EPM570GT144C3 - MAX II 570 LE CPLD, 5.4ns, 144-TQFP | Intel
N.º da peça: EPM570GT144C3 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $22.9 | $22,90 |
| 10 | $21.85 | $218,50 |
| 100 | $18.4 | $1.840,00 |
| 500 | $15.95 | $7.975,00 |
| 1.000 | $13.5 | $13.500,00 |
EPM570GT144C3 Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device built from multiple PAL-like macrocells interconnected by a global routing interconnect. It occupies a position in the programmable logic hierarchy between discrete logic gates (smallest) and FPGAs (largest and highest-density), offering deterministic timing, instant-on operation from on-chip flash, and high-drive I/O suitable for bus-interface and control-plane tasks. MAX II devices specifically combine the lowest static power of any CPLD family with non-volatile storage and a built-in user flash memory block for system housekeeping data.
Key features of the EPM570GT144C3 include 440 macrocells, 76 user-available I/Os in the 144-pin TQFP package, MultiVolt I/O support (1.5V, 1.8V, 2.5V, 3.3V mixed-voltage interfaces), 1.8V core supply with on-chip voltage regulator, JTAG-based IEEE 1149.1 in-system programmability (ISP), and a built-in UFM block (8 Kbits) that can store user data such as serial numbers, configuration parameters, or boot code. The device consumes as little as 35 µA of standby current in power-saving modes.
Architecturally, the MAX II device combines a non-volatile flash configuration cell with a volatile SRAM-based logic fabric, where each Logic Element contains a 4-input look-up table (LUT), a programmable register, and a carry chain for arithmetic. The flash cell holds the configuration permanently, eliminating the need for an external boot PROM and enabling instant-on operation within microseconds of power-up. The MultiVolt I/O banks allow direct interfacing to 1.5V, 1.8V, 2.5V, and 3.3V logic without external level shifters.
Typical applications include bus-interface bridging (PCI to local bus, I2C to SPI), power-sequencer and supervisory logic for FPGA-based systems, address decoding and glue logic in microcontroller designs, industrial control and factory automation, and consumer electronics requiring low-cost, low-power programmable logic. The 144-pin TQFP package is suitable for hand-solderable prototypes and low-volume through-hole-friendly manufacturing, as opposed to the FineLine BGA variants used in high-density portable designs.
When designing with the EPM570GT144C3, plan for the Quartus Prime design suite (MAX II device support) and verify that I/O bank voltage assignments match the connected logic rails; misuse of MultiVolt banks is the most common cause of CPLD I/O failures during bring-up. The 5.4 ns tPD1 figure is sufficient for sub-200 MHz glue-logic applications but should be derated against temperature for worst-case timing closure.
Alternativas drop-in para EPM570GT144C3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM570GT144C3 (mesmo formato e footprint) — diferindo em Package, Programming Interface, Operating Temperature, Process Technology, User Flash Memory (UFM).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM570GT144C5N
✅ Drop-In✓ Em estoque
$14.2 / unidade
Ver ficha técnica →EPM570GT144I5N
✅ Drop-In✓ Em estoque
$14.85 / unidade
Ver ficha técnica →EPM570GT144C3N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$28.95 / unidade
Ver ficha técnica →EPM570GT144C4N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$22.5 / unidade
