EPM570GT144C3 - MAX II 570 LE CPLD, 5.4ns, 144-TQFP | Intel
Référence : EPM570GT144C3 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $22.9 | $22,90 |
| 10 | $21.85 | $218,50 |
| 100 | $18.4 | $1 840,00 |
| 500 | $15.95 | $7 975,00 |
| 1 000 | $13.5 | $13 500,00 |
EPM570GT144C3 Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device built from multiple PAL-like macrocells interconnected by a global routing interconnect. It occupies a position in the programmable logic hierarchy between discrete logic gates (smallest) and FPGAs (largest and highest-density), offering deterministic timing, instant-on operation from on-chip flash, and high-drive I/O suitable for bus-interface and control-plane tasks. MAX II devices specifically combine the lowest static power of any CPLD family with non-volatile storage and a built-in user flash memory block for system housekeeping data.
Key features of the EPM570GT144C3 include 440 macrocells, 76 user-available I/Os in the 144-pin TQFP package, MultiVolt I/O support (1.5V, 1.8V, 2.5V, 3.3V mixed-voltage interfaces), 1.8V core supply with on-chip voltage regulator, JTAG-based IEEE 1149.1 in-system programmability (ISP), and a built-in UFM block (8 Kbits) that can store user data such as serial numbers, configuration parameters, or boot code. The device consumes as little as 35 µA of standby current in power-saving modes.
Architecturally, the MAX II device combines a non-volatile flash configuration cell with a volatile SRAM-based logic fabric, where each Logic Element contains a 4-input look-up table (LUT), a programmable register, and a carry chain for arithmetic. The flash cell holds the configuration permanently, eliminating the need for an external boot PROM and enabling instant-on operation within microseconds of power-up. The MultiVolt I/O banks allow direct interfacing to 1.5V, 1.8V, 2.5V, and 3.3V logic without external level shifters.
Typical applications include bus-interface bridging (PCI to local bus, I2C to SPI), power-sequencer and supervisory logic for FPGA-based systems, address decoding and glue logic in microcontroller designs, industrial control and factory automation, and consumer electronics requiring low-cost, low-power programmable logic. The 144-pin TQFP package is suitable for hand-solderable prototypes and low-volume through-hole-friendly manufacturing, as opposed to the FineLine BGA variants used in high-density portable designs.
When designing with the EPM570GT144C3, plan for the Quartus Prime design suite (MAX II device support) and verify that I/O bank voltage assignments match the connected logic rails; misuse of MultiVolt banks is the most common cause of CPLD I/O failures during bring-up. The 5.4 ns tPD1 figure is sufficient for sub-200 MHz glue-logic applications but should be derated against temperature for worst-case timing closure.
Alternatives de remplacement direct pour EPM570GT144C3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM570GT144C3 (même facteur de forme et même empreinte) — différant par Package, Programming Interface, Operating Temperature, Process Technology, User Flash Memory (UFM).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM570GT144C5N
✅ Remplacement direct✓ En stock
$14.2 / unité
Voir la fiche technique →EPM570GT144I5N
✅ Remplacement direct✓ En stock
$14.85 / unité
Voir la fiche technique →EPM570GT144C3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$28.95 / unité
Voir la fiche technique →EPM570GT144C4N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$22.5 / unité
Voir la fiche technique →EPM570GT144C3 Valeurs maximales et caractéristiques électriques
