EPM240GF100I5N - 240-LE MAX II CPLD, 100-FBGA, Industrial | Intel
MPN: EPM240GF100I5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11.33 | $11.33 |
| 10 | $10.55 | $105.50 |
| 100 | $9.42 | $942.00 |
| 500 | $8.65 | $4,325.00 |
| 1,000 | $7.9 | $7,900.00 |
Drop-in alternatives for EPM240GF100I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM240GF100C5N
✅ Drop-In✓ In Stock
$8.92 / Unit
View Datasheet →EPM240F100I5N
✅ Drop-In✓ In Stock
$5.2 / Unit
View Datasheet →EPM240F100C5N
✅ Drop-In✓ In Stock
$5.2 / Unit
View Datasheet →EPM570GF100I5N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
LC4256ZE-7TN100C
✅ Drop-In📋 Reference alternative (not in catalog)
EPM240GF100I5N Maximum Ratings & Electrical Characteristics
| Series | MAX II |
| Logic Elements / Blocks | 240 LE |
| Number of Macrocells | 192 |
| Maximum User I/O | 80 |
| Propagation Delay (tpd, max) | 4.7 ns |
| Programmable Type | In-System Programmable (ISP) |
| Non-Volatile Memory | On-chip flash configuration |
| Internal Supply Voltage | 1.71 V to 1.89 V (regulated on-chip) |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Package | 100-ball FBGA (FineLine BGA), 11 mm x 11 mm, 1.0 mm pitch |
| Operating Temperature (TJ) | -40 C to +100 C |
| Mounting Type | Surface Mount |
| JTAG Support | IEEE 1149.1 / IEEE 1532 compliant |
| Lead-Free / RoHS | Yes (lead-free, RoHS compliant) |
| Logic Family | CMOS |
| Vertical Migration Family | EPM240 / EPM570 / EPM1270 / EPM2210 in same-package footprint |
EPM240GF100I5N 100-ball fbga (fineline bga), 11 mm x 11 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EPM240GF100I5N (100-ball fbga (fineline bga), 11 mm x 11 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM240GF100I5N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM240GF100I5N is suitable for 6 applications: Industrial Control I/O Expansion and Bus Bridging, Power-Sequencing and Reset Management in Networking Line Cards, Microprocessor Address Decoding and Chip-Select Logic, Automotive Body Electronics and LED Driver Control, Portable and Battery-Powered Consumer Device Glue Logic, Test & Measurement Equipment Front-End Logic.
Industrial Control I/O Expansion and Bus Bridging
The EPM240GF100I5N is a strong fit for industrial control I/O expansion because it offers 80 user I/Os and 4.7 ns propagation delay, deterministic glue-logic timing that MCUs and FPGAs cannot match at this BOM cost. The MultiVolt I/O banks support 1.5/1.8/2.5/3.3 V interface levels, enabling the CPLD to bridge between a 1.8 V ARM Cortex MCU and a 3.3 V peripheral bus without external level shifters. Industrial temperature rating (-40 C to +100 C junction) is essential for factory-floor controllers, motor drives, and PLCs. On-chip flash configuration eliminates external boot PROMs, reducing PCB area. The 100-FBGA package is well-suited to densely-routed multi-rail designs, and Quartus II fitter reports deliver deterministic propagation delay for safety-critical timing.
Recommended
Power-Sequencing and Reset Management in Networking Line Cards
The EPM240GF100I5N is widely deployed for power-sequencing logic on networking line cards and routers where deterministic reset behavior is mandatory. Each macrocell provides a programmable flip-flop and product-term sum, allowing the designer to implement watchdog, voltage-rail sequencing, and I2C address-decoding glue in a single 100-FBGA device. The 4.7 ns tpd ensures reset and gate-drive signals propagate well within sub-microsecond supervisory windows. MultiVolt I/O lets the CPLD interface to 1.8 V switch ASICs and 3.3 V hot-swap controllers without external translators. Industrial temperature grade supports the ATCA and NEBS-compliant chassis ambient of 55-70 C. Quartus II software supports BSDL generation for IEEE 1149.1 boundary-scan coverage during line-card manufacturing test.
Recommended
Microprocessor Address Decoding and Chip-Select Logic
The EPM240GF100I5N fits address-decoding and chip-select generation in legacy microprocessor systems, replacing discrete 74FCT or 74LS glue with a single programmable device. 192 macrocells provide enough product terms to decode 24-32 address lines plus read/write strobes into 4-8 chip-select outputs. The 4.7 ns propagation delay keeps chip-select-to-access latency well within typical 70-100 ns memory bus budgets. Non-volatile configuration means the decode map is permanent at power-on with no boot loader delay. Industrial temperature and 100-FBGA package make it suitable for embedded single-board computers, point-of-sale terminals, and industrial printers. Quartus II supports graphical state-machine and truth-table entry that compiles directly to product-term logic.
Recommended
Automotive Body Electronics and LED Driver Control
The EPM240GF100I5N is a fit for automotive body-electronics modules where deterministic timing and high I/O count outweigh the need for processor-class compute. With 80 user I/Os, the CPLD can drive multi-channel LED arrays, scan key matrices, and sequence relays in body-control modules, mirror controllers, and headlamp leveling systems. The MultiVolt I/O banks support 3.3 V and 5 V interface levels common in 12 V automotive buses. Industrial temperature rating (-40 C to +100 C) covers most cabin and under-hood ambient zones; for 125 C under-hood designs, designers should evaluate AEC-Q100 qualified automotive variants. The 100-FBGA footprint supports miniaturized ECUs where the CPLD replaces 4-6 discrete logic packages.
