EPM5032DM/883B - 32-Macrocell MAX 5000 EPLD, MIL-883B | Intel (Altera)
MPN: EPM5032DM/883B β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $128.5 | $1,285.00 |
| 100 | $110 | $11,000.00 |
| 250 | $98.75 | $24,687.50 |
| 500 | $89 | $44,500.00 |
Drop-in alternatives for EPM5032DM/883B β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPM5032DC-25
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$3.55 / Unit
View Datasheet βEPM5032DC-20
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$5.05 / Unit
View Datasheet βEPM5032DC-15
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$9.95 / Unit
View Datasheet βEPM5032DI-25
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$18.2 / Unit
View Datasheet βEPM5032DM-25/883B
β Drop-Inπ Reference alternative (not in catalog)
EPM5032DM-15/883B
β Drop-Inπ Reference alternative (not in catalog)
EPM5032DM/883B Maximum Ratings & Electrical Characteristics
| Family | MAX 5000 |
| Macrocells | 32 |
| Logic Elements / Flip-Flops | 32 D-type flip-flops |
| Operating Voltage (VCC) | 5 V (nominal) |
| Package Type | Ceramic DIP (DM suffix), windowed for UV erasure |
| Operating Temperature Range | -55 C to +125 C (military / MIL-STD-883B) |
| Screening Level | MIL-STD-883B Class B |
| Programmability | UV-erasable, non-volatile EPROM cell |
| Security Bit | Programmable security bit for read-protection |
| I/O Standard | TTL-compatible |
| RoHS Status | unknown (military ceramic DIP typically non-RoHS) |
| Manufacturer | Altera (now Intel Programmable Solutions Group) |
EPM5032DM/883B Pin Configuration
| Pin 1 | I/O β Programmable I/O pin (global bus / LAB interconnect) |
| Pin 2 | I/O β Programmable I/O pin |
| Pin 3 | I/O β Programmable I/O pin |
| Pin 4 | I/O β Programmable I/O pin |
| Pin 5 | I/O β Programmable I/O pin |
| Pin 6 | I/O β Programmable I/O pin |
| Pin 7 | I/O β Programmable I/O pin |
| Pin 8 | I/O β Programmable I/O pin |
| Pin 9 | I/O β Programmable I/O pin |
| Pin 10 | GND β Ground |
| Pin 11 | I/O β Programmable I/O pin |
| Pin 12 | I/O β Programmable I/O pin |
| Pin 13 | I/O β Programmable I/O pin |
| Pin 14 | I/O β Programmable I/O pin |
| Pin 15 | I/O β Programmable I/O pin |
| Pin 16 | I/O β Programmable I/O pin |
| Pin 17 | I/O β Programmable I/O pin |
| Pin 18 | I/O β Programmable I/O pin |
| Pin 19 | I/O β Programmable I/O pin |
| Pin 20 | I/O β Programmable I/O pin |
| Pin 21 | I/O β Programmable I/O pin |
| Pin 22 | I/O β Programmable I/O pin |
| Pin 23 | I/O β Programmable I/O pin |
| Pin 24 | I/O β Programmable I/O pin |
| Pin 25 | I/O β Programmable I/O pin |
| Pin 26 | I/O β Programmable I/O pin |
| Pin 27 | I/O β Programmable I/O pin |
| Pin 28 | VCC β +5 V supply |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM5032DM/883B is suitable for 6 applications: Military Avionics Flight-Control Logic, Missile Guidance Electronics, Secure Military Communications, Radar Signal Processing Glue Logic, Industrial Control in Extreme Environments, Legacy Avionics Bus Interface (MIL-STD-1553 / ARINC 429).
Military Avionics Flight-Control Logic
The EPM5032DM/883B's MIL-STD-883B Class B screening and 32-macrocell density make it a fit for avionics flight-control subsystems where multiple discrete SSI/MSI logic packages need consolidation into a single qualified device. The /883B screening per MIL-STD-883B Test Method 1005 and 1010 covers burn-in and thermal cycling required by DO-254 design assurance guidance, while 32 macrocells provide enough logic to implement encoder/decoder, watchdog, and bus-arbiter state machines replacing 30-50 7400-series packages.
Recommended
Missile Guidance Electronics
The EPM5032DM/883B's ceramic DIP package, MIL-STD-883B screening, and -55 C to +125 C operating range suit missile guidance electronics where parts must survive high-G launch shock and wide thermal excursions. Its 32 macrocells implement guidance-law state machines, sensor-fusion glue logic, and timing generators, with the UV-erasable window supporting secure reconfiguration between test cycles. Engineers pair it with radiation-hardened micros, but the EPM5032DM/883B handles all non-rad-hard glue-logic consolidation.
Recommended
Secure Military Communications
The EPM5032DM/883B fits secure military radio and cryptographic subsystems where programmable logic must be field-reconfigurable yet retain MIL-spec reliability. Its programmable security bit locks out readback of the EPROM configuration to protect crypto algorithms, and 32 macrocells implement serial-protocol converters, frame-sync logic, and baseband signal-conditioning state machines. The /883B screening meets MIL-STD-883B Class B for deployment in manpack, vehicular, and fixed-site secure radio systems.
Recommended
Radar Signal Processing Glue Logic
The EPM5032DM/883B serves in military radar systems as glue logic between analog front ends, ADC/DAC converters, and DSP processors, where its 32 macrocells handle timing-control, channel-select decoding, and handshaking between sensor ASICs. MIL-STD-883B Class B qualification is required for radar systems deployed in defense platforms, and the device's 5 V TTL-compatible I/O simplifies integration with legacy bipolar signal-conditioning components. Designers often use it for range-gate timing and PRF selection.
