M1AFS1500-2FG676 - 1.5M Gate Fusion FPGA | Microchip
MPN: M1AFS1500-2FG676 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $68.58 | $68.58 |
| 10 | $61.72 | $617.20 |
| 100 | $55.39 | $5,539.00 |
| 500 | $50.87 | $25,435.00 |
| 1,000 | $45.16 | $45,160.00 |
| 3,000 | $39.8 | $119,400.00 |
Drop-in alternatives for M1AFS1500-2FG676 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M1AFS1500-1FG676
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$90 / Unit
View Datasheet →M1AFS1500-2FG676I
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
M1AFS1500-2FGG676
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$297.26 / Unit
View Datasheet →M1AFS1500-2FGG676I
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
M1AFS1500-1FG676I
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
M1AFS1500-2FG676 Maximum Ratings & Electrical Characteristics
| FPGA Family | Fusion |
| Total Gates | 1,500,000 |
| Number of Logic Cells | 38,400 |
| Number of User I/O | 252 |
| Maximum Clock Frequency | 350 MHz |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm |
| Package / Case | 676-FBGA (PBGA-676) |
| Mounting Type | Surface Mount |
| Operating Temperature Range | 0°C to 85°C (TJ) |
| Packaging | Tray |
| Base Product Number | M1AFS1500 |
| Datasheet User Reference Manual | 331 pages |
| Speed Grade | -2 |
M1AFS1500-2FG676 676-fbga (pbga-676) Pin Configuration Guide
Complete pinout information for M1AFS1500-2FG676 (676-fbga (pbga-676) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M1AFS1500-2FG676.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M1AFS1500-2FG676 is suitable for 6 applications: Motor Control, Industrial Automation, Avionics and Aerospace, Smart Grid and Power Monitoring, Medical Imaging, Embedded Vision and Surveillance.
Motor Control
The M1AFS1500-2FG676 works well in multi-axis motor control systems because its 252 user I/O can capture high-resolution encoder inputs while its programmable logic executes real-time commutation algorithms. In a typical servo drive, it interfaces with current-sense amplifiers and gate drivers, closing the loop with low latency compared to MCU firmware. The Fusion analog blocks can monitor voltage/current rails directly, reducing external ADC count. With a 350 MHz maximum clock frequency, it can perform complex PWM generation and fault handling with tighter timing than many MCUs. Designers should isolate the 1.5V core rail from motor supply noise and use dedicated I/O banks for encoder and driver signals to maintain noise immunity.
Recommended
Industrial Automation
In industrial automation, the M1AFS1500-2FG676 can consolidate PLC-like logic, analog sensor conditioning, and high-speed communication in one FPGA. It provides 252 I/O for connecting limit switches, photo-eyes, and encoder interfaces while the configurable analog blocks support direct connection of 4-20mA and 0-10V sensors. The 130nm flash-based fabric allows non-volatile configuration, so the automation node boots immediately without external configuration memory. Engineers can use its 1.5V core for low power consumption and rely on separate I/O banks to bridge 3.3V or 5V industrial signals. The 350MHz clock enables fast PID loops and deterministic digital filtering.
Recommended
Avionics and Aerospace
The M1AFS1500-2FG676 is suited for avionics data concentrators, flight instrumentation, and unmanned vehicle controllers because Fusion FPGAs integrate flash-based configuration and support secure boot. Its 1.5M gates and 38,400 logic cells can host multiple protocol controllers, while 252 I/O connect to sensors, discretes, and avionics data buses. The non-volatile fabric retains the design without external PROM, simplifying line-replaceable unit designs. For critical applications, the commercial temperature range is a limitation; designers should select the I-suffix industrial variant or provide environmental control. The analog blocks can also monitor power supplies and health status.
Recommended
Smart Grid and Power Monitoring
The M1AFS1500-2FG676 is a strong fit for smart grid protection relays and power quality monitors because its mixed-signal analog front-end can digitize voltage/current waveforms while FPGA logic performs synchronized phasor measurement. With 252 I/O, it can interface to multiple ADC channels and precision timing sources. The 1.5V core with 130nm technology keeps power consumption manageable in substation electronics. Fusion's flash memory can store calibration data and event logs without external EEPROM. For protection applications, designers must implement deterministic sampling and use the FPGA's parallelism to process multiple channels simultaneously, meeting tight IEC 61850 timing budgets.
