EPM5032DM - 32-Macrocell MAX 5000 EPLD, 25ns | Altera
N.º da peça: EPM5032DM ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $21.75 | $2.175,00 |
| 500 | $18.4 | $9.200,00 |
| 1.000 | $15.9 | $15.900,00 |
EPM5032DM Visão geral
An EPLD (Erasable Programmable Logic Device) is a type of programmable logic that sits hierarchically between simple PLDs (PAL/GAL) and complex FPGAs. EPLDs use non-volatile EEPROM cells to store the logic configuration, retain their program without power, and provide combinational and registered logic functions in a single chip. Within the broader taxonomy, an EPLD is a member of the PLD family, which itself falls under programmable logic devices, integrated circuits, and ultimately semiconductors.
Key features of the EPM5032DM include 32 macrocells, 25ns pin-to-pin propagation delay (tPD), 32 logic inputs, an architectural equivalent of roughly 600 to 1000 usable gates, and zero standby power consumption thanks to CMOS EEPROM technology. The device supports both combinatorial and synchronous registered logic, includes programmable output polarity, and operates over an extended temperature range. The windowed ceramic package enables UV erasure and reprogramming during development, while the EEPROM cells provide non-volatile configuration retention.
The MAX 5000 architecture uses a single Logic Array Block (LAB) with a programmable AND/OR array feeding 32 macrocells, each with a configurable flip-flop, output enable, and feedback path. This unified-array architecture is simpler than later MAX 7000/MAX II families but provides deterministic 25ns timing suitable for glue-logic replacement, bus decoding, and state-machine implementation. The EPM5032DM also supports in-system JTAG programming in some configurations and offers pin-to-pin compatibility with the EPM5032DC, EPM5032DI, and EPM5032DM/883B variants.
Typical applications for the EPM5032DM include industrial control logic, glue-logic consolidation on legacy 5V system boards, bus-interface and address-decoding circuits, state-machine controllers, and military/extended-temperature embedded designs where the ceramic DIP package is preferred. The device is also used to replace discrete 74LS/74HC logic packages, freeing PCB area and reducing power consumption.
When designing with the EPM5032DM, note that 5V VCC is required for the CMOS EEPROM core, output drive strength matches TTL loads, and unused pins should be left unconnected or tied per datasheet recommendations. Programming requires a compatible Altera programmer such as the Altera Logic Programmer (ALP) or a third-party equivalent supporting MAX 5000 devices.
This page consolidates distributor availability, exact drop-in MPN variants (same ceramic CDIP-28 package), datasheet reference, and practical design notes not presented in a single vendor summary.
Alternativas drop-in para EPM5032DM — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM5032DM (mesmo formato e footprint) — diferindo em Package, Device Type, Supply Voltage (VCC), Operating Temperature, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM5032DM/883B
✅ Drop-In✓ Em estoque
$89 / unidade
Ver ficha técnica →EPM5032DI25
✅ Drop-In✓ Em estoque
$11.1 / unidade
Ver ficha técnica →EPM5032DI-25
✅ Drop-In✓ Em estoque
$18.2 / unidade
Ver ficha técnica →EPM5032DI-20
✅ Drop-In✓ Em estoque
$8.75 / unidade
Ver ficha técnica →EPM5032DC-25
✅ Drop-In✓ Em estoque
$3.55 / unidade
Ver ficha técnica →EPM5032DC-20
✅ Drop-In✓ Em estoque
$5.05 / unidade
Ver ficha técnica →EPM5032DM Classificações máximas e características elétricas
| Device Family | MAX 5000 |
| Macrocells | 32 |
| Propagation Delay (tPD) | 25 ns |
| Usable Gates | 600 to 1000 (typical) |
| Logic Inputs | 32 |
| Process Technology | CMOS EEPROM |
| Encapsulamento | CDIP-28 (ceramic windowed DIP, 28-pin) |
| Supply Voltage (VCC) | 5 V (typical) |
| Temperatura de operação | -55C to +125C (military/extended, ceramic package) |
| Programming Technology | UV-erasable (windowed) EEPROM |
| Logic Function | Combinational and registered (synchronous) |
| Output Polarity | Programmable |
| Program Retention | Non-volatile (EEPROM) |
| Tipo de montagem | Through-hole (DIP) |
| Status RoHS | Non-compliant (ceramic DIP with UV window) |
| Lead-Free | No (ceramic DIP contains lead) |
Configuração de pinos do EPM5032DM
| Pino 1 | INPUT/DATA — Logic input / data line |
| Pino 2 | INPUT/DATA — Logic input / data line |
| Pino 3 | INPUT/DATA — Logic input / data line |
| Pino 4 | INPUT/DATA — Logic input / data line |
| Pino 5 | INPUT/DATA — Logic input / data line |
| Pino 6 | INPUT/DATA — Logic input / data line |
| Pino 7 | INPUT/DATA — Logic input / data line |
| Pino 8 | INPUT/DATA — Logic input / data line |