Recommended
Industrial Control in Extreme Environments
The EPM5032DM/883B's -55 C to +125 C operating range and MIL-STD-883B screening also suit industrial control systems deployed in arctic, desert, or down-hole environments where commercial-grade CPLDs fail. 32 macrocells are sufficient for motor-control state machines, sensor-fusion logic, and safety-interlock controllers in oil-and-gas, mining, and outdoor telecom installations. The MIL-spec package ensures long-term reliability in high-humidity and corrosive atmospheres.
Recommended
Legacy Avionics Bus Interface (MIL-STD-1553 / ARINC 429)
The EPM5032DM/883B is widely deployed in legacy avionics as a MIL-STD-1553 or ARINC 429 bus-interface controller, encoding and decoding Manchester-II or bipolar-RZ protocol state machines. Its 32 macrocells can implement a single-channel 1553 remote terminal encoder/decoder, while MIL-STD-883B Class B screening meets DO-254 design-assurance requirements for flight hardware. Many flight-proven MIL-STD-1553 designs still ship with the EPM5032DM/883B on the BOM.
Recommended
Recommended Products Summary
Engineering reference data for EPM5032DM/883B β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM5032DC-25 | EPM5032DC-20 | EPM5032DC-15 | EPM5032DI-25 | EPM5032DM-25/883B | EPM5032DM-15/883B |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | Ceramic DIP (DM, MIL-STD-883B) | Ceramic DIP (DC) - same footprint, commercial screening | Ceramic DIP (DC) - same footprint, commercial screening | Ceramic DIP (DC) - same footprint, commercial screening | Plastic DIP (DI) - same footprint, plastic body | Ceramic DIP (DM) - same as target | Ceramic DIP (DM) - same as target |
| Macrocells | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| MIL-STD-883B Screening | Yes (Class B) | No (commercial) | No (commercial) | No (commercial) | No (industrial) | Yes (Class B) | Yes (Class B) |
| Operating Temperature | -55 C to +125 C | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | -40 C to +85 C (industrial) | -55 C to +125 C (military) | -55 C to +125 C (military) |
| Pin-to-Pin Delay (tPD) | [DATA_NEEDED: DM speed grade tPD] | 25 ns | 20 ns | 15 ns | 25 ns | 25 ns | 15 ns |
| Core Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Programming Technology | UV-erasable EPROM (windowed) | UV-erasable EPROM (windowed) | UV-erasable EPROM (windowed) | UV-erasable EPROM (windowed) | UV-erasable EPROM (windowed) or OTP variant | UV-erasable EPROM (windowed) | UV-erasable EPROM (windowed) |
| Lifecycle Status | Obsolete (NOS only) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete (NOS, distributor only) | Obsolete (NOS, distributor only) |
| Programming Toolchain | MAX+PLUS II (legacy) | MAX+PLUS II (legacy) | MAX+PLUS II (legacy) | MAX+PLUS II (legacy) | MAX+PLUS II (legacy) | MAX+PLUS II (legacy) | MAX+PLUS II (legacy) |
Key Differentiators
- MIL-STD-883B Class B qualified at the original-die level (vs EPM5032DC-25 (commercial grade))
- Ceramic side-brazed DIP package for hermeticity (vs EPM5032DI-25 (plastic DIP))
- Faster speed grade option with MIL-SPEC screening (vs EPM5032DM-15/883B)
Design Notes
Do not design a new product around the EPM5032DM/883B unless MIL-STD-883B Class B screening or UV-erasable programmability is mandatory. The MAX 5000 family is fully obsolete per Intel lifecycle status, programming requires the legacy MAX+PLUS II toolchain (parallel-port dongle), and Intel does not recommend it for new designs. For new builds, consider Intel MAX II/MAX V/MAX 10 families with Quartus support, or Lattice ispMACH 4000 with ispLEVER/diamond toolchains.
Estimated: at -55 C to +125 C military temperature range the ceramic DM package offers a theta_JA of approximately 35-40 C/W on a standard FR-4 board, which is sufficient since the EPM5032 draws less than 200 mA typically (worst-case CMOS ICC). For high-density MAX 5000A/5000B designs in the same DM package, derate by reducing ICC to avoid thermal shutdown. Provide thermal vias under the ceramic body for best heat transfer in sealed enclosures.
Use a 28-pin DIP footprint with socket (e.g. 3M Textool or Aries low-profile DIP socket) so the device can be UV-erased and reprogrammed without desoldering. Place 0.1 uF decoupling capacitors close to VCC (pin 28) and GND (pin 10); add a 10 uF bulk tantalum on the +5 V rail. Avoid routing high-speed signals adjacent to the quartz window area, which is purely mechanical and unshielded.
Estimated: route all I/O pins with controlled impedance (50 ohm microstrip or stripline) if any I/O runs above 50 MHz; the MAX 5000 family has TTL-compatible output drive of typically 24 mA IOL / -4 mA IOH, so fan-out is generous but undershoot can occur on long traces. Use series damping resistors (22-33 ohm) on long clock and synchronous outputs to reduce ringback.
Compliance Information
Ceramic side-brazed DIP with MIL-STD-883B Class B screening; per MIL-STD-1835 military exemption the part typically uses SnPb solder/terminations and is NOT RoHS compliant. AEC-Q100 is automotive-grade qualification, which does not apply to this MIL-SPEC part. REACH and conflict-minerals status unknown from the verified data.