| Family | MAX II |
| Logic Elements (LEs) | 570 |
| Equivalent Macrocells | 440 |
| User I/O Count | 76 (max, package-dependent) |
| Pin-to-Pin Propagation Delay (tPD1) | 5.4 ns (commercial, fastest speed grade) |
| User Flash Memory (UFM) | 8 Kbits (8,192 bits) |
| Core Supply Voltage | 1.8 V (internal regulator from VCCINT 3.3 V) |
| I/O Supply Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Température de fonctionnement | 0 °C to +85 °C (commercial, C3 grade) |
| Boîtier | 144-pin TQFP (GT144) |
| Type de montage | Surface Mount |
| Process Technology | 0.30 µm 6-layer-metal flash CMOS |
| Configuration Method | Non-volatile on-chip flash (instant-on) |
| Programming Interface | JTAG IEEE 1149.1 (ISP) |
| Statut RoHS | Compliant |
| Niveau MSL | MSL 3 (per JEDEC J-STD-020) |
Configuration des broches de EPM570GT144C3
| Broche 1 | I/O — User I/O (bank 1) |
| Broche 2 | I/O — User I/O (bank 1) |
| Broche 3 | I/O — User I/O (bank 1) |
| Broche 4 | I/O — User I/O (bank 1) |
| Broche 5 | I/O — User I/O (bank 1) |
| Broche 6 | I/O — User I/O (bank 1) |
| Broche 7 | I/O — User I/O (bank 1) |
| Broche 8 | VCCIO1 — I/O bank 1 supply voltage (1.5/1.8/2.5/3.3V) |
| Broche 9 | I/O — User I/O (bank 1) |
| Broche 10 | I/O — User I/O (bank 1) |
| Broche 11 | I/O — User I/O (bank 1) |
| Broche 12 | I/O — User I/O (bank 1) |
| Broche 13 | I/O — User I/O (bank 2) |
| Broche 14 | I/O — User I/O (bank 2) |
| Broche 15 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 16 | I/O — User I/O (bank 2) |
| Broche 17 | I/O — User I/O (bank 2) |
| Broche 18 | I/O — User I/O (bank 2) |
| Broche 19 | I/O — User I/O (bank 2) |
| Broche 20 | I/O — User I/O (bank 2) |
| Broche 21 | I/O — User I/O (bank 2) |
| Broche 22 | I/O — User I/O (bank 2) |
| Broche 23 | I/O — User I/O (bank 2) |
| Broche 24 | I/O — User I/O (bank 2) |
| Broche 25 | I/O — User I/O (bank 2) |
| Broche 26 | I/O — User I/O (bank 2) |
| Broche 27 | I/O — User I/O (bank 3) |
| Broche 28 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 29 | I/O — User I/O (bank 3) |
| Broche 30 | I/O — User I/O (bank 3) |
| Broche 31 | I/O — User I/O (bank 3) |
| Broche 32 | I/O — User I/O (bank 3) |
| Broche 33 | I/O — User I/O (bank 3) |
| Broche 34 | I/O — User I/O (bank 3) |
| Broche 35 | I/O — User I/O (bank 3) |
| Broche 36 | I/O — User I/O (bank 3) |
| Broche 37 | VCCINT — Core analog 3.3V supply |
| Broche 38 | GND — Ground |
| Broche 39 | I/O — User I/O (bank 4) |
| Broche 40 | I/O — User I/O (bank 4) |
| Broche 41 | I/O — User I/O (bank 4) |
| Broche 42 | I/O — User I/O (bank 4) |
| Broche 43 | I/O — User I/O (bank 4) |
| Broche 44 | I/O — User I/O (bank 4) |
| Broche 45 | I/O — User I/O (bank 4) |
| Broche 46 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 47 | I/O — User I/O (bank 4) |
| Broche 48 | I/O — User I/O (bank 4) |
| Broche 49 | I/O — User I/O (bank 4) |
| Broche 50 | I/O — User I/O (bank 4) |
| Broche 51 | I/O — User I/O (bank 4) |
| Broche 52 | I/O — User I/O (bank 4) |
| Broche 53 | I/O — User I/O (bank 4) |
| Broche 54 | I/O — User I/O (bank 4) |
| Broche 55 | I/O — User I/O (bank 4) |
| Broche 56 | I/O — User I/O (bank 4) |
| Broche 57 | I/O — User I/O (bank 4) |
| Broche 58 | I/O — User I/O (bank 4) |
| Broche 59 | I/O — User I/O (bank 4) |
| Broche 60 | I/O — User I/O (bank 4) |
| Broche 61 | I/O — User I/O (bank 4) |
| Broche 62 | I/O — User I/O (bank 4) |
| Broche 63 | I/O — User I/O (bank 4) |
| Broche 64 | I/O — User I/O (bank 4) |
| Broche 65 | I/O — User I/O (bank 4) |
| Broche 66 | I/O — User I/O (bank 4) |
