NXP Semiconductors

MC9S12XD256CAL - 16-bit 80MHz 256KB Flash MCU | NXP | Automotive

N.º da peça: MC9S12XD256CAL ✗ Fim de vida
Em estoque Enviado em 1 a 3 dias úteis
2.35 V to 2.75 V Vdss 112-LQFP (20x20 mm) Package 80 MHz Speed 256 KB (256K x 8) Memory
A partir de $17.2 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-10-18
Preços por volume
Qtd. Preço unitário Total
1 $23.18 $23,18
10 $21.9 $219,00
100 $20.1 $2.010,00
500 $18.6 $9.300,00
1.000 $17.2 $17.200,00
ℹ️ Todos os preços estão em USD

MC9S12XD256CAL Visão geral

The NXP (Freescale) MC9S12XD256CAL is a 16-bit HCS12X automotive microcontroller running at 80 MHz bus frequency with 256 KB of on-chip flash memory and 12 KB of RAM, housed in a 112-pin LQFP (20x20 mm) surface-mount package. It is AEC-Q100 qualified for automotive applications.

A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, memory, and programmable peripherals into one chip, forming the lowest programmable layer of the embedded systems hierarchy: MCU -> embedded processor -> microprocessor -> semiconductor device. The HCS12X family is NXP's enhanced 16-bit CISC architecture, upward compatible with the earlier HCS12 (S12) instruction set, so existing HCS12 firmware migrates with minimal changes.

Key features of the MC9S12XD256CAL include the HCS12X CPU with instruction queue and enhanced indexed addressing, 256 KB (256K x 8) flash program memory, a phase-locked loop (PLL)-based clock and reset generator (CRG) that multiplies an external crystal up to the 80 MHz bus rate, multiple serial communication interfaces (SCI, SPI), a controller area network (CAN) module for vehicle networks, and an analog-to-digital converter. The device operates from a 5 V supply with a 2.5 V regulated core, a combination typical of the S12XD family.

The XGATE co-processor architecture of the S12XD generation offloads interrupt handling and communication tasks from the main CPU, effectively providing an additional 100 MIPS of concurrent processing throughput for protocol stacks and I/O management.

Typical applications include automotive body control modules, HVAC controllers, dashboard and instrument clusters, gateways between CAN networks, and industrial control systems that benefit from the robust 5 V noise immunity and CAN connectivity.

Design consideration: because the part is listed NRND (Not Recommended for New Designs) on the NXP product page, new designs should evaluate the S12XE or MagniV families, while existing designs can continue sourcing through authorized excess-stock channels.

This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet.

Alternativas drop-in para MC9S12XD256CAL — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com MC9S12XD256CAL (mesmo formato e footprint) — diferindo em Package, Operating Temperature, ADC, Timers, Core Processor.

NXP Semiconductors
Package: 80-LQFP (14x14 mm)
ADC: 8-channel 10-bit
Core Processor: HCS12X
Comparar com MC9S12XD256CAL →
NXP Semiconductors
Core Processor: HCS12X (S12XA), 16-bit CISC
Comparar com MC9S12XD256CAL →
NXP Semiconductors
Package: 112-LQFP (20 x 20 mm)
Operating Temperature: -40 °C to +125 °C (automotive grade)
ADC: 16-channel, 12-bit, 2.5 µs conversion
Comparar com MC9S12XD256CAL →
NXP Semiconductors
Package: 144-pin LQFP (20x20 mm)
Operating Temperature: -40C to +85C
ADC: 16-channel, 10-bit
Comparar com MC9S12XD256CAL →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +85C (automotive grade)
ADC: 2 x 10-bit ADC, up to 24 channels
Comparar com MC9S12XD256CAL →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +85C (TA)
Timers: Enhanced Capture Timer (ECT), Periodic Interrupt Timer (PIT), Real Time Interrupt (RTI)
Comparar com MC9S12XD256CAL →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

MC9S12XD256MAL

✅ Drop-In
NXP Semiconductors
📦 112-LQFP
HCS12X (CISC, 16-bit) · 80 MHz · 256 KB Flash · 12 KB · 4 KB · 2.35 V to 2.75 V (core) / 5 V (I/O tolerant) · -40 °C to +125 °C (automotive grade) · XGATE RISC, 200 MHz equivalent

✓ Em estoque

$17.85 / unidade

Ver ficha técnica →

MC9S12XDT256CAG

✅ Drop-In ⚠️ Especificações não verificadas
NXP Semiconductors
📦 112-LQFP
HCS12X (16-bit CISC with XGATE co-processor) · 256 KB Flash · 16 KB · 4 KB · 80 MHz · 2.35 V to 2.75 V · 4.5 V to 5.5 V · 119

✓ Em estoque

$17.4 / unidade

Ver ficha técnica →

MC9S12XEQ384CAG

✅ Drop-In ⚠️ Especificações não verificadas
NXP Semiconductors
📦 112-LQFP
HCS12X (16-bit CISC) · 16-bit · 50 MHz · XGATE RISC co-processor · 384 KB (384K x 8) · 24K x 8 · Hardware-emulated EEPROM (programmable, flexible) · 12-bit

