M1AFS1500-1FG676 - Fusion FPGA 1.5M Gates | Microchip
MPN: M1AFS1500-1FG676 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $150 | $150.00 |
| 10 | $135 | $1,350.00 |
| 100 | $120 | $12,000.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $90 | $90,000.00 |
Drop-in alternatives for M1AFS1500-1FG676 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M1AFS1500-2FG676
✅ Drop-In✓ In Stock
$39.8 / Unit
View Datasheet →M1AFS1500-2FGG676
✅ Drop-In✓ In Stock
$297.26 / Unit
View Datasheet →M1AFS1500-1FGG676
✅ Drop-In📋 Reference alternative (not in catalog)
M1AFS1500-1FG676 Maximum Ratings & Electrical Characteristics
| Family | Fusion |
| Equivalent System Gates | 1,500,000 |
| Logic Cells | 38,400 |
| Number of I/Os | 252 |
| Operating Supply Voltage | 1.5 V |
| Package / Case | FBGA-676 |
| Mounting Style | SMD/SMT |
| Maximum Operating Temperature | +70 C |
| Minimum Operating Temperature | 0 C |
| Technology | 130nm CMOS |
| Speed Grade | -1 |
| Packaging | Tray |
| Flash-Based Lock | 128-bit |
| AES Decryption | Yes |
M1AFS1500-1FG676 fbga-676 Pin Configuration Guide
Complete pinout information for M1AFS1500-1FG676 (fbga-676 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M1AFS1500-1FG676.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M1AFS1500-1FG676 is suitable for 6 applications: Motor Control, Power Management, Industrial Automation, Aerospace and Defense, Medical Electronics, Communications.
Motor Control
The M1AFS1500-1FG676 is ideal for motor control applications due to its integrated analog blocks and flash-based FPGA fabric. The 12-bit ADC can sample motor currents and voltages, while the programmable logic implements PWM generation and commutation algorithms. The 1.5M gates provide ample resources for complex control loops, and the 252 I/Os allow interfacing with multiple sensors and drivers. The flash-based configuration ensures instant-on operation, critical for safety-critical motor control systems. With a 1.5V core and 130nm technology, it offers low power consumption, making it suitable for battery-powered or energy-efficient motor drives.
Recommended
Power Management
The M1AFS1500-1FG676 excels in power management applications by integrating configurable analog and flash memory. The analog front-end can monitor voltage and current, while the FPGA logic implements digital power control algorithms. The 1.5M gates allow for sophisticated state machines and communication interfaces. The flash memory can store calibration data and configuration parameters. The device's 1.5V operation and low power consumption are beneficial for power-sensitive designs. The 676-pin FBGA package provides ample I/Os for controlling multiple power rails. This makes it suitable for server power supplies, industrial power systems, and battery management.
Recommended
Industrial Automation
In industrial automation, the M1AFS1500-1FG676 provides a flexible platform for PLCs, robotics, and process control. The integrated analog blocks allow direct connection to sensors and actuators, reducing external components. The 1.5M gates enable implementation of communication protocols like EtherCAT or PROFINET. The flash-based FPGA offers secure and reliable configuration, essential for industrial environments. The 252 I/Os support numerous digital inputs/outputs. The device operates over 0°C to +70°C, suitable for most industrial settings. Its 1.5V core and 130nm technology ensure low power dissipation, reducing thermal management requirements.
Recommended
Aerospace and Defense
The M1AFS1500-1FG676 is well-suited for aerospace and defense applications due to its flash-based, non-volatile configuration that provides instant-on and secure boot. The 128-bit flash lock and AES decryption protect IP. The integrated analog blocks can interface with sensors for flight control and monitoring. The 1.5M gates allow for complex signal processing and redundancy. The device operates over the industrial temperature range, though extended temperature versions may be available. The 676-pin FBGA package is suitable for high-density PCBs. This FPGA is used in avionics, satellite systems, and military electronics where reliability and security are paramount.
Recommended
Medical Electronics
The M1AFS1500-1FG676 can be used in medical devices such as patient monitors, imaging systems, and diagnostic equipment. The integrated analog front-end simplifies sensor interfacing for vital sign monitoring. The 1.5M gates provide resources for signal processing and display control. The flash-based configuration ensures reliable startup and secure firmware updates. The device's low power consumption is beneficial for portable medical devices. The 252 I/Os allow connection to various peripherals. The 0°C to +70°C operating range covers most medical environments. This FPGA enables compact, high-performance medical electronics.
Recommended
Communications
The M1AFS1500-1FG676 is suitable for communications equipment such as base stations, routers, and network switches. The programmable logic can implement protocol processing, packet filtering, and error correction. The integrated analog blocks can monitor power and signal integrity. The 1.5M gates provide ample resources for complex algorithms. The 252 I/Os support high-speed interfaces. The flash-based configuration allows secure and flexible updates. The device operates at 1.5V, reducing power consumption in dense systems. This FPGA is used in wired and wireless communication infrastructure.
Recommended
Recommended Products Summary
Engineering reference data for M1AFS1500-1FG676 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1AFS1500-2FG676 | M1AFS1500-2FGG676 | M1AFS1500-FGG256I | M1AFS1500-FGG256K | M1AFS1500-1FGG676 |
|---|---|---|---|---|---|---|
| Package | FBGA-676 | FBGA-676 | FBGA-676 | FBGA-256 | FBGA-256 | FBGA-676 |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Speed Grade | -1 | -2 | -2 | -1 | -1 | -1 |
| Number of I/Os | 252 | 252 | 252 | 252 | 252 | 252 |
| Operating Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Logic Cells | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Equivalent System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 |
| Temperature Range | 0°C to +70°C | 0°C to +70°C | 0°C to +70°C | -40°C to +100°C | -40°C to +100°C | 0°C to +70°C |
Key Differentiators
- Integrated analog blocks (vs M1AFS1500-2FG676)
- Flash-based configuration (vs M1AFS1500-2FG676)
- Cost-effective speed grade (vs M1AFS1500-2FG676)
Design Notes
The M1AFS1500-1FG676 requires a 1.5V core supply. Use a low-dropout regulator or a switching regulator with low ripple to provide this voltage. Decouple the power pins with 0.1uF and 10uF capacitors placed close to the FPGA. The total power consumption depends on logic utilization and clock frequency; estimate using the power calculator in the Microchip Libero software. Ensure the power supply can handle peak current demands during configuration and operation.
The 676-pin FBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. Use a 4-layer or more stack-up with dedicated power and ground planes. Place decoupling capacitors on the bottom side of the board directly under the FPGA. Follow the layout guidelines in the Fusion datasheet for analog and digital signal separation. Use via-in-pad or microvias for dense routing. Ensure proper solder mask and pad design for reliable BGA soldering.
The M1AFS1500-1FG676 can dissipate significant power at high utilization. The FBGA package has a thermal resistance that depends on airflow and PCB design. Estimate the junction temperature using the formula Tj = Ta + (theta_JA * P). For a typical design with 2W dissipation and theta_JA of 20°C/W, the junction temperature rise is 40°C. Ensure adequate airflow or a heatsink if operating near the maximum temperature. Monitor the die temperature using the integrated temperature diode if available.
Compliance Information
Compliance information not explicitly stated in the provided data. The M1AFS1500-1FGG676 variant may be lead-free, but this is not confirmed for the -1FG676. Check the manufacturer datasheet for detailed compliance.
