EPM2210GF324I5 - 2210 LE MAX II CPLD, 212 I/O, FBGA-324 | Altera / Intel
MPN: EPM2210GF324I5 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $43.2 | $432.00 |
| 100 | $36.85 | $3,685.00 |
| 250 | $32.4 | $8,100.00 |
| 500 | $28.95 | $14,475.00 |
Drop-in alternatives for EPM2210GF324I5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPM2210GF324C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EPM2210GF324C5
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EPM2210GF324C4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EPM2210F324I8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EPM2210F324C3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$65.2 / Unit
View Datasheet →EPM2210GF324I5N
✅ Drop-In✓ In Stock
$42 / Unit
View Datasheet →EPM2210GF324I5 Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Logic Elements (LEs) | 2,210 |
| Equivalent Macrocells | 1,700 |
| User I/Os (max) | 272 |
| User Flash Memory (UFM) | 8 Kbits |
| Propagation Delay (tPD1, max) | 7 ns (industrial speed grade I5) |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Operating Temperature | -40 °C to +100 °C (industrial grade, suffix I) |
| Package | FBGA-324 (FineLine BGA, 19 x 19 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount |
| Process Technology | 0.18 µm 6-layer-metal flash CMOS |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
| RoHS Status | Compliant (Pb-free) |
EPM2210GF324I5 Pin Configuration
| Pin A1 | I/O — General-purpose user I/O bank 1 |
| Pin A2 | I/O — General-purpose user I/O bank 1 |
| Pin A3 | I/O — General-purpose user I/O bank 1 |
| Pin A4 | I/O — General-purpose user I/O bank 1 |
| Pin A5 | VCCIO1 — I/O bank 1 supply voltage (1.5/1.8/2.5/3.3 V) |
| Pin A6 | I/O — General-purpose user I/O bank 1 |
| Pin A7 | I/O — General-purpose user I/O bank 1 |
| Pin A8 | I/O — General-purpose user I/O bank 1 |
| Pin A9 | I/O — General-purpose user I/O bank 1 |
| Pin A10 | I/O — General-purpose user I/O bank 1 |
| Pin B1 | I/O — General-purpose user I/O bank 1 |
| Pin B2 | I/O — General-purpose user I/O bank 1 |
| Pin B3 | I/O — General-purpose user I/O bank 1 |
| Pin B4 | I/O — General-purpose user I/O bank 1 |
| Pin B5 | I/O — General-purpose user I/O bank 1 |
| Pin B6 | I/O — General-purpose user I/O bank 1 |
| Pin B7 | I/O — General-purpose user I/O bank 1 |
| Pin B8 | I/O — General-purpose user I/O bank 1 |
| Pin B9 | I/O — General-purpose user I/O bank 1 |
| Pin B10 | GND — Ground reference |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM2210GF324I5 is suitable for 7 applications: I/O Expansion and Bus Bridging, FPGA Configuration and Power Sequencing, Industrial Control Boards, LED Display Drivers and Signage, Automotive Infotainment and Body Electronics, Telecom Line-Card Glue Logic, Medical Device Interface Boards.
I/O Expansion and Bus Bridging
The EPM2210GF324I5's 272 user I/Os and 7 ns propagation delay make it ideal for I/O expansion and bus-bridging tasks such as SPI-to-parallel GPIO, I2C-to-LED matrix, or asynchronous SRAM/parallel-NOR glue logic. Its MultiVolt I/O banks (1.5 V to 3.3 V) allow direct connection to mixed-voltage peripherals without external level shifters, reducing BOM cost and PCB area. The non-volatile flash configuration also means the bridge is operational at the first clock cycle after power-up, which is critical for system bring-up. Designers typically instantiate a small state machine plus a few latched register banks and fit the entire design into a fraction of the 2,210 logic elements available.
