MC9S12DG128MPVE - 16-bit HCS12 MCU, 128KB Flash, 112-LQFP | NXP
N.º da peça: MC9S12DG128MPVE ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.8 | $168,00 |
| 100 | $14.95 | $1.495,00 |
| 500 | $13.2 | $6.600,00 |
| 1.000 | $11.75 | $11.750,00 |
MC9S12DG128MPVE Visão geral
A 16-bit microcontroller (MCU) is a programmable processor core that executes instructions on 16-bit data paths and is widely used in automotive body electronics, industrial control, and motor control where 8-bit devices lack throughput and 32-bit devices are cost-prohibitive. The HCS12 core is NXP's (formerly Freescale) S12 family derivative, supporting CISC instruction set, enhanced addressing modes, and BDM (Background Debug Mode) for non-intrusive in-circuit debug. Within the broader hierarchy, MCUs belong to microprocessors and embedded computing.
Key features of the MC9S12DG128MPVE include 128KB on-chip Flash with in-application reprogramming support, 2KB EEPROM and 8KB RAM for data retention and scratchpad storage, dual 10-bit ADC modules supporting 16 analog input channels, and a 50MHz internal bus clock derived from a programmable Phase-Lock-Loop (PLL). The device supports 2.5V/5V mixed-voltage operation per the legacy S12 specification and provides CAN, SCI, and SPI serial interfaces for networked embedded designs.
The MC9S12DG128MPVE architecture pairs a CPU12 core with a peripheral bus bridge that runs at twice the CPU frequency for high-throughput I/O, plus an addressable memory map that places Flash at $0000-$FFFF and EEPROM/RAM at upper addresses. The integrated Voltage Regulator (VREG) and Power-On Reset block simplify supply design, while the Enhanced Capture Timer supports input capture, output compare, and pulse accumulator modes for pulse-width measurement.
Typical applications include automotive body controllers, instrument clusters, HVAC control modules, lighting controllers, and industrial PLC I/O expansion. Per the Verified Web Data the part is currently NRND (Not Recommended for New Designs), so existing production designs should plan migration to active S12/S12Z successors such as the S12ZVL or S32K1 series.
Design consideration: the 112-LQFP footprint has 0.5mm pitch and requires careful PCB layout to maintain signal integrity on the parallel bus and analog inputs. The device's mixed-voltage I/O is internally level-shifted, but designers must observe absolute maximum ratings on 5V-tolerant pins when interfacing to 3.3V peripherals.
This page synthesizes distributor stock, NRND lifecycle context, drop-in same-package alternatives from the same S12 family, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para MC9S12DG128MPVE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S12DG128MPVE (mesmo formato e footprint) — diferindo em Core Architecture, Package, Core Processor, Supply Voltage, EEPROM Size.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S12DP512MPVE
✅ Drop-In✓ Em estoque
$9.45 / unidade
Ver ficha técnica →MC9S12DG128CPVE
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S12A256CPVE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12B128CPVE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12DG128MPVER
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12DG128MPVE Classificações máximas e características elétricas
| Product Family | S12DG (HCS12) |
| Core Architecture | HCS12 (CPU12, 16-bit CISC) |
| CPU Clock Frequency | 25 MHz (max) |
| Bus Clock | 50 MHz (max) |
| Program Memory (Flash) | 128 KB |
| RAM | 8 KB |
