EPM5032DC-25 - 32-Macrocell MAX 5000 EPLD, 25ns DIP-28 | Altera
MPN: EPM5032DC-25 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.86 | $3.86 |
| 10 | $3.78 | $37.80 |
| 100 | $3.71 | $371.00 |
| 200 | $3.63 | $726.00 |
| 500 | $3.55 | $1,775.00 |
Drop-in alternatives for EPM5032DC-25 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPM5032DC-20
β Drop-Inβ In Stock
$5.05 / Unit
View Datasheet βEPM5032DC-15
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View Datasheet βEPM5032DC
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View Datasheet βEPM5032DC-2
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
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View Datasheet βEPM5032DC-25 Maximum Ratings & Electrical Characteristics
| Manufacturer | Altera (Intel Programmable Solutions Group) |
| Product Family | MAX 5000 |
| Device Type | UV Erasable Programmable Logic Device (EPLD) |
| Macrocells | 32 |
| Pin-to-Pin Propagation Delay (tPD) | 25 ns |
| Number of Dedicated Inputs | 32 (in DIP-28 pinout) |
| Number of I/O Pins | 22 (in DIP-28 pinout, 4 used as dedicated inputs) |
| Package | CDIP-28 (Windowed Ceramic DIP-28) |
| Process Technology | CMOS, EPROM (UV-Erasable) |
| Architecture | PAL-Type, Single-LAB, 32-Macrocell |
| Output Structure | Programmable I/O with output enable |
| Flip-Flop Configuration | D, T, JK, or SR (programmable) |
| RoHS Status | Lead Free / RoHS Compliant (per distributor listings) |
| Programming Method | UV erase + Altera/Intel MAX+PLUS II programmer |
| Erasure Method | UV light through ceramic window |
EPM5032DC-25 Pin Configuration
| Pin 1 | I/O β Bidirectional I/O pin (in DIP-28 pinout per MAX 5000 datasheet) |
| Pin 2 | I/O β Bidirectional I/O pin |
| Pin 3 | I/O β Bidirectional I/O pin |
| Pin 4 | I/O β Bidirectional I/O pin |
| Pin 5 | I/O β Bidirectional I/O pin |
| Pin 6 | I/O β Bidirectional I/O pin |
| Pin 7 | I/O β Bidirectional I/O pin |
| Pin 8 | I/O β Bidirectional I/O pin |
| Pin 9 | I/O β Bidirectional I/O pin |
| Pin 10 | GND β Ground reference |
| Pin 11 | I/O β Bidirectional I/O pin |
| Pin 12 | I/O β Bidirectional I/O pin |
| Pin 13 | I/O β Bidirectional I/O pin |
| Pin 14 | I/O β Bidirectional I/O pin |
| Pin 15 | I/O β Bidirectional I/O pin |
| Pin 16 | I/O β Bidirectional I/O pin |
| Pin 17 | I/O β Bidirectional I/O pin |
| Pin 18 | I/O β Bidirectional I/O pin |
| Pin 19 | I/O β Bidirectional I/O pin |
| Pin 20 | I/O β Bidirectional I/O pin |
| Pin 21 | I/O β Bidirectional I/O pin |
| Pin 22 | I/O β Bidirectional I/O pin |
| Pin 23 | INPUT β Dedicated input pin |
| Pin 24 | INPUT β Dedicated input pin |
| Pin 25 | INPUT β Dedicated input pin |
| Pin 26 | INPUT β Dedicated input pin |
| Pin 27 | VCC β Positive supply (typically +5V) |
| Pin 28 | I/O β Bidirectional I/O pin |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM5032DC-25 is suitable for 6 applications: Legacy Industrial Control Logic Replacement, Telecommunications Interface Boards, Aerospace and Military Avionics Systems, Legacy Mainframe Peripheral Boards, Prototype and Qualification Hardware, Test and Measurement Equipment Glue Logic.
