-ends.
Recommended
Networking and Telecom Glue Logic
The EPM2210F324I8N serves as glue logic in networking and telecom equipment. The 2210 LEs and 272 I/Os implement MDIO/Management bus controllers, SFP/I2C interface bridges, and timing-critical reset distribution across switch line cards. The instant-on architecture ensures deterministic board bring-up across power cycles, while the on-chip UFM stores MAC addresses, serial numbers, and inventory data. JTAG ISP supports field upgrades without removing line cards from service.
Recommended
Recommended Products Summary
Engineering reference data for EPM2210F324I8N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM2210F324C3N | EPM2210F324C5N | EPM2210F324C8N | EPM2210F324I5N | EPM2210F324C4N |
|---|---|---|---|---|---|---|
| Package | FBGA-324 (F324) | FBGA-324 (F324) - same | FBGA-324 (F324) - same | FBGA-324 (F324) - same | FBGA-324 (F324) - same | FBGA-324 (F324) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 2210 LEs | 2210 LEs | 2210 LEs | 2210 LEs | 2210 LEs | 2210 LEs |
| User I/O | 272 | 272 | 272 | 272 | 272 | 272 |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C |
| Speed Grade | I8 (slowest industrial) | C3 | C5 | C8 (fastest) | I5 | C4 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Configuration Memory | On-chip Flash (instant-on) | On-chip Flash (instant-on) | On-chip Flash (instant-on) | On-chip Flash (instant-on) | On-chip Flash (instant-on) | On-chip Flash (instant-on) |
Key Differentiators
- Widest operating temperature in the MAX II 324-pin family (vs EPM2210F324C5N)
- Instant-on, non-volatile configuration without external PROM (vs EPF8820ATC144-3)
- 272 user I/Os in mid-density CPLD envelope (vs EPM1270F256C5N)
Design Notes
The F324 FineLine BGA package requires 4-layer PCB minimum with controlled-impedance routing for JTAG and clock nets. Use 0.5 mm pitch BGA fanout with via-in-pad or dog-bone fanout. Maintain at least one solid ground plane reference under the device for signal integrity. Decoupling: place 0.1 uF X7R capacitors adjacent to every VCCINT and VCCIO power pin, with 10 uF bulk capacitors at board entry.
Do not confuse the speed-grade suffix with the temperature-grade suffix. 'I' indicates industrial temperature range; the digit following indicates the speed grade. I8 is the slowest industrial speed grade; I5 is faster. Always verify both temperature and speed grade when substituting. Confirm the part number with the Altera (Intel FPGA) ordering information PDF before placing production orders.
Reserve JTAG pins (TCK, TMS, TDI, TDO) and at least one general-purpose I/O for ISP updates. Provide a JTAG header or test pad cluster accessible without removing the board from its enclosure. For multi-voltage I/O banks, group voltage pins with their respective bank supply and avoid mixing voltage domains on the same bank without the bank VREF properly configured.
MAX II outputs have edge rates that can couple into adjacent nets in the F324 BGA. Estimate: estimated SSO (Simultaneous Switching Output) noise budget using the Altera SSO calculator; de-rate bank current per device DC specifications when more than 16 outputs toggle simultaneously. Place series damping resistors on heavily loaded clock outputs to reduce ground bounce.
Compliance Information
Compliance status not confirmed in the Verified Web Data provided. Industrial temperature grade ('I' suffix) does not imply AEC-Q100 automotive qualification. Contact XAIPART for RoHS/REACH certificates of compliance for specific date codes.