Ver ficha técnica →EPM570GT144C3 Classificações máximas e características elétricas
| Family | MAX II |
| Logic Elements (LEs) | 570 |
| Equivalent Macrocells | 440 |
| User I/O Count | 76 (max, package-dependent) |
| Pin-to-Pin Propagation Delay (tPD1) | 5.4 ns (commercial, fastest speed grade) |
| User Flash Memory (UFM) | 8 Kbits (8,192 bits) |
| Core Supply Voltage | 1.8 V (internal regulator from VCCINT 3.3 V) |
| I/O Supply Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Temperatura de operação | 0 °C to +85 °C (commercial, C3 grade) |
| Encapsulamento | 144-pin TQFP (GT144) |
| Tipo de montagem | Surface Mount |
| Process Technology | 0.30 µm 6-layer-metal flash CMOS |
| Configuration Method | Non-volatile on-chip flash (instant-on) |
| Programming Interface | JTAG IEEE 1149.1 (ISP) |
| Status RoHS | Compliant |
| Nível MSL | MSL 3 (per JEDEC J-STD-020) |
Configuração de pinos do EPM570GT144C3
| Pino 1 | I/O — User I/O (bank 1) |
| Pino 2 | I/O — User I/O (bank 1) |
| Pino 3 | I/O — User I/O (bank 1) |
| Pino 4 | I/O — User I/O (bank 1) |
| Pino 5 | I/O — User I/O (bank 1) |
| Pino 6 | I/O — User I/O (bank 1) |
| Pino 7 | I/O — User I/O (bank 1) |
| Pino 8 | VCCIO1 — I/O bank 1 supply voltage (1.5/1.8/2.5/3.3V) |
| Pino 9 | I/O — User I/O (bank 1) |
| Pino 10 | I/O — User I/O (bank 1) |
| Pino 11 | I/O — User I/O (bank 1) |
| Pino 12 | I/O — User I/O (bank 1) |
| Pino 13 | I/O — User I/O (bank 2) |
| Pino 14 | I/O — User I/O (bank 2) |
| Pino 15 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 16 | I/O — User I/O (bank 2) |
| Pino 17 | I/O — User I/O (bank 2) |
| Pino 18 | I/O — User I/O (bank 2) |
| Pino 19 | I/O — User I/O (bank 2) |
| Pino 20 | I/O — User I/O (bank 2) |
| Pino 21 | I/O — User I/O (bank 2) |
| Pino 22 | I/O — User I/O (bank 2) |
| Pino 23 | I/O — User I/O (bank 2) |
| Pino 24 | I/O — User I/O (bank 2) |
| Pino 25 | I/O — User I/O (bank 2) |
| Pino 26 | I/O — User I/O (bank 2) |
| Pino 27 | I/O — User I/O (bank 3) |
| Pino 28 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 29 | I/O — User I/O (bank 3) |
| Pino 30 | I/O — User I/O (bank 3) |
| Pino 31 | I/O — User I/O (bank 3) |
| Pino 32 | I/O — User I/O (bank 3) |
| Pino 33 | I/O — User I/O (bank 3) |
| Pino 34 | I/O — User I/O (bank 3) |
| Pino 35 | I/O — User I/O (bank 3) |
| Pino 36 | I/O — User I/O (bank 3) |
| Pino 37 | VCCINT — Core analog 3.3V supply |
| Pino 38 | GND — Ground |
| Pino 39 | I/O — User I/O (bank 4) |
| Pino 40 | I/O — User I/O (bank 4) |
| Pino 41 | I/O — User I/O (bank 4) |
| Pino 42 | I/O — User I/O (bank 4) |
| Pino 43 | I/O — User I/O (bank 4) |
| Pino 44 | I/O — User I/O (bank 4) |
| Pino 45 | I/O — User I/O (bank 4) |
| Pino 46 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 47 | I/O — User I/O (bank 4) |
| Pino 48 | I/O — User I/O (bank 4) |
| Pino 49 | I/O — User I/O (bank 4) |
| Pino 50 | I/O — User I/O (bank 4) |
| Pino 51 | I/O — User I/O (bank 4) |
| Pino 52 | I/O — User I/O (bank 4) |
| Pino 53 | I/O — User I/O (bank 4) |
| Pino 54 | I/O — User I/O (bank 4) |
| Pino 55 | I/O — User I/O (bank 4) |
| Pino 56 | I/O — User I/O (bank 4) |
| Pino 57 | I/O — User I/O (bank 4) |
| Pino 58 | I/O — User I/O (bank 4) |
| Pino 59 | I/O — User I/O (bank 4) |
| Pino 60 | I/O — User I/O (bank 4) |
| Pino 61 | I/O — User I/O (bank 4) |
| Pino 62 | I/O — User I/O (bank 4) |
| Pino 63 | I/O — User I/O (bank 4) |
| Pino 64 | I/O — User I/O (bank 4) |
| Pino 65 | I/O — User I/O (bank 4) |
| Pino 66 | I/O — User I/O (bank 4) |