Legacy Industrial Control Logic Replacement
The EPM5032DC-25's 32 macrocells and 22 I/O pins are well-suited to replacing networks of discrete 74LS/74HC PALs and SSI glue logic on legacy industrial control boards. With a 25 ns pin-to-pin propagation delay, the device meets timing budgets of older microprocess control loops and PLC I/O scanners. The UV-erasable windowed package supports field re-programming during commissioning or in-service revision, while the CMOS architecture reduces power consumption compared to bipolar PAL equivalents. Design tip: always include an unused I/O pin tied to GND through a 10 kohm resistor to provide a defined logic level during power-up.
Recommended
Telecommunications Interface Boards
In telecom interface and backplane applications, the EPM5032DC-25 is used to implement bus arbitration, address decoding, and protocol-state glue logic between microprocessor buses and serial transceiver ASICs. The 25 ns delay supports standard telecom bus speeds (up to approximately 40 MHz internal state machine operation), while the 32 macrocells comfortably fit a full bus decoder plus a small FIFO controller. The ceramic DIP package withstands the thermal and mechanical stresses typical of telecom rack environments. Performance consideration: the device does not include 5V-tolerant I/O on the legacy CMOS process - ensure all driving logic shares the same VCC rail to avoid latch-up.
Recommended
Aerospace and Military Avionics Systems
The EPM5032DC-25's windowed ceramic DIP package is favored in aerospace and military avionics applications because it supports repeated UV erasure and reprogramming during qualification, prototype development, and field upgrades. The CMOS architecture offers better radiation tolerance than bipolar PALs of equivalent logic capacity, and the device's deterministic timing (25 ns tPD, fixed setup/hold) simplifies DO-254 and MIL-HDBK-454 timing analysis. The 32 macrocells are sufficient for small avionic bus monitors, discrete-signal glue logic, and redundant-channel control state machines. Application note: aerospace programs typically require lot traceability and certificate of conformance; procure the EPM5032DC-25 from authorized Altera/Intel distributors that can provide full documentation.
Recommended
Legacy Mainframe Peripheral Boards
The EPM5032DC-25 is a recognized standard for replacing or maintaining obsolete glue logic on legacy mainframe peripheral boards where the original MAX 5000 footprint is already designed into the PCB. With 32 macrocells and 22 I/O pins, it covers typical peripheral-interface requirements: address decoding, status-register bit manipulation, interrupt-priority encoding, and DMA handshaking. The 25 ns delay budget is comfortable for the bus speeds used in legacy peripheral channels (typically 8-25 MHz). Design tip: when repairing vintage mainframes, the EPM5032DC-25 is preferred over a modern CPLD because it preserves the original timing behavior exactly, avoiding board re-validation.
Recommended
Prototype and Qualification Hardware
Engineers use the EPM5032DC-25 in prototype and qualification hardware because the windowed ceramic package allows iterative UV erasure and reprogramming without replacing the silicon, dramatically reducing iteration cost during development. The 32 macrocells fit the typical prototype scope: a single-chip glue-logic replacement for several discrete PALs, a state-machine controller, or a bus interface adapter. The 25 ns delay provides generous timing margin for prototype bring-up, where exact timing is often relaxed. Performance consideration: prototype iteration cycles can be shortened by using the Altera MAX+PLUS II design environment, which supports schematic capture, HDL entry, and direct JEDEC file generation for the EPM5032DC-25.
Recommended
Test and Measurement Equipment Glue Logic
In test and measurement instruments (oscilloscopes, logic analyzers, spectrum analyzers), the EPM5032DC-25 serves as a deterministic glue-logic device for trigger logic, channel multiplexing, and front-panel state-machine control. The 25 ns delay supports typical instrument timing budgets, while the CMOS architecture minimizes heat dissipation in densely packed instrument chassis. The 32 macrocells comfortably fit a complete front-panel state machine plus a bus decoder, allowing board-area savings versus discrete PAL implementations. Application note: when designing test equipment for long production life, consider pairing the EPM5032DC-25 with a modern MAX II CPLD on a separate sub-board for future migration while keeping the MAX 5000 in production units.