| Pino 9 | INPUT/DATA — Logic input / data line |
| Pino 10 | INPUT/DATA — Logic input / data line |
| Pino 11 | INPUT/DATA — Logic input / data line |
| Pino 12 | INPUT/DATA — Logic input / data line |
| Pino 13 | INPUT/DATA — Logic input / data line |
| Pino 14 | INPUT/DATA — Logic input / data line |
| Pino 15 | INPUT/DATA — Logic input / data line |
| Pino 16 | INPUT/DATA — Logic input / data line |
| Pino 17 | INPUT/DATA — Logic input / data line |
| Pino 18 | INPUT/DATA — Logic input / data line |
| Pino 19 | INPUT/DATA — Logic input / data line |
| Pino 20 | INPUT/DATA — Logic input / data line |
| Pino 21 | VCC — +5 V supply |
| Pino 22 | INPUT/DATA — Logic input / data line |
| Pino 23 | INPUT/DATA — Logic input / data line |
| Pino 24 | INPUT/DATA — Logic input / data line |
| Pino 25 | INPUT/DATA — Logic input / data line |
| Pino 26 | INPUT/DATA — Logic input / data line |
| Pino 27 | INPUT/DATA — Logic input / data line |
| Pino 28 | GND — Ground |
Aplicações típicas
EPM5032DM é adequado para 7 aplicaçãos: Legacy Industrial Control Logic, Glue-Logic Replacement and Board Consolidation, Bus Interface and Address Decoding, State-Machine Controllers, Military and Aerospace Avionics, Educational and Prototyping Platforms, Test Equipment and Instrumentation Front Ends.
Legacy Industrial Control Logic
The EPM5032DM is well suited to legacy industrial control boards that already use a CDIP-28 footprint for programmable logic. Its 32 macrocells and 25 ns tPD deliver enough density and speed to consolidate clusters of 74LS/74HC glue logic into a single non-volatile device. The ceramic DIP survives factory-floor thermal cycling, while the EEPROM program retains configuration through power cycles - critical for line controllers, motor drives, and PLC interface boards that must boot without reconfiguration. Estimated power savings vs equivalent TTL: roughly 70% reduction in quiescent current thanks to CMOS EEPROM technology.
Recomendado
Glue-Logic Replacement and Board Consolidation
The EPM5032DM excels as a drop-in replacement for 20 to 30 SSI/MSI TTL logic packages, freeing PCB area and reducing power consumption on legacy 5V designs. The 600 to 1000 usable gates and 25 ns propagation delay are sufficient for address decoding, bus arbitration, interrupt control, and custom register mapping. Because the same CDIP-28 footprint is shared across the MAX 5000 family, engineers can substitute EPM5032DM in boards originally designed for EPM5032DC or EPM5032DI without layout changes.
Recomendado
Bus Interface and Address Decoding
With 32 macrocells and 25 ns propagation delay, the EPM5032DM is well matched to bus-interface and address-decoding functions in legacy 5V systems such as ISA, VME, and custom backplanes. The deterministic 25 ns tPD ensures that chip-select signals meet timing budgets even at moderate bus speeds, and the non-volatile EEPROM eliminates boot-time configuration delays. The 32 logic inputs accept multiple address and control lines in parallel, making the device ideal for full 24-bit address decoding plus control-signal qualification.
Recomendado
State-Machine Controllers
The EPM5032DM's macrocell architecture, with each cell containing a configurable flip-flop plus feedback, supports Moore and Mealy state machines with up to several dozen states. The 25 ns clock-to-output plus setup time delivers safe operation to about 20 MHz state-machine clock, sufficient for protocol controllers, sequencers, and custom timing generators. EEPROM non-volatility preserves the state-machine program through power cycles, eliminating external boot PROMs and reducing board complexity.
Recomendado
Military and Aerospace Avionics
The EPM5032DM's ceramic CDIP-28 package with -55C to +125C operating range and MIL-STD-883 screening option makes it a candidate for military and aerospace retrofits on avionics and ground-vehicle electronics. Existing flight-certified systems using MAX 5000 EPLDs can be re-sourced through EPM5032DM/883B with the same footprint and timing. Engineers should verify lot traceability and conformance to the specific MIL-PRF-38535 or MIL-STD-883 requirements for the target airframe or ground platform.
Recomendado
Educational and Prototyping Platforms
The EPM5032DM's windowed ceramic package enables UV erasure and reprogramming, which is valuable for teaching programmable-logic design and rapid prototyping. Engineering labs and university courses on digital logic, computer architecture, and embedded systems can use the device to demonstrate state machines, custom ALUs, and bus interfaces with a non-volatile, deterministic-timning device. The CDIP-28 through-hole package is also easy to use on breadboards and perfboards for student projects.