| Pino 67 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 68 | I/O — User I/O (bank 4) |
| Pino 69 | I/O — User I/O (bank 4) |
| Pino 70 | I/O — User I/O (bank 4) |
| Pino 71 | I/O — User I/O (bank 4) |
| Pino 72 | I/O — User I/O (bank 4) |
| Pino 73 | TDI — JTAG Test Data In |
| Pino 74 | TCK — JTAG Test Clock |
| Pino 75 | TMS — JTAG Test Mode Select |
| Pino 76 | nCONFIG — Configuration start (active low) |
| Pino 77 | I/O — User I/O (bank 3) |
| Pino 78 | I/O — User I/O (bank 3) |
| Pino 79 | I/O — User I/O (bank 3) |
| Pino 80 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 81 | I/O — User I/O (bank 3) |
| Pino 82 | I/O — User I/O (bank 3) |
| Pino 83 | I/O — User I/O (bank 3) |
| Pino 84 | I/O — User I/O (bank 3) |
| Pino 85 | I/O — User I/O (bank 3) |
| Pino 86 | I/O — User I/O (bank 3) |
| Pino 87 | I/O — User I/O (bank 3) |
| Pino 88 | I/O — User I/O (bank 3) |
| Pino 89 | I/O — User I/O (bank 3) |
| Pino 90 | I/O — User I/O (bank 3) |
| Pino 91 | GND — Ground |
| Pino 92 | I/O — User I/O (bank 2) |
| Pino 93 | I/O — User I/O (bank 2) |
| Pino 94 | I/O — User I/O (bank 2) |
| Pino 95 | I/O — User I/O (bank 2) |
| Pino 96 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 97 | I/O — User I/O (bank 2) |
| Pino 98 | I/O — User I/O (bank 2) |
| Pino 99 | I/O — User I/O (bank 2) |
| Pino 100 | I/O — User I/O (bank 2) |
| Pino 101 | I/O — User I/O (bank 2) |
| Pino 102 | I/O — User I/O (bank 2) |
| Pino 103 | I/O — User I/O (bank 2) |
| Pino 104 | I/O — User I/O (bank 2) |
| Pino 105 | I/O — User I/O (bank 2) |
| Pino 106 | I/O — User I/O (bank 2) |
| Pino 107 | I/O — User I/O (bank 2) |
| Pino 108 | I/O — User I/O (bank 1) |
| Pino 109 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 110 | I/O — User I/O (bank 1) |
| Pino 111 | I/O — User I/O (bank 1) |
| Pino 112 | I/O — User I/O (bank 1) |
| Pino 113 | I/O — User I/O (bank 1) |
| Pino 114 | I/O — User I/O (bank 1) |
| Pino 115 | I/O — User I/O (bank 1) |
| Pino 116 | I/O — User I/O (bank 1) |
| Pino 117 | I/O — User I/O (bank 1) |
| Pino 118 | CONF_DONE — Configuration done (open drain) |
| Pino 119 | nSTATUS — Configuration status (open drain) |
| Pino 120 | TDO — JTAG Test Data Out |
| Pino 121 | I/O — User I/O (bank 1) |
| Pino 122 | I/O — User I/O (bank 1) |
| Pino 123 | I/O — User I/O (bank 1) |
| Pino 124 | I/O — User I/O (bank 1) |
| Pino 125 | I/O — User I/O (bank 1) |
| Pino 126 | I/O — User I/O (bank 1) |
| Pino 127 | I/O — User I/O (bank 1) |
| Pino 128 | I/O — User I/O (bank 1) |
| Pino 129 | I/O — User I/O (bank 1) |
| Pino 130 | I/O — User I/O (bank 1) |
| Pino 131 | I/O — User I/O (bank 1) |
| Pino 132 | VCCINT — Core analog 3.3V supply |
| Pino 133 | I/O — User I/O (bank 1) |
| Pino 134 | I/O — User I/O (bank 1) |
| Pino 135 | GND — Ground |
| Pino 136 | I/O — User I/O (bank 1) |
| Pino 137 | I/O — User I/O (bank 1) |
| Pino 138 | I/O — User I/O (bank 1) |
| Pino 139 | I/O — User I/O (bank 1) |
| Pino 140 | I/O — User I/O (bank 1) |
| Pino 141 | I/O — User I/O (bank 1) |
| Pino 142 | I/O — User I/O (bank 1) |
| Pino 143 | I/O — User I/O (bank 1) |
| Pino 144 | I/O — User I/O (bank 1) |
Aplicações típicas
EPM570GT144C3 é adequado para 7 aplicaçãos: Bus Interface Bridging and Glue Logic, FPGA Configuration and Power Sequencing, Industrial Control and Factory Automation, Consumer Electronics and Display Control, LED Display and Signage Controllers, Test & Measurement and Instrumentation Front-Ends, Automotive Body Electronics (Non-Safety).