| Broche 67 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 68 | I/O — User I/O (bank 4) |
| Broche 69 | I/O — User I/O (bank 4) |
| Broche 70 | I/O — User I/O (bank 4) |
| Broche 71 | I/O — User I/O (bank 4) |
| Broche 72 | I/O — User I/O (bank 4) |
| Broche 73 | TDI — JTAG Test Data In |
| Broche 74 | TCK — JTAG Test Clock |
| Broche 75 | TMS — JTAG Test Mode Select |
| Broche 76 | nCONFIG — Configuration start (active low) |
| Broche 77 | I/O — User I/O (bank 3) |
| Broche 78 | I/O — User I/O (bank 3) |
| Broche 79 | I/O — User I/O (bank 3) |
| Broche 80 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 81 | I/O — User I/O (bank 3) |
| Broche 82 | I/O — User I/O (bank 3) |
| Broche 83 | I/O — User I/O (bank 3) |
| Broche 84 | I/O — User I/O (bank 3) |
| Broche 85 | I/O — User I/O (bank 3) |
| Broche 86 | I/O — User I/O (bank 3) |
| Broche 87 | I/O — User I/O (bank 3) |
| Broche 88 | I/O — User I/O (bank 3) |
| Broche 89 | I/O — User I/O (bank 3) |
| Broche 90 | I/O — User I/O (bank 3) |
| Broche 91 | GND — Ground |
| Broche 92 | I/O — User I/O (bank 2) |
| Broche 93 | I/O — User I/O (bank 2) |
| Broche 94 | I/O — User I/O (bank 2) |
| Broche 95 | I/O — User I/O (bank 2) |
| Broche 96 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 97 | I/O — User I/O (bank 2) |
| Broche 98 | I/O — User I/O (bank 2) |
| Broche 99 | I/O — User I/O (bank 2) |
| Broche 100 | I/O — User I/O (bank 2) |
| Broche 101 | I/O — User I/O (bank 2) |
| Broche 102 | I/O — User I/O (bank 2) |
| Broche 103 | I/O — User I/O (bank 2) |
| Broche 104 | I/O — User I/O (bank 2) |
| Broche 105 | I/O — User I/O (bank 2) |
| Broche 106 | I/O — User I/O (bank 2) |
| Broche 107 | I/O — User I/O (bank 2) |
| Broche 108 | I/O — User I/O (bank 1) |
| Broche 109 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 110 | I/O — User I/O (bank 1) |
| Broche 111 | I/O — User I/O (bank 1) |
| Broche 112 | I/O — User I/O (bank 1) |
| Broche 113 | I/O — User I/O (bank 1) |
| Broche 114 | I/O — User I/O (bank 1) |
| Broche 115 | I/O — User I/O (bank 1) |
| Broche 116 | I/O — User I/O (bank 1) |
| Broche 117 | I/O — User I/O (bank 1) |
| Broche 118 | CONF_DONE — Configuration done (open drain) |
| Broche 119 | nSTATUS — Configuration status (open drain) |
| Broche 120 | TDO — JTAG Test Data Out |
| Broche 121 | I/O — User I/O (bank 1) |
| Broche 122 | I/O — User I/O (bank 1) |
| Broche 123 | I/O — User I/O (bank 1) |
| Broche 124 | I/O — User I/O (bank 1) |
| Broche 125 | I/O — User I/O (bank 1) |
| Broche 126 | I/O — User I/O (bank 1) |
| Broche 127 | I/O — User I/O (bank 1) |
| Broche 128 | I/O — User I/O (bank 1) |
| Broche 129 | I/O — User I/O (bank 1) |
| Broche 130 | I/O — User I/O (bank 1) |
| Broche 131 | I/O — User I/O (bank 1) |
| Broche 132 | VCCINT — Core analog 3.3V supply |
| Broche 133 | I/O — User I/O (bank 1) |
| Broche 134 | I/O — User I/O (bank 1) |
| Broche 135 | GND — Ground |
| Broche 136 | I/O — User I/O (bank 1) |
| Broche 137 | I/O — User I/O (bank 1) |
| Broche 138 | I/O — User I/O (bank 1) |
| Broche 139 | I/O — User I/O (bank 1) |
| Broche 140 | I/O — User I/O (bank 1) |
| Broche 141 | I/O — User I/O (bank 1) |
| Broche 142 | I/O — User I/O (bank 1) |
| Broche 143 | I/O — User I/O (bank 1) |
| Broche 144 | I/O — User I/O (bank 1) |
Applications typiques
EPM570GT144C3 convient pour 7 applications: Bus Interface Bridging and Glue Logic, FPGA Configuration and Power Sequencing, Industrial Control and Factory Automation, Consumer Electronics and Display Control, LED Display and Signage Controllers, Test & Measurement and Instrumentation Front-Ends, Automotive Body Electronics (Non-Safety).
