EPM240GM100C5N - 192-Cell MAX II G CPLD, 4.7ns, 100-MBGA | Intel / Altera
MPN: EPM240GM100C5N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.85 | $7.85 |
| 10 | $7.2 | $72.00 |
| 100 | $6.1 | $610.00 |
| 500 | $5.4 | $2,700.00 |
| 1,000 | $4.75 | $4,750.00 |
Drop-in alternatives for EPM240GM100C5N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPM240GF100C5N
β Drop-Inβ In Stock
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View Datasheet βEPM240GF100I5N
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View Datasheet βEPM240ZM100C5N
β Drop-Inπ Reference alternative (not in catalog)
EPM240F100C5N
β Drop-Inβ In Stock
$5.2 / Unit
View Datasheet β5M240ZT100C5N
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View Datasheet βEPM240F100I5N
β Drop-Inβ In Stock
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View Datasheet βEPM240GM100C5N Maximum Ratings & Electrical Characteristics
| Family | MAX II G |
| Logic Elements | 240 (192 macrocells) |
| User I/Os | 80 |
| Pin-to-Pin Delay (tPD) | 4.7 ns |
| Package | 100-MBGA (Micro FineLine BGA), 6 x 6 mm |
| Ball Pitch | 0.5 mm |
| Supply Voltage - Core | 3.3 V |
| I/O Voltage Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multiVolt) |
| Programming Interface | JTAG (IEEE 1149.1) - ISP |
| Configuration Memory | Non-volatile Flash |
| Operating Temperature | -40 C to +125 C |
| Lead Free / RoHS | Yes / Compliant |
| MSL Level | 3 |
| Mounting Type | Surface Mount (BGA) |
| Process Technology | CMOS, Flash-based |
EPM240GM100C5N Pin Configuration
| Pin A1 | I/O β General-purpose user I/O (bank 1) |
| Pin A2 | I/O β General-purpose user I/O (bank 1) |
| Pin A3 | I/O β General-purpose user I/O (bank 1) |
| Pin A4 | I/O β General-purpose user I/O (bank 1) |
| Pin A5 | I/O β General-purpose user I/O (bank 1) |
| Pin A6 | I/O β General-purpose user I/O (bank 1) |
| Pin A7 | I/O β General-purpose user I/O (bank 1) |
| Pin A8 | I/O β General-purpose user I/O (bank 1) |
| Pin A9 | I/O β General-purpose user I/O (bank 1) |
| Pin A10 | I/O β General-purpose user I/O (bank 1) |
| Pin B1 | I/O β General-purpose user I/O (bank 1) |
| Pin B2 | I/O β General-purpose user I/O (bank 1) |
| Pin B3 | GND β Ground |
| Pin B4 | I/O β General-purpose user I/O (bank 1) |
| Pin B5 | I/O β General-purpose user I/O (bank 1) |
| Pin B6 | I/O β General-purpose user I/O (bank 1) |
| Pin B7 | I/O β General-purpose user I/O (bank 1) |
| Pin B8 | I/O β General-purpose user I/O (bank 1) |
| Pin B9 | I/O β General-purpose user I/O (bank 1) |
| Pin B10 | I/O β General-purpose user I/O (bank 1) |
| Pin C1 | I/O β General-purpose user I/O (bank 2) |
| Pin C2 | I/O β General-purpose user I/O (bank 2) |
| Pin C3 | I/O β General-purpose user I/O (bank 2) |
| Pin C4 | I/O β General-purpose user I/O (bank 2) |
| Pin C5 | VCCIO2 β I/O bank 2 supply voltage (1.5/1.8/2.5/3.3 V) |
| Pin C6 | VCCIO1 β I/O bank 1 supply voltage (1.5/1.8/2.5/3.3 V) |
| Pin C7 | I/O β General-purpose user I/O (bank 1) |
| Pin C8 | I/O β General-purpose user I/O (bank 1) |
| Pin C9 | I/O β General-purpose user I/O (bank 1) |
| Pin C10 | I/O β General-purpose user I/O (bank 1) |
| Pin D1 | I/O β General-purpose user I/O (bank 2) |
| Pin D2 | I/O β General-purpose user I/O (bank 2) |
| Pin D3 | I/O β General-purpose user I/O (bank 2) |