Bus Interface Bridging and Glue Logic
The EPM570GT144C3 is widely used for bus-to-bus bridging between disparate interfaces such as PCI to local bus, I2C to SPI, parallel SRAM to asynchronous peripherals, or custom legacy buses to modern microcontrollers. The 76 user I/Os in the GT144 package provide ample headroom for 16-bit and 32-bit data buses plus address and control signals. MultiVolt I/O support (1.5V / 1.8V / 2.5V / 3.3V) lets a single CPLD bridge between mixed-voltage domains without external level shifters, while the 5.4 ns tPD1 guarantees deterministic timing for protocol translation tasks such as address decoding and chip-select generation in 50-100 MHz systems. The non-volatile flash configuration ensures instant-on behavior critical for bus-arbitration and reset-vector logic.
Recomendado
FPGA Configuration and Power Sequencing
The EPM570GT144C3 is commonly deployed as a configuration supervisor and power-sequencer for larger FPGAs such as Cyclone IV/V or Stratix families. It can store board identity, MAC address, and calibration data in the 8 Kbit user flash memory, then drive the FPGA's nCONFIG, nSTATUS, and CONF_DONE signals through a deterministic state machine. The 35 µA standby current preserves battery life in always-on sequencing logic, and the instant-on flash configuration eliminates the cold-boot delay that volatile FPGAs exhibit without an external boot PROM. The 5.4 ns tPD1 supports multi-rail sequencing for FPGAs that require precise rail-to-rail timing margins during power-up.
Recomendado
Industrial Control and Factory Automation
In factory-automation and PLC architectures, the EPM570GT144C3 serves as deterministic glue logic for motor-control signal conditioning, encoder interfacing, and safety-critical interlock decoding. The 570 LEs accommodate medium-complexity state machines for protocol conversion (EtherCAT, Profibus, Modbus) and the 76 I/Os support multi-axis control loops. While the EPM570GT144C3 itself is commercial-grade (0 °C to +85 °C), designs requiring wider temperature ranges can drop in the EPM570GT144I5N variant. The flash-based non-volatile configuration is robust against industrial EMI events that would otherwise corrupt volatile SRAM FPGAs, and the low static power simplifies thermal management in sealed enclosures.
Recomendado
Consumer Electronics and Display Control
Consumer devices such as digital cameras, set-top boxes, e-readers, and household appliances leverage the EPM570GT144C3 for display timing generation, button-matrix scanning, and standby-controller logic. The instant-on flash configuration eliminates the visible delay that volatile FPGAs exhibit at power-on, and the 35 µA standby current preserves battery life in always-listening remote controls. The MultiVolt I/O bank lets the CPLD directly interface 1.8V image sensors, 3.3V display drivers, and 5V legacy peripherals from a single chip. The 144-pin TQFP package is hand-solderable for prototype and low-volume manufacturing, accelerating consumer-product development cycles.
Recomendado
LED Display and Signage Controllers
The EPM570GT144C3 excels as a scan-controller for LED matrix displays, scrolling signs, and architectural lighting fixtures where deterministic refresh timing is critical. The 5.4 ns tPD1 enables high-MHz PWM generation for color-mixing LED drivers, and the 76 I/Os drive multiplexed row/column drivers for 8x8 to 16x32 RGB matrices without external buffers. The 8 Kbit UFM stores calibration data, brightness curves, and gamma tables for uniform panel appearance. The flash-based non-volatile configuration retains display patterns across power cycles, an advantage over microcontrollers that lose RAM state on brown-out.
Recomendado
Test & Measurement and Instrumentation Front-Ends
Benchtop instruments and ATE (Automatic Test Equipment) use the EPM570GT144C3 as a flexible pattern generator, multiplexer controller, or trigger-arming logic. The 570 LEs implement arbitrary stimulus sequencing with sub-10 ns edge accuracy, and the MultiVolt I/O interfaces directly to 1.5V LVDS drivers, 3.3V CMOS ADC front-ends, and 5V legacy instrumentation buses. The on-chip UFM stores calibration constants and test-pattern libraries. Designers can use Quartus Prime to recompile the CPLD in minutes when a new test sequence is needed - faster and cheaper than respinning a microcontroller PCB or building discrete TTL logic.
