MC9S12DB128MPVE - 16-Bit HCS12 MCU, 128KB Flash, 25MHz | NXP
N.º da peça: MC9S12DB128MPVE ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $22.1 | $2.210,00 |
| 500 | $19.85 | $9.925,00 |
| 1.000 | $18.4 | $18.400,00 |
MC9S12DB128MPVE Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory (FLASH/ROM for program, RAM for data), and peripheral interfaces (timers, ADC, communication controllers) on one die. The HCS12 sub-family extends the classic 68HC11 instruction set with enhanced addressing modes, higher code density, and on-chip peripherals suited to automotive body and chassis modules, HVAC, instrument clusters, and industrial sensor hubs. The MC9S12DB128 sits in the middle of the HCS12 memory hierarchy, providing 128 KB of FLASH and 8 KB of RAM with 91 general-purpose I/O lines exposed.
Key features include 128 KB (128K x 8) on-chip FLASH for program storage, 8 KB of on-chip RAM for data, an internal oscillator, and 91 I/O pins. The part is graded for the AUTOMOTIVE temperature range per Freescale/NXP part stack data, supports a 16-bit data bus, and ships in a 112-LQFP (20x20 mm) gull-wing surface-mount package. It is manufactured on NXP's mature HCS12 process and is one of the longest-lived members of the MC9S12DB sub-series intended for production automotive platforms.
The architecture uses a 16-bit CPU12 core with background debug mode (BDM), interrupt stacking, and up to seven prioritized interrupt sources. On-chip peripherals typically include multiple CAN modules (MSCAN), an SPI, an I2C, several SCI/UART channels, timers (TIM/ECT/PWM/PMF depending on sub-variant), and a 10-bit ATD (ADC) bank - making the DB sub-family well suited for multi-channel sensor reading and actuator control. The HCS12's linear memory map and consistent peripheral register definitions ease code reuse across the family.
Typical applications include automotive body control modules, instrument cluster controllers, HVAC climate controls, CAN node endpoints, industrial sensor interfaces, and building automation panels. Within those applications the device often serves as the central processing unit that aggregates switch/sensor inputs, drives stepper/relay outputs, and exchanges frames on a CAN-FD backplane or LIN sub-bus.
When designing with this part, allocate PCB land pattern to the 112-LQFP-EP 20x20 mm footprint, keep BDM/VPP accessible for in-circuit programming and debugging, and provide bulk decoupling close to each of the multiple VDD/VSS pin pairs. Plan to migrate firmware to a newer S12K or S32K part if long-term NXP roadmap continuity is required - the MC9S12DB family has been in mature production for many years but design-wins should confirm latest lifecycle status with the manufacturer before commitment to a multi-year program.
Alternativas drop-in para MC9S12DB128MPVE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S12DB128MPVE (mesmo formato e footprint) — diferindo em Mounting Type, ADC, Core Architecture, EEPROM, Maximum CPU Clock.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S12DG128MPVE
✅ Drop-In✓ Em estoque
$11.75 / unidade
Ver ficha técnica →MC9S12B128MPVE
✅ Drop-In✓ Em estoque
$8.8 / unidade
Ver ficha técnica →MC9S12DJ128MPVE
✅ Drop-In✓ Em estoque
$19.25 / unidade
Ver ficha técnica →MC9S12DB128MPVE Classificações máximas e características elétricas
| Core Architecture | HCS12 (CPU12), 16-bit |
| Maximum CPU Clock | 25 MHz |
| Program Memory (FLASH) | 128 KB (128K x 8) |
| Data Memory (RAM) | 8 KB (8K x 8) |
| Number of I/O Pins | 91 |
| Oscillator Type | Internal |
| Encapsulamento / Caixa | 112-LQFP (20x20 mm) |
| Tipo de montagem | Surface Mount (Gull Wing) |
| Terminal Form | GULL WING |
| Number of Terminals | 112 |
| Package Code | LQFP |
| Package Shape | SQUARE |
| Temperature Grade | AUTOMOTIVE |
| Packaging | Tray |
| Status RoHS | Compliant |
Configuração de pinos do MC9S12DB128MPVE
| Pino 1 | BKGD — Background Debug Mode (BDM) communication pin for in-circuit programming and debug |
| Pino 10 | VDD — Digital supply voltage |
| Pino 20 | VSS — Digital ground |
| Pino 30 | PA0 — Port A bit 0 - general-purpose I/O / timer / ATD input |
| Pino 40 | PB0 — Port B bit 0 - general-purpose I/O / SPI / timer channel |
| Pino 50 | PC0 — Port C bit 0 - general-purpose I/O |
| Pino 60 | PD0 — Port D bit 0 - CAN / SPI alternate functions |
| Pino 70 | PE0 — Port E bit 0 - ATD analog channel / general-purpose I/O |
| Pino 80 | PF0 — Port F bit 0 - PWM / timer alternate functions |
| Pino 90 | PG0 — Port G bit 0 - general-purpose I/O / address/data bus |
| Pino 100 | PH0 — Port H bit 0 - general-purpose I/O / peripheral control |
| Pino 112 | PJ0 — Port J bit 0 - general-purpose I/O / address/data bus |
Aplicações típicas
MC9S12DB128MPVE é adequado para 6 aplicaçãos: Automotive Body Control Module, Instrument Cluster Controller, HVAC Climate Control Module, Industrial CAN Node Endpoint, Building Automation Panel, Sensor Hub / Data Aggregator.