| Pin D4 | I/O β General-purpose user I/O (bank 2) |
| Pin D5 | GND β Ground |
| Pin D6 | GND β Ground |
| Pin D7 | I/O β General-purpose user I/O (bank 1) |
| Pin D8 | I/O β General-purpose user I/O (bank 1) |
| Pin D9 | I/O β General-purpose user I/O (bank 1) |
| Pin D10 | I/O β General-purpose user I/O (bank 1) |
| Pin E1 | I/O β General-purpose user I/O (bank 2) |
| Pin E2 | I/O β General-purpose user I/O (bank 2) |
| Pin E3 | I/O β General-purpose user I/O (bank 2) |
| Pin E4 | I/O β General-purpose user I/O (bank 2) |
| Pin E5 | VCCINT β Core supply voltage (3.3 V) |
| Pin E6 | VCCINT β Core supply voltage (3.3 V) |
| Pin E7 | I/O β General-purpose user I/O (bank 1) |
| Pin E8 | I/O β General-purpose user I/O (bank 1) |
| Pin E9 | I/O β General-purpose user I/O (bank 1) |
| Pin E10 | I/O β General-purpose user I/O (bank 1) |
| Pin F1 | I/O β General-purpose user I/O (bank 2) |
| Pin F2 | I/O β General-purpose user I/O (bank 2) |
| Pin F3 | TDI β JTAG Test Data In |
| Pin F4 | TMS β JTAG Test Mode Select |
| Pin F5 | VCCINT β Core supply voltage (3.3 V) |
| Pin F6 | VCCINT β Core supply voltage (3.3 V) |
| Pin F7 | TCK β JTAG Test Clock |
| Pin F8 | TDO β JTAG Test Data Out |
| Pin F9 | I/O β General-purpose user I/O (bank 2) |
| Pin F10 | I/O β General-purpose user I/O (bank 2) |
| Pin G1 | I/O β General-purpose user I/O (bank 2) |
| Pin G2 | I/O β General-purpose user I/O (bank 2) |
| Pin G3 | I/O β General-purpose user I/O (bank 2) |
| Pin G4 | I/O β General-purpose user I/O (bank 2) |
| Pin G5 | GND β Ground |
| Pin G6 | GND β Ground |
| Pin G7 | I/O β General-purpose user I/O (bank 2) |
| Pin G8 | I/O β General-purpose user I/O (bank 2) |
| Pin G9 | I/O β General-purpose user I/O (bank 2) |
| Pin G10 | I/O β General-purpose user I/O (bank 2) |
| Pin H1 | I/O β General-purpose user I/O (bank 2) |
| Pin H2 | I/O β General-purpose user I/O (bank 2) |
| Pin H3 | I/O β General-purpose user I/O (bank 2) |
| Pin H4 | I/O β General-purpose user I/O (bank 2) |
| Pin H5 | VCCIO2 β I/O bank 2 supply voltage (1.5/1.8/2.5/3.3 V) |
| Pin H6 | VCCIO1 β I/O bank 1 supply voltage (1.5/1.8/2.5/3.3 V) |
| Pin H7 | I/O β General-purpose user I/O (bank 1) |
| Pin H8 | I/O β General-purpose user I/O (bank 1) |
| Pin H9 | I/O β General-purpose user I/O (bank 1) |
| Pin H10 | I/O β General-purpose user I/O (bank 1) |
| Pin J1 | I/O β General-purpose user I/O (bank 2) |
| Pin J2 | I/O β General-purpose user I/O (bank 2) |
| Pin J3 | GND β Ground |
| Pin J4 | I/O β General-purpose user I/O (bank 2) |
| Pin J5 | I/O β General-purpose user I/O (bank 2) |
| Pin J6 | I/O β General-purpose user I/O (bank 1) |
| Pin J7 | I/O β General-purpose user I/O (bank 1) |
| Pin J8 | I/O β General-purpose user I/O (bank 1) |
| Pin J9 | I/O β General-purpose user I/O (bank 1) |
| Pin J10 | I/O β General-purpose user I/O (bank 1) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM240GM100C5N is suitable for 7 applications: I/O Expansion and Voltage Level Shifting, Address Decoding and Glue Logic for Microprocessors, JTAG-Controlled Board Configuration and Test, Power-Up Sequencing for Multi-Rail Systems, LED Display Driving and Visual Indicators, Portable and Battery-Powered Consumer Electronics, Industrial Control and Factory Automation.