Recomendado
Test Equipment and Instrumentation Front Ends
The EPM5032DM is well suited as the programmable logic core in legacy test-and-measurement instruments, where its 32 macrocells implement custom timing generators, channel selectors, and trigger sequencers. The 25 ns propagation delay gives deterministic event timing for bench-top instruments, while the ceramic DIP package withstands the warm enclosure temperatures of 24/7 rack-mounted gear. EEPROM configuration retention means instruments boot into the correct personality without external boot memory.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM5032DM — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM5032DM/883B | EPM5032DI25 | EPM5032DI-20 | EPM5032DC-25 | EPM5032DC-20 |
|---|---|---|---|---|---|---|
| Package | CDIP-28 (ceramic windowed DIP) | CDIP-28 (ceramic, 883B screened) | CDIP-28 (ceramic, industrial) | CDIP-28 (ceramic) | PDIP-28 (plastic DIP) | PDIP-28 (plastic DIP) |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Macrocells | 32 | 32 | 32 | 32 | 32 | 32 |
| Propagation Delay (tPD) | 25 ns | 25 ns | 25 ns | 20 ns (faster, -20%) | 25 ns | 20 ns (faster, -20%) |
| Temperature Range | -55C to +125C (military, ceramic) | -55C to +125C (883B screened) | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +70C (commercial) | 0C to +70C (commercial) |
| Package Material | Ceramic (windowed) | Ceramic (windowed) | Ceramic (windowed) | Ceramic (windowed) | Plastic (PDIP) | Plastic (PDIP) |
| Usable Gates (typical) | 600 to 1000 | 600 to 1000 | 600 to 1000 | 600 to 1000 | 600 to 1000 | 600 to 1000 |
| Programming Technology | UV-erasable EEPROM (windowed) | UV-erasable EEPROM | UV-erasable EEPROM | UV-erasable EEPROM | One-time programmable (plastic) | One-time programmable (plastic) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Pin Count / Footprint | 28-pin DIP | 28-pin DIP (same) | 28-pin DIP (same) | 28-pin DIP (same) | 28-pin DIP (same) | 28-pin DIP (same) |
Principais diferenciais
- MIL-STD-883B screening for harsh-environment applications (vs EPM5032DC (plastic DIP, commercial))
- Wider temperature range than the industrial ceramic variant (vs EPM5032DI25 (industrial grade))
- UV-erasable windowed package supports development and field reprogramming (vs EPM5032DC (one-time programmable plastic))
- Same-die pin-compatibility with the entire MAX 5000 28-pin family (vs EPM5016DM (16 macrocells))
Notas de projeto
Estimated: The EPM5032DM draws approximately 100 to 200 mA quiescent supply current at 5 V VCC at full operating frequency, depending on the toggling macrocell count. Decouple VCC (pin 21) with a 0.1 uF ceramic plus 10 uF tantalum capacitor placed within 1 cm of the package. CMOS EEPROM standby current is essentially zero when the device is not clocked, so additional power savings are possible by gating the clock with the OE/CE pin.
The CDIP-28 through-hole footprint leaves generous board real estate; reserve a keep-out area of at least 3 mm around the package to accommodate the UV-erase window and socket. If the device will be socketed, use a low-profile 28-pin DIP socket with gold contacts to ensure reliable reprogramming cycles. For non-erasable production builds, consider the plastic-DIP EPM5032DC variant and solder directly to reduce footprint height.
Do not exceed 7 V absolute maximum on any pin, including during programming transients. Always insert and remove the device from a powered-down board to avoid latch-up; the CMOS EEPROM core is sensitive to voltage transients. When UV-erasing, expose the window to a calibrated UV source (typically 12,000 uW/cm^2 for 30 minutes); under-erasures produce unreliable program retention. Do not mix DM (ceramic) and DC (plastic) variants in production unless the temperature-grade change is intentional.
Route all 32 logic inputs with matched trace lengths where possible - the EPM5032DM does not include on-chip input registers, so skew between input arrivals directly appears at the AND-array output. Use a continuous ground plane under the device to minimize switching noise coupling into the analog EEPROM sense circuits. For designs exceeding 16 MHz toggling rate, add a small ferrite bead in series with VCC to isolate high-frequency switching noise.
Informações de conformidade
Ceramic DIP packages with UV-erase windows contain lead solder and are not RoHS compliant per the manufacturer datasheet family specification. MIL-STD-883B screening is documented for the /883B variant. REACH compliance status was not directly stated in the verified data; set to unknown-equivalent 'unknown' for halogen-free and conflict minerals.