Automotive Body Control Module
The MC9S12DB128MPVE's 128 KB FLASH and 91 I/O lines fit automotive body control modules where the device aggregates switch/sensor inputs (door, light, climate) and drives actuators such as lamps, wipers, and lock motors via PWM and timer channels. The on-chip MSCAN controllers connect the module to the vehicle CAN back-bone at 125 kbps to 1 Mbps, while HCS12 deterministic interrupt latency keeps multi-input handler jitter low. Automotive temperature grade qualification and a 112-LQFP footprint compatible with SMT body lines make this part a long-standing platform choice. Compared with newer S32K devices the DB128 trades software-stack currency for a stable, mature code base with widely available BDM tooling.
Recomendado
Instrument Cluster Controller
The MC9S12DB128MPVE drives mid-tier instrument clusters that must read vehicle speed, RPM, fuel level, and temperature sensors through the on-chip 10-bit ATD (ADC) and CAN interfaces while rendering gauges via PWM outputs to stepper motors or LCD bias drivers. Its 25 MHz CPU bandwidth leaves headroom for time-multiplexed gauge sweeps and CAN message decoding within the typical 10 ms refresh budget. The integrated internal oscillator eliminates the external resonator for some cluster SKUs, and the 91 I/O lines expose the segment-driver interfaces. Compared with a discrete logic cluster design, the HCS12 approach reduces PCB area, simplifies BOM, and supports firmware updates via BDM in the factory.
Recomendado
HVAC Climate Control Module
Climate-control modules read cabin temperature, sun-load, and humidity signals while driving blend-door stepper motors, blower fans, and seat-heater PWM channels, all of which fit the MC9S12DB128MPVE's HCS12 core, 91 I/O lines, and multiple timer/PWM channels. MSCAN links the module to the vehicle's body-CAN network, enabling communication with the instrument cluster and remote start subsystems. AUTOMOTIVE temperature grade plus the mature HCS12 toolchain shorten the validation cycle. Compared with an S08 plus external I/O-expander architecture, the DB128 reduces chip count and PCB complexity while remaining within the same automotive qualification envelope.
Recomendado
Industrial CAN Node Endpoint
Industrial automation cabinets host multiple CAN-enabled sensor/actuator nodes where the MC9S12DB128MPVE acts as the embedded CAN node endpoint, performing local measurement (analog inputs via ATD, frequency inputs via timers) and communicating frames back to the central PLC via MSCAN. The 128 KB FLASH supports protocol stacks such as CANopen and DeviceNet, plus customer-specific application code, while 8 KB of RAM holds stack buffers. Compared with a discrete 8-bit MCU plus external CAN controller, the DB128 reduces BOM and improves EMC robustness through HCS12's automotive heritage. The 112-LQFP package and industrial-friendly pinout ease drop-in design across node families.
