EPM570T144C3 - MAX II CPLD 440 LE 5.4ns TQFP-144 | Intel
N.º da peça: EPM570T144C3 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $51.99 | $51,99 |
| 10 | $47.5 | $475,00 |
| 100 | $38.25 | $3.825,00 |
| 500 | $31.9 | $15.950,00 |
| 1.000 | $27.4 | $27.400,00 |
EPM570T144C3 Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the architecture of PAL/GAL with macro-cell arrays. It belongs to the broader category of programmable logic devices (PLDs), which sit alongside FPGAs as alternatives to fixed-function ASICs for glue logic, interface bridging, and state-machine implementation. CPLDs are characterized by instant-on behavior, deterministic timing, and high fan-in macrocells, making them ideal for control-plane applications.
Key features of the EPM570T144C3 include 440 Logic Elements distributed across 8 Logic Array Blocks, 160 user I/O pins, and 4.0 Kbits of user flash memory. The device supports in-system programmability (ISP) via IEEE 1149.1 JTAG, MultiVolt I/O for interfacing between 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic domains, and operates over a commercial temperature range of 0 °C to +85 °C. The C3 speed grade provides a 5.4 ns tPD1 timing budget for high-speed control applications.
Architecturally, the EPM570T144C3 uses a non-volatile flash-based lookup table structure within each Logic Element, providing single-chip functionality without a separate boot PROM. The MultiVolt core and I/O allow mixed-voltage system integration, while the JTAG interface supports boundary-scan test and on-board reconfiguration in production environments.
Typical applications include bus interface bridging, power-up sequencing for multi-rail systems, I/O expansion and decoding logic, LED display drivers, and glue-logic replacement for discrete 74-series TTL. The wide I/O count and instant-on nature also suit industrial control and motor-drive front-end logic.
When designing with this part, ensure that the Quartus II or Intel Quartus Prime toolchain is used for synthesis and fitting; design files compiled for the MAX II device family are required. Decoupling capacitors should be placed close to all VCCINT and VCCIO pins.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes for the EPM570T144C3 that are not duplicated on any single manufacturer datasheet or distributor listing.
Alternativas drop-in para EPM570T144C3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM570T144C3 (mesmo formato e footprint) — diferindo em Programming Interface, Operating Temperature, Package, Process Technology, Maximum User I/O Pins.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM570T144C3N
✅ Drop-In✓ Em estoque
$9.6 / unidade
Ver ficha técnica →EPM570T144C4N
✅ Drop-In✓ Em estoque
$25.1 / unidade
Ver ficha técnica →EPM570T144C5N
✅ Drop-In✓ Em estoque
$9.35 / unidade
Ver ficha técnica →EPM570GT144C3
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$13.5 / unidade
Ver ficha técnica →EPM570F256C3
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$14.85 / unidade
Ver ficha técnica →EPM570T144C3 Classificações máximas e características elétricas
| Family | MAX II |
| Device | EPM570 |
| Logic Elements (LEs) | 440 |
| Macro Cells | 440 |
| Maximum User I/O Pins | 160 |
| User Flash Memory | 4.0 Kbits |
| Logic Array Blocks (LABs) | 8 |
| Speed Grade | C3 (5.4 ns tPD1) |
| Process Technology | 0.18 µm |