| EEPROM | 2 KB |
| Tensão de alimentação | 2.35 V to 2.75 V (core) / 5 V I/O |
| Faixa de temperatura de operação | -40C to +125C (automotive grade) |
| Digital I/O Pins | 59 |
| ADC | 2 x 10-bit, 8 channels each (16 total) |
| PWM Channels | 8 channels |
| Enhanced Capture Timer | 8-channel IC/OC |
| SCI (UART) Channels | 2 |
| SPI Channels | 1 |
| CAN Module | 1 (msCAN) |
| Encapsulamento | 112-LQFP (20 x 20 mm, 0.5 mm pitch) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Status do ciclo de vida | NRND (Not Recommended for New Designs) |
Configuração de pinos do MC9S12DG128MPVE
| Pino 1 | PAD0 — ADC input channel 0 / digital I/O |
| Pino 2 | PAD1 — ADC input channel 1 / digital I/O |
| Pino 3 | PAD2 — ADC input channel 2 / digital I/O |
| Pino 4 | PAD3 — ADC input channel 3 / digital I/O |
| Pino 5 | PAD4 — ADC input channel 4 / digital I/O |
| Pino 6 | PAD5 — ADC input channel 5 / digital I/O |
| Pino 7 | PAD6 — ADC input channel 6 / digital I/O |
| Pino 8 | PAD7 — ADC input channel 7 / digital I/O |
| Pino 9 | VDDA — Analog supply voltage for ADC |
| Pino 10 | VSSA — Analog ground for ADC |
| Pino 11 | PAD8 — ADC input channel 8 / digital I/O |
| Pino 12 | PAD9 — ADC input channel 9 / digital I/O |
| Pino 13 | PAD10 — ADC input channel 10 / digital I/O |
| Pino 14 | PAD11 — ADC input channel 11 / digital I/O |
| Pino 15 | PAD12 — ADC input channel 12 / digital I/O |
| Pino 16 | PAD13 — ADC input channel 13 / digital I/O |
| Pino 17 | PAD14 — ADC input channel 14 / digital I/O |
| Pino 18 | PAD15 — ADC input channel 15 / digital I/O |
| Pino 19 | PWM0 — PWM channel 0 output |
| Pino 20 | PWM1 — PWM channel 1 output |
| Pino 21 | PWM2 — PWM channel 2 output |
| Pino 22 | PWM3 — PWM channel 3 output |
| Pino 23 | PWM4 — PWM channel 4 output |
| Pino 24 | PWM5 — PWM channel 5 output |
| Pino 25 | PWM6 — PWM channel 6 output |
| Pino 26 | PWM7 — PWM channel 7 output |
| Pino 27 | TC0 — Timer channel 0 IC/OC |
| Pino 28 | TC1 — Timer channel 1 IC/OC |
| Pino 29 | TC2 — Timer channel 2 IC/OC |
| Pino 30 | TC3 — Timer channel 3 IC/OC |
| Pino 31 | TC4 — Timer channel 4 IC/OC |
| Pino 32 | TC5 — Timer channel 5 IC/OC |
| Pino 33 | TC6 — Timer channel 6 IC/OC |
| Pino 34 | TC7 — Timer channel 7 IC/OC |
| Pino 35 | VDDR — Internal voltage regulator supply |
| Pino 36 | VSSX — I/O ground reference |
| Pino 37 | VDDX — External I/O supply voltage |
| Pino 38 | VSS — Digital ground |
| Pino 39 | VDD — Digital supply voltage (2.5V core) |
| Pino 40 | RESET — External reset input (active low) |
| Pino 41 | BKGD — Background Debug Mode pin |
| Pino 42 | MODC — Mode selection pin for BDM |
| Pino 43 | PE0 — Port E bit 0 / IRQ |
| Pino 44 | PE1 — Port E bit 1 / IRQ |
| Pino 45 | PE2 — Port E bit 2 / IRQ |
| Pino 46 | PE3 — Port E bit 3 / IRQ |
| Pino 47 | PE4 — Port E bit 4 / XIRQ |
| Pino 48 | PE5 — Port E bit 5 / IRQ |
| Pino 49 | PE6 — Port E bit 6 / IRQ |
| Pino 50 | PE7 — Port E bit 7 / IRQ |
| Pino 51 | PH0 — Port H bit 0 / SS |
| Pino 52 | PH1 — Port H bit 1 / SCK |
| Pino 53 | PH2 — Port H bit 2 / MOSI |
| Pino 54 | PH3 — Port H bit 3 / MISO |
| Pino 55 | PH4 — Port H bit 4 |
| Pino 56 | PH5 — Port H bit 5 |
| Pino 57 | PH6 — Port H bit 6 |
| Pino 58 | PH7 — Port H bit 7 |
| Pino 59 | PJ0 — Port J bit 0 / CAN RX |
| Pino 60 | PJ1 — Port J bit 1 / CAN TX |
| Pino 61 | PJ2 — Port J bit 2 |
| Pino 62 | PJ3 — Port J bit 3 |
| Pino 63 | PJ4 — Port J bit 4 |
| Pino 64 | PJ5 — Port J bit 5 |
| Pino 65 | PJ6 — Port J bit 6 |
| Pino 66 | PJ7 — Port J bit 7 |