Recommended
Medical Imaging
The M1AFS1500-2FG676 can be used in ultrasound front-end processing, CT data acquisition, and patient monitoring systems where high I/O count and parallel processing are essential. Its 252 I/O can capture arrays of ADC data, while the programmable fabric performs beamforming or digital filtering algorithms with deterministic latency. Fusion's configurable analog can supervise power rails and temperature for patient safety. The 350MHz clock allows high-rate data processing on multiple channels concurrently. For medical equipment, designers should verify isolation requirements and use the industrial/green variants if extended temperature or RoHS compliance is required.
Recommended
Embedded Vision and Surveillance
The M1AFS1500-2FG676 suits embedded vision systems that require parallel pre-processing of image data from multiple sensors. With 252 I/O, it can connect to parallel CMOS imagers, LVDS receivers, or a frame-buffer bus, while FPGA logic performs filtering, downsampling, or feature extraction before sending results to a host processor. The Fusion mixed-signal blocks can manage sensor power and exposure control. For real-time surveillance analytics, the FPGA offloads repetitive pixel operations, reducing CPU load. Designers should match I/O bank voltages to the sensor interface and use internal RAM blocks efficiently for line buffers; available RAM is not specified in the verified data and must be checked in the datasheet.
Recommended
Recommended Products Summary
Engineering reference data for M1AFS1500-2FG676 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1AFS1500-1FG676 | M1AFS1500-2FG676I | M1AFS1500-2FGG676 | M1AFS1500-2FGG676I |
|---|---|---|---|---|---|
| Package | 676-FBGA | 676-FBGA (same) | 676-FBGA (same) | 676-FBGA (same) | 676-FBGA (same) |
| Brand | Microchip Technology | Microchip Technology (same) | Microchip Technology (same) | Microchip Technology (same) | Microchip Technology (same) |
| Speed Grade | -2 | -1 | -2 | -2 | -2 |
| Operating Temperature Range | 0°C to 85°C (TJ) | 0°C to 85°C (TJ) | Industrial (per suffix) | 0°C to 85°C (TJ) | Industrial (per suffix) |
| Total Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 |
| Number of Logic Cells | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Number of User I/O | 252 | 252 | 252 | 252 | 252 |
| RoHS / Lead-Free | Unknown (FG code, not explicitly stated) | [DATA_NEEDED] | [DATA_NEEDED] | Green/lead-free (FGG code) | Green/lead-free (FGG code) |
Key Differentiators
- Higher speed grade compared to M1AFS1500-1FG676 (vs M1AFS1500-1FG676)
- Commercial temperature range reduces cost vs industrial variant (vs M1AFS1500-2FG676I)
- Non-green base variant for projects without mandatory RoHS finish (vs M1AFS1500-2FGG676I)
Design Notes
The M1AFS1500-2FG676 requires a clean 1.5V core rail plus separate I/O bank and analog supply voltages. Estimated: for a 1A core current with 30mV allowed ripple, the power distribution impedance target is about 30mΩ up to 10MHz. Place 100nF X7R decoupling capacitors near each power ball and add bulk capacitance on the main supply rail. Follow Microchip's Fusion power-up sequencing guidance to avoid latch-up or unreliable configuration.
The 676-FBGA package power dissipation depends on logic utilization, I/O loading, and clock frequency. At high utilization the device can dissipate several watts; the datasheet's thermal resistance values should be used to compute junction temperature, but they are not included in the verified snippets. Estimated: for 2W dissipation with a 10°C/W θJA and 40°C ambient, junction temperature would be about 60°C, leaving margin for the 85°C limit. Use thermal vias and a solid ground plane under the BGA.
In Fusion FPGA designs, do not assume all 676 balls are user I/O: only 252 I/O are available and many balls are power, ground, and configuration pins. Review the package pinout before layout, and verify I/O bank voltages against external interfaces. Because the verified data does not include RAM bit or analog-block counts, confirm those resources in the full 331-page Fusion manual before finalizing high-density logic.
Compliance Information
The verified web data does not explicitly state RoHS, REACH, lead-free, or conflict-mineral status for M1AFS1500-2FG676. The FGG-suffix variants indicate green/lead-free packages but this should be confirmed with the supplier.