Bus Interface Bridging and Glue Logic
The EPM570GT144C3 is widely used for bus-to-bus bridging between disparate interfaces such as PCI to local bus, I2C to SPI, parallel SRAM to asynchronous peripherals, or custom legacy buses to modern microcontrollers. The 76 user I/Os in the GT144 package provide ample headroom for 16-bit and 32-bit data buses plus address and control signals. MultiVolt I/O support (1.5V / 1.8V / 2.5V / 3.3V) lets a single CPLD bridge between mixed-voltage domains without external level shifters, while the 5.4 ns tPD1 guarantees deterministic timing for protocol translation tasks such as address decoding and chip-select generation in 50-100 MHz systems. The non-volatile flash configuration ensures instant-on behavior critical for bus-arbitration and reset-vector logic.
Recommandé
FPGA Configuration and Power Sequencing
The EPM570GT144C3 is commonly deployed as a configuration supervisor and power-sequencer for larger FPGAs such as Cyclone IV/V or Stratix families. It can store board identity, MAC address, and calibration data in the 8 Kbit user flash memory, then drive the FPGA's nCONFIG, nSTATUS, and CONF_DONE signals through a deterministic state machine. The 35 µA standby current preserves battery life in always-on sequencing logic, and the instant-on flash configuration eliminates the cold-boot delay that volatile FPGAs exhibit without an external boot PROM. The 5.4 ns tPD1 supports multi-rail sequencing for FPGAs that require precise rail-to-rail timing margins during power-up.
Recommandé
Industrial Control and Factory Automation
In factory-automation and PLC architectures, the EPM570GT144C3 serves as deterministic glue logic for motor-control signal conditioning, encoder interfacing, and safety-critical interlock decoding. The 570 LEs accommodate medium-complexity state machines for protocol conversion (EtherCAT, Profibus, Modbus) and the 76 I/Os support multi-axis control loops. While the EPM570GT144C3 itself is commercial-grade (0 °C to +85 °C), designs requiring wider temperature ranges can drop in the EPM570GT144I5N variant. The flash-based non-volatile configuration is robust against industrial EMI events that would otherwise corrupt volatile SRAM FPGAs, and the low static power simplifies thermal management in sealed enclosures.
Recommandé
Consumer Electronics and Display Control
Consumer devices such as digital cameras, set-top boxes, e-readers, and household appliances leverage the EPM570GT144C3 for display timing generation, button-matrix scanning, and standby-controller logic. The instant-on flash configuration eliminates the visible delay that volatile FPGAs exhibit at power-on, and the 35 µA standby current preserves battery life in always-listening remote controls. The MultiVolt I/O bank lets the CPLD directly interface 1.8V image sensors, 3.3V display drivers, and 5V legacy peripherals from a single chip. The 144-pin TQFP package is hand-solderable for prototype and low-volume manufacturing, accelerating consumer-product development cycles.
Recommandé
LED Display and Signage Controllers
The EPM570GT144C3 excels as a scan-controller for LED matrix displays, scrolling signs, and architectural lighting fixtures where deterministic refresh timing is critical. The 5.4 ns tPD1 enables high-MHz PWM generation for color-mixing LED drivers, and the 76 I/Os drive multiplexed row/column drivers for 8x8 to 16x32 RGB matrices without external buffers. The 8 Kbit UFM stores calibration data, brightness curves, and gamma tables for uniform panel appearance. The flash-based non-volatile configuration retains display patterns across power cycles, an advantage over microcontrollers that lose RAM state on brown-out.
Recommandé
Test & Measurement and Instrumentation Front-Ends
Benchtop instruments and ATE (Automatic Test Equipment) use the EPM570GT144C3 as a flexible pattern generator, multiplexer controller, or trigger-arming logic. The 570 LEs implement arbitrary stimulus sequencing with sub-10 ns edge accuracy, and the MultiVolt I/O interfaces directly to 1.5V LVDS drivers, 3.3V CMOS ADC front-ends, and 5V legacy instrumentation buses. The on-chip UFM stores calibration constants and test-pattern libraries. Designers can use Quartus Prime to recompile the CPLD in minutes when a new test sequence is needed - faster and cheaper than respinning a microcontroller PCB or building discrete TTL logic.