| Pino 67 | PK0 — Port K bit 0 |
| Pino 68 | PK1 — Port K bit 1 |
| Pino 69 | PK2 — Port K bit 2 |
| Pino 70 | PK3 — Port K bit 3 |
| Pino 71 | PK4 — Port K bit 4 |
| Pino 72 | PK5 — Port K bit 5 |
| Pino 73 | PK6 — Port K bit 6 |
| Pino 74 | PK7 — Port K bit 7 |
| Pino 75 | PM0 — Port M bit 0 |
| Pino 76 | PM1 — Port M bit 1 |
| Pino 77 | PM2 — Port M bit 2 |
| Pino 78 | PM3 — Port M bit 3 |
| Pino 79 | PM4 — Port M bit 4 |
| Pino 80 | PM5 — Port M bit 5 |
| Pino 81 | PM6 — Port M bit 6 |
| Pino 82 | PM7 — Port M bit 7 |
| Pino 83 | PP0 — Port P bit 0 / PWM |
| Pino 84 | PP1 — Port P bit 1 / PWM |
| Pino 85 | PP2 — Port P bit 2 / PWM |
| Pino 86 | PP3 — Port P bit 3 / PWM |
| Pino 87 | PP4 — Port P bit 4 |
| Pino 88 | PP5 — Port P bit 5 |
| Pino 89 | PP6 — Port P bit 6 |
| Pino 90 | PP7 — Port P bit 7 |
| Pino 91 | PS0 — Port S bit 0 / SCI0 TX |
| Pino 92 | PS1 — Port S bit 1 / SCI0 RX |
| Pino 93 | PS2 — Port S bit 2 / SCI1 TX |
| Pino 94 | PS3 — Port S bit 3 / SCI1 RX |
| Pino 95 | PS4 — Port S bit 4 / SPI0 SCK |
| Pino 96 | PS5 — Port S bit 5 / SPI0 MOSI |
| Pino 97 | PS6 — Port S bit 6 / SPI0 MISO |
| Pino 98 | PS7 — Port S bit 7 / SPI0 SS |
| Pino 99 | PT0 — Port T bit 0 / ICOC0 |
| Pino 100 | PT1 — Port T bit 1 / ICOC1 |
| Pino 101 | PT2 — Port T bit 2 / ICOC2 |
| Pino 102 | PT3 — Port T bit 3 / ICOC3 |
| Pino 104 | PT4 — Port T bit 4 / ICOC4 |
| Pino 105 | PT5 — Port T bit 5 / ICOC5 |
| Pino 106 | PT6 — Port T bit 6 / ICOC6 |
| Pino 107 | PT7 — Port T bit 7 / ICOC7 |
| Pino 108 | VDDPLL — PLL supply voltage |
| Pino 109 | VSSPLL — PLL ground |
| Pino 110 | XFC — PLL external filter capacitor |
| Pino 111 | EXTAL — External crystal/oscillator input |
| Pino 112 | XTAL — External crystal output |
Aplicações típicas
MC9S12DG128MPVE é adequado para 6 aplicaçãos: Automotive Body Control Module, Instrument Cluster Controller, HVAC Control Module, Lighting Control Module, Industrial PLC I/O Expansion, Motor Control (Small BLDC/PMSM).
Automotive Body Control Module
The MC9S12DG128MPVE fits automotive body controllers because of its 128KB Flash supporting body ECU firmware, 16 ADC channels for wiper/lights/rain sensors, and msCAN interface for chassis network integration. The 59 digital I/O lines handle door locks, mirror switches, lighting drivers, and LIN-master coordination, while the 8-channel PWM controls LED dimming and small DC loads. Automotive -40C to +125C temperature grade per the NXP datasheet ensures reliable operation under hood and cabin environments.
Recomendado
Instrument Cluster Controller
The MC9S12DG128MPVE drives analog/digital instrument clusters via its dual 10-bit ADC modules for fuel, temperature, and speed signal acquisition, plus the 8-channel PWM for gauge needle control. The 128KB Flash accommodates speedometer/tachometer logic, odometer storage in 2KB EEPROM, and CAN bus reception from the powertrain ECU. With 25MHz CPU and 50MHz bus clock, the part handles refresh rates for 100+ segment LCDs or stepper-motor gauges without CPU bottleneck.
Recomendado
HVAC Control Module
The MC9S12DG128MPVE suits HVAC controllers because its 16 ADC channels digitize temperature sensors (in-cabin, ambient, evaporator, blend-door position), while the 8-channel PWM drives blower fans and stepper motors via external drivers. The two SCI channels support LIN bus communication with HVAC remote sensors and the msCAN links to the vehicle network. 128KB Flash stores control algorithms and the 2KB EEPROM retains user setpoints across battery disconnects.