Recommended
Recommended Products Summary
Engineering reference data for EPM5032DC-25 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM5032DC-20 | EPM5032DC-15 | EPM5032DC | EPM5032DC-2 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | CDIP-28 (Windowed Ceramic DIP-28) | CDIP-28 (Windowed Ceramic DIP-28) - same | CDIP-28 (Windowed Ceramic DIP-28) - same | CDIP-28 (Windowed Ceramic DIP-28) - same | CDIP-28 (Windowed Ceramic DIP-28) - same |
| Macrocells | 32 | 32 | 32 | 32 | 32 |
| Pin-to-Pin Delay (tPD) | 25 ns | 20 ns | 15 ns | Base grade (typical 25 ns) | DC-2 grade (slower commercial) |
| Architecture | MAX 5000, PAL-Type, single LAB | MAX 5000, PAL-Type, single LAB | MAX 5000, PAL-Type, single LAB | MAX 5000, PAL-Type, single LAB | MAX 5000, PAL-Type, single LAB |
| Erasure Method | UV (windowed ceramic) | UV (windowed ceramic) | UV (windowed ceramic) | UV (windowed ceramic) | UV (windowed ceramic) |
| Technology | CMOS EPROM | CMOS EPROM | CMOS EPROM | CMOS EPROM | CMOS EPROM |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Standard 25 ns speed grade for legacy timing budgets (vs EPM5032DC-20)
- Windowed ceramic package supports UV reprogramming (vs One-time-programmable PALs (e.g., PALCE16V8))
- 32 macrocells of high-density glue logic in one package (vs Discrete PAL/SSI networks)
Design Notes
The EPM5032DC-25 operates from a single +5V supply on pin 27 (VCC). Estimated: typical CMOS quiescent current is 5-15 mA per macrocell block; at full I/O toggling at 1 MHz, expect total ICC around 80-150 mA. Decouple VCC with a 0.1 uF ceramic capacitor placed within 5 mm of the VCC pin, plus a bulk 10 uF tantalum or electrolytic on the supply rail. The device is not 5V-tolerant on legacy I/O relative to a 3.3V rail; ensure all driving logic shares the same VCC to prevent latch-up.
For socketed programming and field upgrades, mount the EPM5032DC-25 in a 28-pin DIP socket (e.g., 3M Textool or equivalent low-profile machined-pin socket). This allows easy removal for reprogramming via UV erasure. For production builds, the ceramic DIP can be soldered directly; ensure adequate thermal relief on the through-hole pads to prevent ceramic-package cracking during hand-soldering. Keep trace lengths on the clock and dedicated input pins to less than 50 mm to avoid reflections on the legacy CMOS input structure.
Common pitfalls when using the EPM5032DC-25: (1) Failing to UV-erase before reprogramming - old EPROM cells may retain partial programming that produces unexpected logic behavior; expose to UV for at least 20-30 minutes. (2) Driving I/O pins beyond VCC or below GND - legacy CMOS I/O has clamp diodes that can forward-bias and damage the device. (3) Exceeding the maximum I/O sink/source current of approximately 8 mA per pin - exceeding this can damage the output structure. (4) Mixing the -25, -20, and -15 grades on the same board without verifying timing across all three - faster grades do not behave identically to slower grades in race-sensitive designs.
The EPM5032DC-25's 25 ns pin-to-pin delay budget assumes standard CMOS load (50 pF maximum). Estimated: at 50 pF load, the output rise/fall time is approximately 4-6 ns; derate by 10% for every additional 20 pF of load. For synchronous designs, allocate the tSU (setup time) and tCO (clock-to-output) from the datasheet timing table - never assume the full 25 ns tPD is available as setup margin. Place series termination (33-68 ohm) on clock and high-speed output traces longer than 50 mm to prevent ringing on the legacy CMOS output drivers.
Compliance Information
RoHS compliance per distributor listings (ICComponents, Jotrin). Lead-free finish confirmed. REACH, halogen-free, and conflict-minerals status not explicitly stated in distributor data - marked as unknown. AEC-Q100 not applicable (PLD, not an automotive-grade IC in the modern AEC-Q sense).
