EPM5032DC-20 - 600-Gate, 32-Macrocell MAX 5000 CPLD DIP-20 | Intel
MPN: EPM5032DC-20 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.05 | $8.05 |
| 10 | $7.2 | $72.00 |
| 100 | $6.4 | $640.00 |
| 500 | $5.65 | $2,825.00 |
| 1,000 | $5.05 | $5,050.00 |
Drop-in alternatives for EPM5032DC-20 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPM5032DC-15
β Drop-Inβ In Stock
$9.95 / Unit
View Datasheet βEPM5032DC-2
β Drop-Inβ In Stock
$8.75 / Unit
View Datasheet βEPM5032DC
β Drop-Inβ In Stock
$10.4 / Unit
View Datasheet βEPM5016DC-20
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$16.5 / Unit
View Datasheet βEPM5016DC-15
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$10.75 / Unit
View Datasheet βEPM5032DC-20 Maximum Ratings & Electrical Characteristics
| Product Family | MAX 5000 |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Programmable Technology | UV-Erasable / OTP EPROM |
| Usable Gates | 600 |
| Macrocells | 32 |
| Maximum Frequency (fCNT) | 71.4 MHz |
| Pin-to-Pin Delay (tPD) | 20 ns |
| Speed Grade | -20 |
| Supply Voltage (VCC) | 5 V |
| Package | 20-pin DIP (Windowed Ceramic, 0.3" wide) |
| Mounting Type | Through-Hole |
| Logic Blocks | 4 Logic Array Blocks (LABs) |
| RoHS Status | Compliant (per IC-Components listing) |
| Manufacturer | Altera (now Intel Programmable Solutions Group) |
| Programming Method | Altera MAX+PLUS II / Quartus (legacy support) |
EPM5032DC-20 Pin Configuration
| Pin 1 | I/O β General-purpose I/O / macrocell input-output |
| Pin 2 | I/O β General-purpose I/O / macrocell input-output |
| Pin 3 | I/O β General-purpose I/O / macrocell input-output |
| Pin 4 | I/O β General-purpose I/O / macrocell input-output |
| Pin 5 | I/O β General-purpose I/O / macrocell input-output |
| Pin 6 | I/O β General-purpose I/O / macrocell input-output |
| Pin 7 | I/O β General-purpose I/O / macrocell input-output |
| Pin 8 | I/O β General-purpose I/O / macrocell input-output |
| Pin 9 | I/O β General-purpose I/O / macrocell input-output |
| Pin 10 | GND β Ground (0 V) |
| Pin 11 | I/O β General-purpose I/O / macrocell input-output |
| Pin 12 | I/O β General-purpose I/O / macrocell input-output |
| Pin 13 | I/O β General-purpose I/O / macrocell input-output |
| Pin 14 | I/O β General-purpose I/O / macrocell input-output |
| Pin 15 | I/O β General-purpose I/O / macrocell input-output |
| Pin 16 | I/O β General-purpose I/O / macrocell input-output |
| Pin 17 | I/O β General-purpose I/O / macrocell input-output |
| Pin 18 | I/O β General-purpose I/O / macrocell input-output |
| Pin 19 | I/O β General-purpose I/O / macrocell input-output |
| Pin 20 | VCC β +5 V supply voltage |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM5032DC-20 is suitable for 6 applications: VME / ISA Bus Address Decoding, Glue-Logic Consolidation in Industrial Controllers, Legacy Military / Aerospace State-Machine Replacement, Microprocessor Address / I/O Expansion, Pin-Compatible Replacement for Older 24-pin PAL/GAL Devices, Field-Repair / Legacy Board Sustainment.
VME / ISA Bus Address Decoding
The EPM5032DC-20 fits VME and ISA bus address-decoding applications because its 32 macrocells are sufficient to decode multiple address and chip-select lines, while the 20 ns pin-to-pin delay keeps decode latency under one bus cycle. Its 5 V TTL-compatible I/O interfaces directly to 74LS245 / 74FCT logic without level shifters, and the UV-erasable windowed DIP package supports engineering rework and field repairs of legacy VME boards. Compared with discrete 74-series decoders, the EPM5032DC-20 consolidates 4-6 decoder packages into one device, reducing PCB area by ~60%. Designers should place the device near the bus buffers and keep decode paths under 20 ns to meet bus timing.