✓ Em estoque

Consulte o preço

Ver ficha técnica →

MC9S12XEP768CAG

✅ Drop-In ⚠️ Especificações não verificadas
NXP Semiconductors
📦 112-LQFP
HCS12X (16-bit) with XGATE co-processor · 50 MHz · 768 KB (768K x 8) with ECC · 32 KB · 1.8V / 2.8V / 5V · -40C to +85C (automotive grade)

✓ Em estoque

$19.85 / unidade

Ver ficha técnica →

MC9S12XA256CAAR

✅ Drop-In ⚠️ Especificações não verificadas
NXP Semiconductors
📦 112-LQFP
HCS12X · 16-Bit · 80 MHz · 256 KB (256K x 8) Flash · 16 KB · 4 KB · 59 · 80-LQFP (14x14 mm)

✓ Em estoque

$9.95 / unidade

Ver ficha técnica →

MC9S12XD256CAL Classificações máximas e características elétricas

Core Processor HCS12X (16-bit CISC)
Core Size 16-bit
Bus Frequency 80 MHz
Flash Memory 256 KB (256K x 8)
RAM Size 12 KB
Supply Voltage (VDD) 2.35 V to 2.75 V
I/O Voltage 5 V (2.5 V/5 V dual rail)
I/O Count 119 I/O ports
Peripherals CRG (clocks and reset generator), SCI, SPI, CAN, ADC
Connectivity CANbus, SCI, SPI
Temperatura de operação -40C to +125C (automotive grade A suffix)
Qualification AEC-Q100 (automotive)
Encapsulamento 112-LQFP (20x20 mm)
Tipo de montagem Surface Mount
Packaging Tray
Status RoHS Compliant

Guia de Configuração de Pinos do MC9S12XD256CAL 112-lqfp (20x20 mm)

Configuração de pinos para MC9S12XD256CAL (pacote 112-lqfp (20x20 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.

Diagrama de pinagem do pacote 112-lqfp (20x20 mm) para MC9S12XD256CAL

Nenhum dado detalhado de pinagem disponível para MC9S12XD256CAL.

Consulte a ficha técnica para a configuração completa dos pinos.

Aplicações típicas

MC9S12XD256CAL é adequado para 6 aplicaçãos: Automotive Body Control Modules, Instrument Clusters and Dashboards, CAN Network Gateways, HVAC Control Modules, Industrial Control Systems, Engine and Powertrain Auxiliary Controllers.

🚗

Automotive Body Control Modules

The MC9S12XD256CAL fits body control modules (BCM) because its AEC-Q100 qualification, -40C to +125C temperature rating, and 5 V I/O noise immunity match the harsh electrical environment of vehicle cabins and engine bays. Its 119 I/O lines drive relays, lamp loads, and switch matrices directly, while the integrated CAN interface connects the module to the vehicle network without an external protocol chip. In a typical BCM, the 80 MHz HCS12X core runs the state machine for load control while polling ADC channels for switch and sensor diagnostics; the 256 KB flash accommodates full firmware plus diagnostic bootloaders (UDS/KWP2000). Designers should budget flash headroom for OTA-style update code, which is a reason the pin-compatible XEP768 variant is often chosen for BCM redesigns.

🚗

Instrument Clusters and Dashboards

Dashboard and instrument-cluster controllers benefit from the MC9S12XD256CAL's combination of timer channels for stepper-motor gauge drive, ADC inputs for fuel and temperature sensing, and CAN connectivity for vehicle-speed and engine data. The 80 MHz bus speed provides margin for real-time gauge update rates and LCD segment refresh, and the 12 KB RAM holds display buffers and diagnostic frames. Because clusters remain powered in accessory mode, the CRG-based low-power clock modes reduce standby current. The 112-LQFP 20x20 mm footprint suits the dense multi-gauge PCB of a cluster. Note the part's NRND status: new cluster platforms should instead adopt the pin-compatible S9S12XE/S12G family, reusing the same layout with firmware changes for the revised peripheral map.

🌐

CAN Network Gateways

Gateway nodes bridging multiple CAN buses suit the MC9S12XD256CAL because the S12XD generation pairs the main CPU with an XGATE co-processor that independently services CAN message queues, filtering and forwarding frames without loading the core. The 80 MHz bus and instruction queue sustain inter-bus forwarding latency in the tens of microseconds required by powertrain and chassis networks. The 256 KB flash holds protocol conversion tables plus OBD diagnostics. Gateway designs pair the MCU with high-speed CAN transceivers on each bus and a system basis chip for wake-up handling. Since the device is NRND, high-volume gateway programs should qualify the S12XE-based pin-compatible upgrade early to secure long-term supply.

🏭

HVAC Control Modules

Automotive HVAC controllers use the MC9S12XD256CAL to blend-air door actuators, blower PWM stages, and temperature sensor networks on one 5 V board. The ADC reads NTC thermistors for cabin and evaporator temperature, timer channels generate PWM for blower-speed control, and the CAN link reports status to the climate-control master. The 119 I/O count covers multiple stepper-driven flap actuators without port expanders, and the -40C to +125C range covers under-dash and near-engine mounting positions. The 256 KB flash stores control laws plus seat-heating and defrost logic. Designers should implement watchdog-based failsafe actuator shutdown, since HVAC faults can obscure windshields - the CRG's watchdog module supports this.