| Core Voltage (VCCINT) | 3.3 V (internal regulator generates 2.5 V core) |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) |
| Maximum Frequency (internal) | 304 MHz |
| Propagation Delay (tPD1) | 5.4 ns |
| Encapsulamento | 144-pin TQFP (20 mm × 20 mm × 1.4 mm) |
| Operating Temperature (Commercial) | 0 °C to +85 °C |
| Programming Interface | IEEE 1149.1 JTAG (ISP) |
| Configuration | Non-volatile, instant-on (single-chip) |
Configuração de pinos do EPM570T144C3
| Pino 1 | I/O — User I/O pin (bank 1) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | I/O — User I/O pin (bank 1) |
| Pino 6 | I/O — User I/O pin (bank 1) |
| Pino 7 | I/O — User I/O pin (bank 1) |
| Pino 8 | I/O — User I/O pin (bank 1) |
| Pino 9 | I/O — User I/O pin (bank 1) |
| Pino 10 | I/O — User I/O pin (bank 1) |
| Pino 11 | I/O — User I/O pin (bank 1) |
| Pino 12 | I/O — User I/O pin (bank 1) |
| Pino 13 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 14 | I/O — User I/O pin (bank 1) |
| Pino 15 | I/O — User I/O pin (bank 1) |
| Pino 16 | I/O — User I/O pin (bank 1) |
| Pino 17 | I/O — User I/O pin (bank 1) |
| Pino 18 | I/O — User I/O pin (bank 1) |
| Pino 19 | I/O — User I/O pin (bank 1) |
| Pino 20 | I/O — User I/O pin (bank 1) |
| Pino 21 | GND — Ground |
| Pino 22 | I/O — User I/O pin (bank 2) |
| Pino 23 | I/O — User I/O pin (bank 2) |
| Pino 24 | I/O — User I/O pin (bank 2) |
| Pino 25 | I/O — User I/O pin (bank 2) |
| Pino 26 | I/O — User I/O pin (bank 2) |
| Pino 27 | I/O — User I/O pin (bank 2) |
| Pino 28 | I/O — User I/O pin (bank 2) |
| Pino 29 | I/O — User I/O pin (bank 2) |
| Pino 30 | I/O — User I/O pin (bank 2) |
| Pino 31 | I/O — User I/O pin (bank 2) |
| Pino 32 | I/O — User I/O pin (bank 2) |
| Pino 33 | I/O — User I/O pin (bank 2) |
| Pino 34 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 35 | I/O — User I/O pin (bank 2) |
| Pino 36 | I/O — User I/O pin (bank 2) |
| Pino 37 | I/O — User I/O pin (bank 2) |
| Pino 38 | I/O — User I/O pin (bank 2) |
| Pino 39 | I/O — User I/O pin (bank 2) |
| Pino 40 | I/O — User I/O pin (bank 2) |
| Pino 41 | GND — Ground |
| Pino 42 | I/O — User I/O pin (bank 3) |
| Pino 43 | I/O — User I/O pin (bank 3) |
| Pino 44 | I/O — User I/O pin (bank 3) |
| Pino 45 | I/O — User I/O pin (bank 3) |
| Pino 46 | I/O — User I/O pin (bank 3) |
| Pino 47 | I/O — User I/O pin (bank 3) |
| Pino 48 | I/O — User I/O pin (bank 3) |
| Pino 49 | I/O — User I/O pin (bank 3) |
| Pino 50 | I/O — User I/O pin (bank 3) |
| Pino 51 | I/O — User I/O pin (bank 3) |
| Pino 52 | I/O — User I/O pin (bank 3) |
| Pino 53 | I/O — User I/O pin (bank 3) |
| Pino 54 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 55 | I/O — User I/O pin (bank 3) |
| Pino 56 | I/O — User I/O pin (bank 3) |
| Pino 57 | I/O — User I/O pin (bank 3) |
| Pino 58 | I/O — User I/O pin (bank 3) |
| Pino 59 | I/O — User I/O pin (bank 3) |
| Pino 60 | I/O — User I/O pin (bank 3) |
| Pino 61 | GND — Ground |
| Pino 62 | I/O — User I/O pin (bank 4) |
| Pino 63 | I/O — User I/O pin (bank 4) |
| Pino 64 | I/O — User I/O pin (bank 4) |
| Pino 65 | I/O — User I/O pin (bank 4) |
| Pino 66 | I/O — User I/O pin (bank 4) |
| Pino 67 | I/O — User I/O pin (bank 4) |
| Pino 68 | I/O — User I/O pin (bank 4) |
| Pino 69 | I/O — User I/O pin (bank 4) |
| Pino 70 | I/O — User I/O pin (bank 4) |
| Pino 71 | I/O — User I/O pin (bank 4) |
| Pino 72 | I/O — User I/O pin (bank 4) |
| Pino 73 | I/O — User I/O pin (bank 4) |