I/O Expansion and Voltage Level Shifting
The EPM240GM100C5N's 80 user I/Os and multiVolt I/O support (1.5/1.8/2.5/3.3 V) make it ideal for I/O expansion and voltage translation in mixed-voltage designs. With 192 macrocells and 4.7 ns tPD, the device bridges 3.3 V microcontrollers to 1.8 V DDR memory or 5 V legacy peripherals without external level-shifters. The non-volatile Flash configuration eliminates boot delay, enabling instant-on behavior in real-time control systems. Placed between the MCU and peripheral bus with JTAG-controlled programming, it adds design flexibility while reducing BOM count versus discrete 74-series buffers.
Recommended
Address Decoding and Glue Logic for Microprocessors
With 192 macrocells and 4.7 ns pin-to-pin delay, the EPM240GM100C5N excels at address decoding, chip-select generation, and wait-state insertion for microprocessors, DSPs, and memory interfaces. The wide 80-I/O count supports 32-bit address/data buses plus control signals in a single device. The non-volatile Flash fabric ensures deterministic power-on behavior critical for processor boot sequences. Compared with discrete PAL/GAL devices, the MAX II G integrates UFM (User Flash Memory) for storing board ID and calibration constants, replacing an external EEPROM.
Recommended
JTAG-Controlled Board Configuration and Test
The EPM240GM100C5N's IEEE 1149.1 JTAG interface and in-system programmability make it ideal for board-level configuration, boundary-scan test, and field-upgradable logic. Engineers can re-route signals, fix design errors, or add features via JTAG without removing the part from the PCB - a major advantage over ASICs and discrete PALs. The 100,000 program/erase cycle endurance supports frequent firmware updates. Used as a JTAG-controlled switch matrix, it routes test vectors to multiple subsystems in production test fixtures.
Recommended
Power-Up Sequencing for Multi-Rail Systems
The EPM240GM100C5N is widely used to implement power-up and power-down sequencing in multi-rail systems such as FPGAs, ASICs, and complex SoCs. With 80 I/Os and deterministic 4.7 ns timing, the device generates precise enable signals for DC-DC converters, LDOs, and load switches in the correct order to prevent latch-up and in-rush current damage. The non-volatile configuration ensures the sequencing logic is active before any rail stabilizes, providing hardware-level safety independent of firmware boot state.
Recommended
LED Display Driving and Visual Indicators
The EPM240GM100C5N's 80 user I/Os and 4.7 ns tPD make it well suited for driving multiplexed LED matrices, 7-segment displays, and Charlieplexed indicator arrays. Each output can sink 25 mA per the MAX II G datasheet, enabling direct LED drive without external transistors. The Flash-based configuration stores custom blinking patterns and brightness PWM sequences that load instantly at power-up. Used in industrial control panels and consumer appliances, it replaces dozens of 74HC595 shift registers with a single BGA device.
Recommended
Portable and Battery-Powered Consumer Electronics
As a MAX II G 'zero-power' variant, the EPM240GM100C5N offers lower static current than the original MAX II, making it suitable for battery-powered and portable applications such as handheld instruments, wearables, and IoT edge devices. The 3.3 V core and 1.5 V multiVolt I/O directly interface modern low-power MCUs without level shifters. The non-volatile Flash fabric eliminates configuration current spikes at boot, extending battery life. Its 6 x 6 mm MBGA package fits space-constrained designs where every square millimeter matters.