Recommended
Glue-Logic Consolidation in Industrial Controllers
The EPM5032DC-20 is well-suited for consolidating 74-series glue logic in industrial controllers (PLC backplanes, motor-control interface boards, instrumentation front-ends) because its 600 usable gates and 32 macrocells replace roughly 8-12 discrete SSI/MSI packages. The 71.4 MHz internal frequency handles synchronous control paths up to 30 MHz external clock, and the 20-pin DIP footprint simplifies through-hole PCB assembly for legacy industrial designs. Compared with a GAL22V10 / PALCE22V10, the EPM5032DC-20 provides 50% more macrocells, a richer AND/OR array, and EPROM-based programming. Designers should allocate I/O pins for board-level test points and route the JTAG-equivalent programming signals to a header.
Recommended
Legacy Military / Aerospace State-Machine Replacement
The EPM5032DC-20 targets legacy military and aerospace state-machine replacement because it replaces 5-10 74LS / 54LS flip-flop packages with one programmable device, and the windowed ceramic DIP package supports MIL-STD-883B screening flows used on legacy avionics boards. Its 20 ns tPD handles asynchronous control signals typical in flight-control and weapons-system interfaces, and 5 V operation matches MIL-STD-1553 and ARINC 429 transceiver rails. Compared with modern flash-based CPLDs, the EPM5032DC-20 is preferred only when exact bit-for-bit legacy compatibility is required; otherwise MAX II with on-chip flash is recommended. Designers should validate programming files against the original ABEL/CUPL source.
Recommended
Microprocessor Address / I/O Expansion
The EPM5032DC-20 fits 8-bit and 16-bit microprocessor address and I/O expansion applications (8051, 68HC11, Z80, 8086 designs) because its 32 macrocells decode up to 32 chip-selects and generate chip-enable signals for memory and peripheral banks. The 5 V I/O directly interfaces to the microprocessor bus without external buffers, and the 20 ns tPD satisfies the address-to-chip-enable timing of 10-25 MHz MPUs. Compared with discrete 74LS138 / 74LS139 decoders, the EPM5032DC-20 implements a complete 8-bank or 16-bank decoder with strobe and qualification logic in one chip. Designers should use Quartus II legacy mode (or MAX+PLUS II) to import ABEL/CUPL designs.
Recommended
Pin-Compatible Replacement for Older 24-pin PAL/GAL Devices
The EPM5032DC-20 fits pin-compatible replacement of legacy 24-pin PAL/GAL devices (PALCE24V10, GAL6001, etc.) where 32 macrocells and 600 gates are sufficient for the target logic equation. Its 20-pin DIP footprint is mechanically smaller than 24-pin alternatives, allowing it to fit on legacy boards with 20-pin socket footprints. The 5 V operation and TTL I/O match original PAL/GAL signaling, and the 20 ns tPD is comparable to 25 ns PAL devices. Compared with modern Lattice ispMACH 4000ZE, the EPM5032DC-20 preserves EPROM-based programming compatible with original development flows. Designers should verify that the target board's 20-pin socket pinout matches the EPM5032DC-20 datasheet pinout before substitution.
Recommended
Field-Repair / Legacy Board Sustainment
The EPM5032DC-20 is the go-to part for field-repair and legacy board sustainment because Intel PSG no longer manufactures MAX 5000 but maintains pin-compatible stocks via brokers for legacy board refurbishment programs. Its UV-erasable windowed package allows engineering to recover original programming, and the 20 ns tPD preserves the original timing budget of 1980s/1990s designs. Compared with modern CPLDs that require PCB rework for new packages, the EPM5032DC-20 enables drop-in socket replacement of failed MAX 5000 devices without layout changes. Designers should stock EPM5032DC-15 and EPM5032DC-20 as alternates because broker availability fluctuates.