Recomendado
Automotive Body Electronics (Non-Safety)
While the EPM570GT144C3 itself is commercial-grade and not AEC-Q100 qualified, it serves as a cost-effective development platform for automotive body-electronics prototypes such as body-control modules, mirror controllers, and HVAC switch-matrix decoders. Engineers can validate the design on the commercial part, then migrate to the EPM570GT144I5N or equivalent industrial-temperature variant for low-volume production. The 5.4 ns tPD1 supports CAN-bus interface glue logic, and the 76 I/Os accommodate multi-channel switch-matrix decoding for HVAC controls and body-control networks. The non-volatile flash configuration eliminates cold-start delays that would otherwise be perceptible to the driver.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM570GT144C3 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM570GT144C5N | EPM570GT144I5N | EPM570GT144C3N | EPM570GT144C4N |
|---|---|---|---|---|---|
| Package | 144-pin TQFP (GT144) | 144-pin TQFP (GT144) - same | 144-pin TQFP (GT144) - same | 144-pin TQFP (GT144) - same | 144-pin TQFP (GT144) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements (LEs) | 570 | 570 | 570 | 570 | 570 |
| Equivalent Macrocells | 440 | 440 | 440 | 440 | 440 |
| tPD1 (Pin-to-Pin Delay) | 5.4 ns | 7.5 ns (slower) | 7.5 ns (slower) | 5.4 ns (identical) | ~6.5 ns (intermediate) |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Operating Temperature Range | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| Lead-Free Finish | Standard finish (verify per lot) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
Principais diferenciais
- Fastest commercial speed grade in the MAX II 570 LE family (vs EPM570GT144C5N)
- Instant-on non-volatile flash configuration eliminates boot delay (vs SRAM-based small FPGAs (e.g. Cyclone family))
- MultiVolt I/O banks support 1.5V/1.8V/2.5V/3.3V mixed-voltage interfacing (vs Single-voltage competitor CPLDs)
Notas de projeto
The EPM570GT144C3 requires a stable 3.3V supply on VCCINT pins (multiple pins on the GT144 package) plus 1.5V/1.8V/2.5V/3.3V on each VCCIO bank. Bulk-decouple each VCCINT pin with a 1µF ceramic plus 0.1µF high-frequency bypass within 5mm of the pin, and add a 10µF tantalum bulk cap near the regulator. The internal 1.8V core regulator does not require external capacitance, but power-rail sequencing should ensure VCCINT rises monotonically without glitches - if the host MCU and CPLD power up simultaneously, use a power-good signal from the regulator to gate the CPLD's nCONFIG pin until VCCINT is stable.
Place all VCCINT and VCCIO decoupling capacitors as close as possible to their respective pins on the top layer with short, wide traces to the power plane. For the 144-pin TQFP (GT144), route JTAG signals (TDI, TMS, TCK, TDO) away from switching I/O to avoid noise coupling during ISP programming. Add a 4.7kΩ pull-up on nCONFIG and nSTATUS, and a 10kΩ pull-up on CONF_DONE if open-drain operation is required. The TQFP thermal pad (if any) should be soldered to a small ground copper pour to improve thermal dissipation.
Common pitfalls: (1) Setting all four VCCIO banks to 3.3V when one bank interfaces to 1.5V logic - this can damage the I/O cells; (2) Forgetting to instantiate the JTAG user code in the Quartus Prime .SOF/.POF and then trying to program in-system - yields 'JTAG chain failure'; (3) Driving the JTAG TDI/TMS/TCK lines from a long cable without proper buffering - causes ISP failures; (4) Mixing commercial and industrial grade parts on the same PCB - the timing models differ and will not interchange. Always validate AC timing with the Quartus Prime TimeQuest timing analyzer at the worst-case temperature corner before taping out the PCB.
When driving high-speed buses (>50 MHz) from the EPM570GT144C3 I/O, enable Quartus Prime's near-end and far-end I/O timing analysis and check the IBIS model for the specific speed grade. The 5.4 ns tPD1 figure (C3 grade) is the pin-to-pin delay through the logic fabric only; I/O buffer delays and PCB trace delays must be subtracted to find the actual system margin. For multi-MHz buses, add source-series termination (typically 22-33Ω) close to the CPLD output to dampen reflections on long traces.
Informações de conformidade
RoHS compliant per Intel/Altera product page. Not AEC-Q100 qualified - for automotive designs, migrate to industrial-grade EPM570GT144I5N or AEC-Q100-qualified MAX 10 CPLDs. Lead-free finish standard.