Recommended
FPGA Configuration and Power Sequencing
The EPM2210GF324I5 is widely used as a companion configuration and power-sequencing controller for Altera/Intel FPGAs (Cyclone, Arria, MAX 10). Its deterministic timing drives power-good signals, FPGA MSEL pins, and hold-time circuits with sub-10 ns accuracy, and the JTAG chain can be shared between the CPLD and the FPGA for in-system programming. The 8 Kbit UFM block stores non-volatile configuration such as board revision, serial numbers, and calibration data. Using a MAX II CPLD instead of discrete sequencer ICs reduces board area and gives designers full flexibility to update sequencing logic via JTAG.
Recommended
Industrial Control Boards
Industrial PLC and motor-control boards use the EPM2210GF324I5 to implement deterministic glue logic between microcontrollers, ADCs, and high-voltage gate drivers. The industrial temperature grade (-40 °C to +100 °C) and 1.8 V core with 3.3 V-tolerant I/O suit factory-floor environments, while the 324-ball BGA package's 19 x 19 mm body fits standard 4-layer PCBs. The CPLD's instant-on behavior eliminates the boot delay of an MCU-based sequencer, which improves safety-loop response time. Designers frequently use the UFM to log fault counters or motor calibration constants that must survive power cycles.
Recommended
LED Display Drivers and Signage
Large LED video walls and stadium-scoreboard controllers use the EPM2210GF324I5 to refresh shift-register chains, generate blanking intervals, and PWM-modulate scan currents with deterministic timing. The 272 user I/Os drive dozens of 16-bit shift registers in parallel, and the 7 ns tPD ensures glitch-free multiplexing between scan rows. MultiVolt I/O allows direct connection to 3.3 V LED driver ICs as well as legacy 5 V logic through external resistors. The on-chip UFM can store gamma-correction tables or brightness presets that the host processor reads at boot.
Recommended
Automotive Infotainment and Body Electronics
Although the EPM2210GF324I5 is not AEC-Q100 qualified, its industrial temperature range and robust FBGA package make it acceptable for non-safety automotive subsystems such as infotainment head units, instrument-cluster backlight drivers, and body-control modules where cost is critical. The deterministic timing drives CAN/LIN transceivers' enable lines and backlight PWM at sub-microsecond resolution. MultiVolt I/O interfaces 1.8 V application processors and 3.3 V transceivers without level shifters, saving board space. Designers use the UFM to store vehicle-specific options and dealer configuration.
Recommended
Telecom Line-Card Glue Logic
Telecom line cards and base-station RF front-ends use the EPM2210GF324I5 to implement JESD204B/C link synchronization, clock distribution, and front-panel LED management. The 7 ns propagation delay meets JESD204B subclass-1 deterministic-latency requirements for deterministic SYSREF distribution. JTAG/ISP allows remote firmware updates via the system's existing JTAG scan chain, and the UFM stores card identity, calibration constants, and alarm thresholds. The 272 I/Os comfortably handle 12+ JESD204B lanes plus GPIO and supervisory signals on a single CPLD.
Recommended
Medical Device Interface Boards
Medical imaging and patient-monitoring equipment use the EPM2210GF324I5 as deterministic glue logic between image sensors, FPGAs, and high-speed ADCs. The CPLD generates precise pixel-clock, line-sync, and frame-sync signals with sub-10 ns accuracy, which is essential for clean image capture. The 8 Kbit UFM stores factory calibration data and device serial numbers required for FDA traceability. MultiVolt I/O allows direct interface with both 1.8 V image sensors and 3.3 V ADCs without external level shifters, reducing BOM cost and improving reliability for medical-grade designs.