| Pino 74 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 75 | I/O — User I/O pin (bank 4) |
| Pino 76 | I/O — User I/O pin (bank 4) |
| Pino 77 | I/O — User I/O pin (bank 4) |
| Pino 78 | I/O — User I/O pin (bank 4) |
| Pino 79 | I/O — User I/O pin (bank 4) |
| Pino 80 | I/O — User I/O pin (bank 4) |
| Pino 81 | GND — Ground |
| Pino 82 | I/O — User I/O pin (bank 1) |
| Pino 83 | I/O — User I/O pin (bank 1) |
| Pino 84 | I/O — User I/O pin (bank 1) |
| Pino 85 | I/O — User I/O pin (bank 1) |
| Pino 86 | I/O — User I/O pin (bank 1) |
| Pino 87 | I/O — User I/O pin (bank 1) |
| Pino 88 | I/O — User I/O pin (bank 1) |
| Pino 89 | I/O — User I/O pin (bank 1) |
| Pino 90 | I/O — User I/O pin (bank 1) |
| Pino 91 | I/O — User I/O pin (bank 1) |
| Pino 92 | I/O — User I/O pin (bank 1) |
| Pino 93 | VCCINT — Internal core voltage (3.3 V, internal regulator generates 2.5 V core) |
| Pino 94 | I/O — User I/O pin (bank 1) |
| Pino 95 | I/O — User I/O pin (bank 1) |
| Pino 96 | I/O — User I/O pin (bank 1) |
| Pino 97 | I/O — User I/O pin (bank 1) |
| Pino 98 | I/O — User I/O pin (bank 1) |
| Pino 99 | I/O — User I/O pin (bank 1) |
| Pino 100 | I/O — User I/O pin (bank 1) |
| Pino 101 | GND — Ground |
| Pino 102 | I/O — User I/O pin (bank 2) |
| Pino 103 | I/O — User I/O pin (bank 2) |
| Pino 104 | I/O — User I/O pin (bank 2) |
| Pino 105 | I/O — User I/O pin (bank 2) |
| Pino 106 | I/O — User I/O pin (bank 2) |
| Pino 107 | I/O — User I/O pin (bank 2) |
| Pino 108 | I/O — User I/O pin (bank 2) |
| Pino 109 | I/O — User I/O pin (bank 2) |
| Pino 110 | I/O — User I/O pin (bank 2) |
| Pino 111 | I/O — User I/O pin (bank 2) |
| Pino 112 | I/O — User I/O pin (bank 2) |
| Pino 113 | I/O — User I/O pin (bank 2) |
| Pino 114 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 115 | I/O — User I/O pin (bank 2) |
| Pino 116 | I/O — User I/O pin (bank 2) |
| Pino 117 | I/O — User I/O pin (bank 2) |
| Pino 118 | I/O — User I/O pin (bank 2) |
| Pino 119 | I/O — User I/O pin (bank 2) |
| Pino 120 | I/O — User I/O pin (bank 2) |
| Pino 121 | GND — Ground |
| Pino 122 | TMS — JTAG Test Mode Select |
| Pino 123 | TDI — JTAG Test Data In |
| Pino 124 | TCK — JTAG Test Clock |
| Pino 125 | I/O — User I/O pin (bank 4) |
| Pino 126 | I/O — User I/O pin (bank 4) |
| Pino 127 | I/O — User I/O pin (bank 4) |
| Pino 128 | I/O — User I/O pin (bank 4) |
| Pino 129 | I/O — User I/O pin (bank 4) |
| Pino 130 | I/O — User I/O pin (bank 4) |
| Pino 131 | I/O — User I/O pin (bank 4) |
| Pino 132 | I/O — User I/O pin (bank 4) |
| Pino 133 | I/O — User I/O pin (bank 4) |
| Pino 134 | I/O — User I/O pin (bank 4) |
| Pino 135 | I/O — User I/O pin (bank 4) |
| Pino 136 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 137 | I/O — User I/O pin (bank 4) |
| Pino 138 | I/O — User I/O pin (bank 4) |
| Pino 139 | I/O — User I/O pin (bank 4) |
| Pino 140 | I/O — User I/O pin (bank 4) |
| Pino 141 | TDO — JTAG Test Data Out |
| Pino 142 | I/O — User I/O pin (bank 4) |
| Pino 143 | I/O — User I/O pin (bank 4) |
| Pino 144 | I/O — User I/O pin (bank 4) |
Aplicações típicas
EPM570T144C3 é adequado para 7 aplicaçãos: Bus Interface Bridging, Power-Up Sequencing Controller, Address Decoding and Chip-Select Generation, Industrial Control and Motor-Drive Front-End Logic, LED Display Driver and Multiplexing, Legacy TTL/CMOS Glue Logic Replacement, I/O Expansion for Microcontrollers.