Recommended
Recommended Products Summary
Engineering reference data for EPM5032DC-20 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM5032DC-15 | EPM5032DC-2 | EPM5032DC | EPM5016DC-20 | EPM5016DC-15 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 20-pin DIP (Windowed Ceramic) | 20-pin DIP (Windowed Ceramic) - same | 20-pin DIP (Windowed Ceramic) - same | 20-pin DIP (Windowed Ceramic) - same | 20-pin DIP - same | 20-pin DIP - same |
| Usable Gates | 600 | 600 | 600 | 600 | 400 | 400 |
| Macrocells | 32 | 32 | 32 | 32 | 16 | 16 |
| Pin-to-Pin Delay (tPD) | 20 ns | 15 ns (faster) | 25 ns (slower) | default (typically 25 ns) | 20 ns (same) | 15 ns (faster) |
| Max Frequency (fCNT) | 71.4 MHz | 90 MHz | [DATA_NEEDED] | [DATA_NEEDED] | 71.4 MHz | 90 MHz |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Programming Technology | UV-Erasable / OTP EPROM | UV-Erasable / OTP EPROM | UV-Erasable / OTP EPROM | UV-Erasable / OTP EPROM | UV-Erasable / OTP EPROM | UV-Erasable / OTP EPROM |
Key Differentiators
- Higher logic density vs EPM5016 family (vs EPM5016DC-20)
- Balanced speed grade for 5 V TTL systems (vs EPM5032DC-15)
- Pin-compatible with all MAX 5000 20-pin DIP variants (vs EPM5032DC-2)
Design Notes
The EPM5032DC-20 in the windowed ceramic DIP package has typical CMOS power dissipation of 100-300 mW at 5 V VCC, well within the package's thermal envelope (theta_JA approximately 50-60 C/W for ceramic DIP-20). Estimated: at 200 mW dissipation the junction temperature rise is ~10-12 C above ambient, so no heatsink is required. However, designers should provide at least 1 oz copper pour on power and ground planes and maintain ambient temperature below 70 C for reliable long-term operation in legacy industrial enclosures.
Place a 0.1 uF ceramic decoupling capacitor as close as possible to the VCC pin (pin 20), with the ground return to pin 10 (GND) via a short, wide trace. Add a 10 uF tantalum or electrolytic bulk capacitor on the 5 V rail within 1 inch of the device for supply noise suppression. Estimated: a 0.1 uF + 10 uF decoupling pair reduces VCC ripple by >20 dB in the 1-100 MHz band, which is critical because MAX 5000 I/O switching can inject 50-100 mV of noise onto the supply without proper bypass.
Do not attempt to reprogram the EPM5032DC-20 in-circuit - the MAX 5000 EPROM cells require UV erasure (253.7 nm wavelength, 20-30 minutes at 12-15 mW/cm^2 intensity) through the quartz window before reprogramming, and OTP (one-time-programmable) variants cannot be erased at all. Always verify programming success on a programmer (e.g. Altera PL-MAXPLUS-PUB or BP Microsystems) before socket installation. Note: this part is obsolete and Intel PSG does not provide new factory programming files - existing JEDEC/BitStream files must be retained by the customer.
For VME and ISA bus designs, keep all I/O traces to the EPM5032DC-20 under 50 mm (2 inches) to minimize propagation delay and ringing. Match trace impedance to 50 ohms for clocked I/O, and avoid stubs by using daisy-chain routing for multi-drop signals. Estimated: each inch of improperly-terminated trace adds ~1-2 ns of delay, which can exceed the 20 ns tPD budget on -20 grade parts and cause decode glitches. Use a ground plane under all I/O traces for return-path integrity.
Compliance Information
RoHS compliance per IC-Components listing for EPM5032DC-20. Reach, halogen-free, and lead-free status not confirmed in the verified web data and flagged as unknown. Part is obsolete - REACH SVHC declaration may no longer be maintained by Intel PSG.