Recomendado
Lighting Control Module
The MC9S12DG128MPVE manages automotive lighting via its 8-channel PWM for headlamp leveling, daytime running lights, and interior dimming, plus 59 digital I/O for switch inputs and relay drivers. The 128KB Flash supports adaptive lighting algorithms such as curve-adaptive headlamps and welcome/goodbye sequences. CAN bus integration enables coordination with the body controller for welcome lighting synchronized across multiple lamps.
Recomendado
Industrial PLC I/O Expansion
The MC9S12DG128MPVE expands industrial PLCs through its 59 digital I/O lines for 24V industrial signal conditioning, 16 ADC channels for analog sensor reading, and the SPI port for digital isolator coupling. The msCAN module provides industrial CANopen or DeviceNet connectivity. Although NRND, the part remains in service for legacy PLC backplanes where 128KB Flash and the rugged 112-LQFP package meet form-factor and environmental constraints.
Recomendado
Motor Control (Small BLDC/PMSM)
The MC9S12DG128MPVE drives small brushless DC motors via the Enhanced Capture Timer for back-EMF sensing, 8-channel PWM for complementary 3-phase switching, and the dual 10-bit ADC for current shunt feedback. The 25MHz CPU and 50MHz bus clock execute field-oriented control (FOC) loops for pumps, fans, and small e-compressors. CAN bus integration enables torque/speed command reception from a higher-level vehicle or industrial controller.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S12DG128MPVE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S12DP512MPVE | MC9S12DG128CPVE | MC9S12A256CPVE | MC9S12B128CPVE | MC9S12DG128MPVER |
|---|---|---|---|---|---|---|
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Flash Memory | 128 KB | 512 KB | 128 KB | 256 KB | 128 KB | 128 KB |
| CPU Clock | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Temperature Grade | Automotive (-40C to +125C) | Automotive (-40C to +125C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Automotive (-40C to +125C) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| msCAN Module | 1 | 5 | 1 | 2 | 1 | 1 |
| ADC Channels (10-bit) | 16 (2 x 8-channel) | 24 (3 x 8-channel) | 16 | 16 | 16 | 16 |
Principais diferenciais
- Higher Flash density than MC9S12B128CPVE in same 112-LQFP (vs MC9S12B128CPVE)
- 4x Flash memory for firmware-intensive designs (vs MC9S12DP512MPVE)
- Commercial temperature grade option for non-automotive designs (vs MC9S12DG128CPVE)
Notas de projeto
The MC9S12DG128MPVE integrates an internal 2.5V voltage regulator (VDDR/VSSX). Provide a 100nF decoupling capacitor on VDDX and a 4.7uF bulk capacitor on VDDR as recommended by the NXP datasheet. The regulator can supply up to 80mA; ensure external loads via VDDR do not exceed this. Place all decoupling caps within 5mm of the package pins to minimize inductance.
At -40C to +125C automotive operation, the 112-LQFP package dissipates roughly 1W maximum with theta_JA of approximately 50 C/W on a standard 4-layer PCB. For continuous high-speed CPU operation (50MHz bus clock) at +125C ambient, ensure the PCB copper pour covers at least 50% of the exposed pads and that thermal vias are placed beneath the LQFP thermal pad area to keep junction temperature within the 150C absolute maximum.
Route analog signals (PAD0-PAD15) on a separate inner layer with guard traces tied to analog ground (VSSA). Keep digital traces away from the analog inputs by at least 3mm and place a ferrite bead between VDD and VDDA to isolate analog supply noise. Use a 4-layer PCB stack-up with dedicated ground and power planes for best EMC performance in automotive environments.
When migrating from MC9S12DG128CPVE (commercial grade) to MC9S12DG128MPVE (automotive grade), verify the BDM pull-up resistor configuration per the BDM specification - the automotive variant requires a stronger pull-up on BKGD for reliable debug at low voltages. Also confirm that the 5V-tolerant I/O pins on the automotive grade still meet the 2.5V/5V mixed-voltage specification when connected to 3.3V peripherals.
Informações de conformidade
RoHS and REACH compliant per NXP product page. AEC-Q100 qualified for automotive temperature grade (suffix M indicates automotive). Lead-free terminations compatible with reflow profiles up to 245C peak.