Recommended
Recommended Products Summary
Engineering reference data for EPM2210GF324I5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM2210GF324C5N | EPM2210GF324C5 | EPM2210GF324C4N | EPM2210F324I8N | EPM2210F324C3N | EPM2210GF324I5N |
|---|---|---|---|---|---|---|---|
| Package | FBGA-324 (19 x 19 mm, 1.0 mm pitch) | FBGA-324 - same | FBGA-324 - same | FBGA-324 - same | FBGA-324 - same | FBGA-324 - same | FBGA-324 - same |
| Brand | Altera (Intel) | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 2,210 LEs | 2,210 LEs - same | 2,210 LEs - same | 2,210 LEs - same | 2,210 LEs - same | 2,210 LEs - same | 2,210 LEs - same |
| Speed Grade | I5 (~7 ns tPD) | C5 (~7 ns tPD) - same | C5 (~7 ns tPD) - same | C4 (~9 ns tPD) - slower | I8 (~10 ns tPD) - slower | C3 (~6 ns tPD) - faster | I5 (~7 ns tPD) - same |
| Operating Temperature | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) - same |
| Lead-Free (Pb-free) Finish | G prefix (RoHS) | G + N (RoHS Pb-free) - same | G (RoHS) - same | G + N (RoHS Pb-free) - same | F + N (RoHS Pb-free) | F + N (RoHS Pb-free) | G + N (RoHS Pb-free) - same |
| User I/Os (max) | 272 | 272 - same | 272 - same | 272 - same | 272 - same | 272 - same | 272 - same |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbit - same | 8 Kbit - same | 8 Kbit - same | 8 Kbit - same | 8 Kbit - same | 8 Kbit - same |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V - same | 1.8 V - same | 1.8 V - same | 1.8 V - same | 1.8 V - same | 1.8 V - same |
| Approx. Unit Price (qty 1) | USD 48.50 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest logic density in MAX II family (vs EPM1270F256I5N)
- Industrial temperature grade with Pb-free finish (vs EPM2210GF324C5N)
- Industry-standard 7 ns I5 speed grade (vs EPM2210F324I8N)
- Non-volatile flash configuration - instant-on (vs EPM1270T144C5N)
Design Notes
The EPM2210GF324I5's 1.0 mm pitch FBGA-324 requires a 4-layer (minimum) PCB stack-up with laser-drilled micro vias or via-in-pad technology to fan out the inner balls. Use a 0.4 mm via pad with 0.2 mm finished hole, and place a continuous reference plane (GND) directly under the BGA to control impedance and provide a return path. Keep all decoupling capacitors within 100 mils (2.5 mm) of their respective VCCINT/VCCIO balls. Avoid routing high-speed signals (faster than 50 MHz) through the inner ball rows - escape them on the outer rows first to minimize stubs.
Estimated: At 100% resource utilization (2,210 LEs) and 100 MHz toggling, the EPM2210GF324I5 draws approximately 200-300 mA from VCCINT and 50-100 mA per active VCCIO bank. Decouple every VCCINT ball with a 0.1 µF X7R ceramic plus a 10 µF bulk capacitor, and each VCCIO bank with one 0.1 µF per 4 balls plus one 4.7 µF bulk. Connect all GND balls to a low-impedance ground plane with at least 2 vias per ball to reduce ground bounce. Estimated: peak inrush at power-up is below 500 mA due to internal soft-start on VCCINT.
MultiVolt I/O banks must be powered even if unused - per the MAX II datasheet, unpowered VCCIO banks can back-feed through I/O pins and cause latch-up. Tie unused I/O pins to logic high or low through Quartus II pin assignments to enable the internal weak pull-up. For JTAG, route TMS/TCK as a daisy-chain with one stub per device and place a 10 kΩ pull-up on TMS and TCK to keep the chain in a known state during power-up. Use the TCK buffer to drive at most 4 devices to stay within the 50 MHz/10 pF JTAG specification.
Do not confuse EPM2210GF324I5 (industrial temp, G = RoHS Pb-free green) with EPM2210F324I5N (older lead-finish code F, N suffix = Pb-free). Although both share the FBGA-324 footprint, the G prefix is the modern RoHS-marked variant and is preferred for new designs. Also note that MAX II CPLDs are NOT 5 V tolerant - exceed 3.3 V on any I/O pin and you will damage the device. For 5 V systems, use an external resistor divider or level-shifter IC. Finally, do not migrate between FBGA-324 and TQFP-144 footprints without a board rework; vertical migration is supported only within the same package outline.
Compliance Information
RoHS and REACH compliant per Altera/Intel product page. Industrial temperature grade (suffix I) but not AEC-Q100 qualified - not for automotive safety-critical applications. Halogen-free and conflict-mineral status not explicitly stated in the provided data - set to 'unknown'.