Recommandé
Automotive Body Electronics (Non-Safety)
While the EPM570GT144C3 itself is commercial-grade and not AEC-Q100 qualified, it serves as a cost-effective development platform for automotive body-electronics prototypes such as body-control modules, mirror controllers, and HVAC switch-matrix decoders. Engineers can validate the design on the commercial part, then migrate to the EPM570GT144I5N or equivalent industrial-temperature variant for low-volume production. The 5.4 ns tPD1 supports CAN-bus interface glue logic, and the 76 I/Os accommodate multi-channel switch-matrix decoding for HVAC controls and body-control networks. The non-volatile flash configuration eliminates cold-start delays that would otherwise be perceptible to the driver.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM570GT144C3 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM570GT144C5N | EPM570GT144I5N | EPM570GT144C3N | EPM570GT144C4N |
|---|---|---|---|---|---|
| Package | 144-pin TQFP (GT144) | 144-pin TQFP (GT144) - same | 144-pin TQFP (GT144) - same | 144-pin TQFP (GT144) - same | 144-pin TQFP (GT144) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements (LEs) | 570 | 570 | 570 | 570 | 570 |
| Equivalent Macrocells | 440 | 440 | 440 | 440 | 440 |
| tPD1 (Pin-to-Pin Delay) | 5.4 ns | 7.5 ns (slower) | 7.5 ns (slower) | 5.4 ns (identical) | ~6.5 ns (intermediate) |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Operating Temperature Range | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| Lead-Free Finish | Standard finish (verify per lot) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
Principaux différenciateurs
- Fastest commercial speed grade in the MAX II 570 LE family (vs EPM570GT144C5N)
- Instant-on non-volatile flash configuration eliminates boot delay (vs SRAM-based small FPGAs (e.g. Cyclone family))
- MultiVolt I/O banks support 1.5V/1.8V/2.5V/3.3V mixed-voltage interfacing (vs Single-voltage competitor CPLDs)
Notes de conception
The EPM570GT144C3 requires a stable 3.3V supply on VCCINT pins (multiple pins on the GT144 package) plus 1.5V/1.8V/2.5V/3.3V on each VCCIO bank. Bulk-decouple each VCCINT pin with a 1µF ceramic plus 0.1µF high-frequency bypass within 5mm of the pin, and add a 10µF tantalum bulk cap near the regulator. The internal 1.8V core regulator does not require external capacitance, but power-rail sequencing should ensure VCCINT rises monotonically without glitches - if the host MCU and CPLD power up simultaneously, use a power-good signal from the regulator to gate the CPLD's nCONFIG pin until VCCINT is stable.
Place all VCCINT and VCCIO decoupling capacitors as close as possible to their respective pins on the top layer with short, wide traces to the power plane. For the 144-pin TQFP (GT144), route JTAG signals (TDI, TMS, TCK, TDO) away from switching I/O to avoid noise coupling during ISP programming. Add a 4.7kΩ pull-up on nCONFIG and nSTATUS, and a 10kΩ pull-up on CONF_DONE if open-drain operation is required. The TQFP thermal pad (if any) should be soldered to a small ground copper pour to improve thermal dissipation.
Common pitfalls: (1) Setting all four VCCIO banks to 3.3V when one bank interfaces to 1.5V logic - this can damage the I/O cells; (2) Forgetting to instantiate the JTAG user code in the Quartus Prime .SOF/.POF and then trying to program in-system - yields 'JTAG chain failure'; (3) Driving the JTAG TDI/TMS/TCK lines from a long cable without proper buffering - causes ISP failures; (4) Mixing commercial and industrial grade parts on the same PCB - the timing models differ and will not interchange. Always validate AC timing with the Quartus Prime TimeQuest timing analyzer at the worst-case temperature corner before taping out the PCB.
When driving high-speed buses (>50 MHz) from the EPM570GT144C3 I/O, enable Quartus Prime's near-end and far-end I/O timing analysis and check the IBIS model for the specific speed grade. The 5.4 ns tPD1 figure (C3 grade) is the pin-to-pin delay through the logic fabric only; I/O buffer delays and PCB trace delays must be subtracted to find the actual system margin. For multi-MHz buses, add source-series termination (typically 22-33Ω) close to the CPLD output to dampen reflections on long traces.
Informations de conformité
RoHS compliant per Intel/Altera product page. Not AEC-Q100 qualified - for automotive designs, migrate to industrial-grade EPM570GT144I5N or AEC-Q100-qualified MAX 10 CPLDs. Lead-free finish standard.