Recommended
Portable and Battery-Powered Consumer Device Glue Logic
The EPM240GF100I5N is selected for portable consumer devices where low static power and instant-on configuration outweigh FPGAs. The on-chip voltage regulator draws microamp-level quiescent current from the VCCIO rail, which lets a coin-cell or Li-ion source keep the device configured even in deep-sleep states. The 4.7 ns tpd enables fast wake-up to I2C/SPI peripheral enable, key-scan debouncing, and battery-management auxiliary logic. The MultiVolt I/O banks interface directly to 1.8 V application processors and 3.3 V sensors without external translators. The 100-FBGA 11 mm x 11 mm footprint is small enough for wearable and handheld enclosures. On-chip flash configuration means no external boot device, lowering total BOM and standby drain.
Recommended
Test & Measurement Equipment Front-End Logic
The EPM240GF100I5N fits the front-end logic of test and measurement equipment such as bench multimeters, oscilloscope front panels, and signal-generator mode switches. With 80 user I/Os and 4.7 ns propagation delay, the CPLD can scan rotary encoders, debounce key matrices, drive seven-segment or OLED displays, and route analog MUX select lines from a single device. Non-volatile configuration ensures the instrument boots to the correct mode within microseconds, with no user-visible FPGA configuration latency. MultiVolt I/O connects directly to 1.8 V DSP or MCU and 3.3 V display drivers. Industrial temperature rating supports lab and light-industrial ambient. Quartus II BSDL output accelerates IEEE 1149.1 boundary-scan coverage during in-circuit test.
Recommended
Recommended Products Summary
Engineering reference data for EPM240GF100I5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM240GF100C5N | EPM240F100I5N | EPM240F100C5N | EPM570GF100I5N | LC4256ZE-7TN100C |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Lattice Semiconductor |
| Package | 100-FBGA (11x11 mm, 1.0 mm pitch) | 100-FBGA (same footprint) | 100-FBGA (same footprint) | 100-FBGA (same footprint) | 100-FBGA (same vertical-migration footprint) | 100-TQFP (different package style, same pin count) |
| Logic Elements / Blocks | 240 LE | 240 LE | 240 LE | 240 LE | 570 LE | 256 macrocells |
| Number of Macrocells | 192 | 192 | 192 | 192 | 440 | 256 |
| Maximum User I/O | 80 | 80 | 80 | 80 | 76-80 (100-FBGA migration) | 64-80 (TQFP-100) |
| Propagation Delay (tpd max) | 4.7 ns | 4.7 ns | 4.7 ns | 5.4 ns (C5 speed grade) | 5.4 ns | 7.5 ns |
| Operating Temperature | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) | -40 C to +100 C (industrial) | 0 C to +90 C (commercial) |
| Lead-Free / RoHS | Yes (G suffix) | Yes | No (legacy lead) | No (legacy lead) | Yes | Yes |
| Internal Core Voltage | 1.71 V to 1.89 V (regulated on-chip) | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.8 V nominal |
Key Differentiators
- Industrial temperature grade in a lead-free 100-FBGA (vs EPM240GF100C5N)
- G-suffix lead-free compliance (vs EPM240F100I5N)
- On-chip non-volatile flash configuration (vs LC4256ZE-7TN100C)
- Higher logic density in same package (vs EPM240F100C5N)
Design Notes
The EPM240GF100I5N integrates an on-die voltage regulator that derives the 1.8 V core from the VCCIO rail, so designers only need to supply one external rail. Per Quartus II pin connection guidelines, place a 0.1 uF decoupling capacitor adjacent to every VCCIO ball and a 10 uF bulk capacitor on the main VCCIO rail. Estimate: at room temperature with all 80 I/Os toggling at 100 MHz, peak supply current stays below 50 mA, well within the on-chip regulator's 100 mA continuous rating.
The 100-FBGA package at 1.0 mm pitch requires 4-layer PCB with microvia stackups for fan-out; do not attempt 6-mil traces on outer layers - escape routing will fail. Use the MAX II device pin connection guidelines file from Intel to verify unused-pin termination; unconfigured I/O pins default to tri-stated input, which can float and cause shoot-through if left driving a bus. Tie unused JTAG TCK/TMS pins through 10 kohm pull-ups to avoid spurious boundary-scan entry during power-up.
MultiVolt I/O supports 1.5 V, 1.8 V, 2.5 V, and 3.3 V interface levels, but each VCCIO bank must be tied to a single voltage - mixing 1.8 V and 3.3 V within the same bank is not allowed. Plan bank assignments during schematic capture before PCB layout to avoid re-spinning the BGA escape. For high-speed LVDS or DDR interfaces, add 33 ohm series-termination resistors close to the CPLD output to dampen reflections on the 100-FBGA escape traces.
Do not attempt to migrate a MAX II design to MAX V without recompile and PCB review - the MAX V family is not pin-compatible. When migrating from EPM240 to EPM570 in the same 100-FBGA, the Quartus II fitter must re-assign pin locations if the EPM240 I/O map used bank-3 pins that the EPM570 repurposes for JTAG or configuration. Estimate: vertical migration typically requires 1-2 days of fitter iteration before bitstream and pinout converge.
Compliance Information
G-suffix denotes lead-free / RoHS compliant finish. Not AEC-Q100 qualified - the standard I5N part is industrial-grade, not automotive-grade; review dedicated AEC-Q100 variants for under-hood 125 C operation. Halogen-free status not stated in the verified datasheet - marked unknown.