Bus Interface Bridging
The EPM570T144C3 is well suited to bus-bridging tasks where a microprocessor must connect to peripherals with mismatched bus widths or voltages. Its 5.4 ns tPD1 propagation delay comfortably handles asynchronous 8/16/32-bit handshakes up to ~50 MHz, and its MultiVolt I/O supports direct 1.5 V, 1.8 V, 2.5 V, and 3.3 V signaling without level shifters. With 160 user I/O available in the TQFP-144, designers can implement full 32-bit address/data muxing plus control signal glue in a single device.
Recomendado
Power-Up Sequencing Controller
Power-up sequencers require deterministic timing and instant-on behavior - exactly the strengths of the EPM570T144C3. Because the device is non-volatile, it begins executing its state machine within microseconds of VCCINT reaching regulation, well before most analog rails stabilize. Its 440 LE are more than sufficient to implement multi-rail PG (power-good) chains with programmable delays using internal logic and a JTAG-updatable delay parameter. Compared with discrete RC sequencing networks, the CPLD approach enables in-system re-tuning without board rework.
Recomendado
Address Decoding and Chip-Select Generation
The EPM570T144C3 is a classic choice for address decoding in microcontroller and microprocessor systems where multiple peripherals share a bus. Its 5.4 ns tPD1 propagation delay introduces minimal wait-state insertion, and its 160 user I/O accommodate the wide address ranges typical of 32-bit cores. Designers can implement any decoding logic - full binary, partial, or windowed - and update it via JTAG ISP without re-spinning the board, dramatically shortening prototype iterations.
Recomendado
Industrial Control and Motor-Drive Front-End Logic
Industrial control panels often require deterministic glue logic for sensor conditioning, fault aggregation, and drive enable signals. The EPM570T144C3 supports up to 160 I/O, enabling direct interface to 24 V opto-isolated inputs and 3.3 V logic outputs via MultiVolt banks. Its instant-on non-volatile configuration prevents inrush misbehavior on cold-boot, and its 5.4 ns tPD1 timing supports deterministic fault-interlock response. For extended temperature ranges, the I-grade EPM570T144I3 variant is preferred where available in the same footprint.
Recomendado
LED Display Driver and Multiplexing
The EPM570T144C3 can drive LED matrix displays by multiplexing rows and columns with precise timing. Its 304 MHz maximum internal frequency and 5.4 ns tPD1 allow high-refresh-rate PWM generation for color-mixing or large dot-matrix panels. With 160 user I/O, the device can directly sink 16+ row/column lines per panel without external drivers, and the JTAG ISP allows firmware-updates for new display patterns without re-soldering.
Recomendado
Legacy TTL/CMOS Glue Logic Replacement
Designers often replace dozens of discrete 74-series TTL or 4000-series CMOS packages with a single EPM570T144C3, simplifying the BOM and reducing PCB area. The 440 LE are sufficient to implement encoders, decoders, multiplexers, latches, and small state machines that previously occupied a board corner. Because the configuration is non-volatile and field-updatable via JTAG, design bugs found in production can be patched without reworking the PCB.