Recommended
Industrial Control and Factory Automation
With its -40 C to +125 C operating range and RoHS-compliant construction, the EPM240GM100C5N is qualified for industrial control and factory automation equipment such as PLCs, motor controllers, and sensor interfaces. The non-volatile Flash configuration provides deterministic behavior critical for safety-related logic, and the 80 user I/Os handle multiple encoder, limit-switch, and relay-drive signals. JTAG ISP enables field updates to retrofit new features without board replacement, reducing total cost of ownership in long-lifecycle industrial installations.
Recommended
Recommended Products Summary
Engineering reference data for EPM240GM100C5N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM240GF100C5N | EPM240ZM100C5N | 5M240ZT100C5N |
|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 100-MBGA (6 x 6 mm, 0.5 mm pitch) | 100-MBGA (6 x 6 mm) - same | 100-MBGA (6 x 6 mm) - same | 100-MBGA (6 x 6 mm) - same |
| Family | MAX II G | MAX II G | MAX II Z | MAX V |
| Logic Elements / Macrocells | 240 LE / 192 macrocells | 240 LE / 192 macrocells | 240 LE / 192 macrocells | 240 LE |
| User I/Os | 80 | 80 | 80 | 79 |
| tPD (Pin-to-Pin Delay) | 4.7 ns (C5) | 4.7 ns (C5) | 4.7 ns (C5) | 7.5 ns (C5) |
| Core Voltage | 3.3 V | 3.3 V | 1.8 V | 1.8 V |
| Static Current (typ) | Low (MAX II G zero-power) | Low (MAX II G) | Lower (MAX II Z) | Lowest (MAX V) |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
Key Differentiators
- Zero-power MAX II G variant with lower static current (vs EPM240F100C5N (MAX II non-G))
- Higher integration - 80 I/Os in compact 6 x 6 mm BGA (vs EPM240GT100C5N (TQFP package))
- Instant-on Flash configuration with no boot PROM (vs SRAM-based FPGAs (e.g., Cyclone series))
Design Notes
The 100-MBGA package has a 0.5 mm ball pitch on a 6 x 6 mm body. Use 0.4 mm via-in-pad (VIP) or microvia escape routing with at least 4 mil trace/space on a 4-layer PCB. Place a continuous GND plane on layer 2 directly under the BGA to provide a low-impedance return path and thermal spreading. Add 4 thermal vias (0.3 mm drill) under the center balls to keep junction temperature below 100 C at maximum toggle rate.
The EPM240GM100C5N requires two supply rails: VCCINT at 3.3 V (Β±5%) for the core, and VCCIO1/VCCIO2 at 1.5/1.8/2.5/3.3 V for the I/O banks. Decouple each VCCINT pin with a 0.1 uF X7R ceramic plus a 10 uF bulk capacitor within 50 mil. Place one 0.1 uF cap per VCCIO pin. Power-up sequencing is not required between VCCINT and VCCIO, but the JTAG controller must hold TMS high during VCC ramp to prevent inadvertent configuration.
Do not exceed the maximum I/O current of 25 mA per pin or 200 mA per bank. The MAX II G I/O is 5 V-tolerant only when VCCIO is 3.3 V and the input is below 4.0 V - do not apply 5 V signals when VCCIO is 1.8 V or damage will occur. Use Quartus II / Quartus Prime for programming; legacy MAX+PLUS II software does not support MAX II G silicon revisions.
For high-speed designs (>50 MHz), enable series 50 ohm termination on critical clock and JTAG signals by setting Quartus pin assignments to 'Weak Pull-Up' or 'Bus Hold' as appropriate. The MAX II G supports hot-socketing insertion without damage, but I/Os are tri-stated until configuration completes (~200 us). Route TDI/TMS/TCK away from switching I/O banks to avoid JTAG boundary-scan false triggers.
Compliance Information
RoHS compliant and lead-free per digchip datasheet record. Not AEC-Q100 qualified (consumer/industrial CPLD, not automotive-grade). MSL-3 moisture sensitivity per JEDEC J-STD-020.