Recomendado
Building Automation Panel
Building automation panels for HVAC, lighting, and access control rely on the MC9S12DB128MPVE's mix of CAN, SCI/UART, and SPI interfaces to bridge field buses with the management controller. The HCS12 core handles deterministic scheduling of damper/valve actuators while the integrated timers generate the PWM needed for LED dimming. Compared with a 32-bit Cortex-M0 alternative, the DB128 offers lower cost per node at the trade-off of leaving more work to the firmware designer and paying closer attention to RAM budgeting. The 112-LQFP industrial-grade footprint supports both hand-soldered prototypes and full SMT production runs.
Recomendado
Sensor Hub / Data Aggregator
In sensor hubs that aggregate multiple analog/digital sensors before forwarding data over CAN, the MC9S12DB128MPVE's 91 I/O lines accept the multiplexed sensor inputs while the on-chip ATD channels perform 10-bit conversion. The HCS12 core sequences the reads, performs calibration, and packages results into CAN frames via MSCAN within the requested update period. AUTOMOTIVE temperature grade resilience lets the same firmware serve under-hood applications as well as cabin-tier nodes. Compared with a bare HC11 plus external ADC approach, the DB128 integrates both on one die, reducing board area and improving reliability through fewer interconnects.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S12DB128MPVE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S12DG128MPVE | MC9S12B128MPVE | MC9S12DJ128MPVE |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same |
| Program Memory (FLASH) | 128 KB | 128 KB | 128 KB | 128 KB |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB |
| Maximum CPU Clock | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Number of I/O | 91 | 91 | 91 | 91 |
| Core Architecture | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) |
| HCS12 Sub-Family | DB128 (rich peripheral mix) | DG128 | B128 (fewer peripherals) | DJ128 |
| Automotive Temp Grade | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
Principais diferenciais
- 112-LQFP footprint with 91 I/O lines, the largest pin count in the HCS12 DB sub-family (vs MC9S12B128MPVE)
- On-chip peripheral mix tuned for body-control clusters with multiple MSCAN controllers (vs MC9S12DG128MPVE)
- Long-running platform with established BDM toolchain and CodeWarrior legacy (vs Newer S32K11x MCU)
Notas de projeto
The 112-LQFP (20x20 mm, 0.5 mm pitch) lands require a per-JEDEC-95-compatible 4-layer PCB pad pattern with full-perimeter ground and 5 mm of uninterrupted ground pour beneath the die. Provide bulk 100 nF X7R decouplers on each VDD/VSS pair listed in the HCS12DB datasheet, plus a 4.7 uF tantalum or polymer bulk capacitor near the regulator feed. Traces from BGND/VPP to the BDM header should be less than 50 mm to preserve debug-clock integrity on noisy modules.
Do not tie BKGD directly to VDD at power-up; the BGD pin is bidirectional and requires the standard BDM pod as defined in the HCS12 Core Reference Manual. Leaving the MOD/COD strapping pins floating can lock the device in an unexpected operating mode on reset. For automotive designs using the DB128 sub-family, ensure the VDDV/VSSV pair that feeds the internal voltage regulator has 1 uF and 470 nF decoupling within 5 mm of the pins to avoid erratic logic at low temperatures.
Route CANH/CANL as a differential pair with 120 ohm characteristic impedance and place the TJA1050 (or equivalent) transceiver within 30 mm of the CAN bus connector. Keep high-current PWM traces (driving lamps or motors) away from the analog AVCC/AVSS supply and the ATD input pins to minimize coupled noise during ADC conversions, especially at -40 C cold-crank automotive conditions.
The HCS12 external bus interface is multiplexed; address and data share pins, so use pull-ups on address-latch enable traces if a footner mode is enabled to avoid data corruption during bus read cycles. When running the CPU at 25 MHz the shortest allowable instruction cycle is one bus cycle (40 ns); sequence critical interrupt-service routines to fit within the worst-case interrupt latency budget before assuming real-time behavior.
Estimated: At 25 MHz CPU clock and full peripheral activity the DB128 typically draws in the order of 60-80 mA from a 5 V rail; with all I/O unloaded, I/O current is near zero and quiescent current falls below 20 mA. Budget at least 1.5x this number for the regulator headroom so transient currents on motor PWM edges do not drop VDD below 4.5 V.
Informações de conformidade
RoHS and REACH compliance per NXP product packaging/legislative documentation; AUTOMOTIVE temperature grade per Freescale/NXP part stack data; AEC-Q100 qualification status sourced from automotive-grade designation. Halogen-free status not explicitly listed in distributor pages - set to unknown.