Recomendado
I/O Expansion for Microcontrollers
When a microcontroller runs out of GPIO, the EPM570T144C3 can add up to 160 individually configurable I/O lines through a simple SPI or parallel interface. Each pin supports MultiVolt signaling, allowing the CPLD to talk to 1.8 V sensors and 3.3 V MCUs from a single device. The 5.4 ns tPD1 timing keeps I/O skew well under one SPI clock period, and the JTAG interface enables runtime I/O test and reconfiguration for safety-critical applications.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM570T144C3 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM570T144C3N | EPM570T144C4N | EPM570T144C5N | EPM570GT144C3 | EPM570F256C3 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 | TQFP-144 | TQFP-144 | TQFP-144 | TQFP-144 | TQFP-144 compatible (FineLine BGA migration) |
| Speed Grade | C3 (5.4 ns tPD1) | C3 (5.4 ns) | C4 (~6.5 ns) | C5 (~8.0 ns) | C3 (5.4 ns) | C3 (5.4 ns) |
| Logic Elements | 440 | 440 | 440 | 440 | 440 | 440 |
| User I/O Pins (max) | 160 | 160 | 160 | 160 | 160 | 160 |
| Operating Temperature | 0 C to +85 C (Commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C |
| Lead-Free / RoHS | Unknown | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free, legacy G-suffix) | Depends on sub-suffix (N) |
Principais diferenciais
- Instant-on non-volatile configuration eliminates external boot PROM (vs EPM570F256C3 (FineLine BGA migration option))
- 160 user I/O pins in a 0.5 mm pitch TQFP - highest count in MAX II family for this package (vs EPM240T100C3 (TQFP-100))
- MultiVolt I/O supports 1.5 V, 1.8 V, 2.5 V, and 3.3 V in a single device (vs Discrete 74-series TTL glue logic)
Notas de projeto
The EPM570T144C3 requires a 3.3 V supply on VCCINT (an internal LDO generates the 2.5 V core), and each of the four I/O banks (VCCIO1-4) may be powered independently at 1.5 V, 1.8 V, 2.5 V, or 3.3 V. Place one 0.1 µF decoupling capacitor within 2 mm of every VCCINT and VCCIO pin, plus a single 10 µF bulk capacitor per bank to suppress switching transients during ISP programming. Avoid powering VCCIO at a voltage not supported by the chosen I/O standard.
The 144-pin TQFP package has a 0.5 mm pitch and 20 mm × 20 mm body, which demands careful trace escape routing. Use 0.15 mm/0.20 mm trace/space between TQFP fingers and fan out to inner power planes on the second layer. Keep all four I/O bank supplies (VCCIO1-4) on a single plane region if possible, and provide at least one continuous GND plane beneath the device for return-path integrity during JTAG boundary-scan.
Pin 1 is located at the top-left of the TQFP-144 package when the dot marker is oriented to the upper-left. The JTAG signals TCK (pin 124), TMS (pin 122), TDI (pin 123), and TDO (pin 141) must be routed away from high-frequency switching signals and length-matched within 25 mm to avoid boundary-scan failures. A 10 kΩ pull-up on TDI and TMS, plus a 10 kΩ pull-up on TDO, is recommended for stable JTAG operation.
Do not confuse the speed-grade suffix C3 (fastest, 5.4 ns) with C5 (slowest, ~8.0 ns) when substituting across production runs - timing closure may fail. The 'T' prefix in EPM570T144 indicates TQFP package, while 'G' and 'F' prefixes denote legacy lead-free and FineLine BGA migration options. Always re-validate the Quartus II fitter report after a speed-grade or package-marker change.
Although CPLD outputs have slower edge rates than FPGAs (typically 2-3 ns), the 5.4 ns tPD1 timing budget assumes a 50 pF load. For high-fanout signals driving more than eight inputs or external cables, add a series 22 Ω damping resistor close to the CPLD output to limit overshoot and ringing. For MultiVolt I/O banks, mix only compatible voltage standards in the same bank - mixing 1.5 V and 3.3 V in one bank is not allowed.
Informações de conformidade
RoHS/lead-free status was not confirmed in the verified web data; the EPM570T144C3N variant is documented as Pb-free. AEC-Q100 is not applicable to a general-purpose commercial CPLD. Conflict-minerals statement available from Intel's Corporate Responsibility Report.