🏭

Industrial Control Systems

Beyond vehicles, the MC9S12XD256CAL serves industrial control nodes where 5 V noise immunity and a CISC 16-bit core with large flash simplify legacy maintenance. Typical roles include motor-control sequencers, pump and valve controllers, and sensor-hub boards that speak CANopen or DeviceNet over its CAN module. The 80 MHz performance handles PID loops at kHz rates, while 119 I/O lines interface limit switches, relays, and H-bridge drivers. The 256 KB flash supports field-updatable firmware with dual-bank bootloaders. For industrial new builds the NRND status matters less than for automotive because industrial programs have shorter lives, but designers should still note that the pin-compatible S12XE family offers an active migration path with identical footprint.

⚡

Engine and Powertrain Auxiliary Controllers

Auxiliary powertrain controllers - fan-speed modules, throttle-body controllers, exhaust-flap actuators - fit the MC9S12XD256CAL's profile: AEC-Q100 grade, 125C ambient capability, fast ADC sampling of position sensors, and CAN communication with the ECU. The HCS12X core's deterministic CISC execution simplifies safety-related timing analysis compared with pipelined RISC parts, and the CRG provides the watchdog and clock monitoring required for fault-tolerant actuator control. The 256 KB flash stores calibration tables alongside code, and the 12 KB RAM keeps sensor-filtering buffers on-chip. Underhood placement demands careful PCB thermal design with 2 oz copper and thermal vias at the LQFP's exposed footprint region.

Resumo dos produtos recomendados

TJA1050 NXP Semiconductors Usado em: Automotive Body Control Modules MC33989 SBC power supply for S12 family Usado em: Automotive Body Control Modules, HVAC Control Modules, Engine and Powertrain Auxiliary Controllers MC33903 System basis chip for cluster power Usado em: Instrument Clusters and Dashboards TJA1042 NXP Semiconductors Usado em: Instrument Clusters and Dashboards TJA1043 CAN transceiver with partial networking Usado em: CAN Network Gateways MC33907 SBC with CAN wake-up Usado em: CAN Network Gateways TJA1051 CAN transceiver Usado em: HVAC Control Modules MCP2551 CAN transceiver for industrial bus Usado em: Industrial Control Systems MC33926 Motor driver companion Usado em: Industrial Control Systems TJA1055 Fault-tolerant CAN/LIN transceiver Usado em: Engine and Powertrain Auxiliary Controllers
What is the MC9S12XD256CAL microcontroller?
The MC9S12XD256CAL is an NXP (Freescale) 16-bit HCS12X automotive microcontroller with a 256 KB flash memory, 80 MHz bus speed, and a 112-pin LQFP (20x20 mm) package. It belongs to the S12XD family, is AEC-Q100 qualified, and includes CAN, SCI, SPI, ADC, and a clock and reset generator (CRG) module. According to NXP's product page, the device is currently listed NRND (Not Recommended for New Designs).
What is the price of MC9S12XD256CAL?
As of 2026-10-18, the MC9S12XD256CAL is priced from approximately $23.18 for a single unit at LCSC, with volume pricing decreasing at 10/100/500/1000-piece breaks on the XAIPART tier table. Because the device is NRND, authorized-distributor stock may fluctuate and excess-stock brokers often hold inventory; always confirm quantity pricing and date codes at time of order.
Is MC9S12XD256CAL still in production and can I buy it?
The MC9S12XD256CAL is listed NRND on the official NXP product page, meaning it is not recommended for new designs but remains purchasable from remaining inventory. Distributors such as DigiKey, Mouser, Arrow, and LCSC list stock, and Rochester Electronics provides lifecycle support. Buy only from authorized sources to avoid counterfeit risk, since NRND automotive parts are a common counterfeiting target.
Where can I download the MC9S12XD256CAL datasheet PDF?
The MC9S12XD256CAL datasheet is available as a free PDF download from the official NXP product page at nxp.com/part/MC9S12XD256CAL under the Data Sheet section. The S12XD family reference manual covers the full peripheral set including the CRG module. Avoid third-party mirror sites such as alldatasheet or digchips when the manufacturer's original document is available, as NXP documents may have revisions not reflected on mirrors.
What is the difference between MC9S12XD256CAL and MC9S12XD256MAL?
The two parts differ only in package/temperature ordering code: both are S12XD devices with 256 KB flash and 80 MHz bus speed, and the Xecor comparison database reports identical performance profiles across primary parameters with no measurable differences. The MAL suffix denotes a different package/grade variant than the CAL 112-LQFP automotive variant. Verify the exact package outline in the ordering-info table of the NXP datasheet before substituting.
What is the best drop-in replacement for MC9S12XD256CAL?
The best drop-in replacement is MC9S12XD256MAL, the same die in a different ordering-code variant, followed by other 112-pin LQFP S12XD-family members such as MC9S12XDT256CAG (same flash, extended temperature features). For designs migrating away from the NRND part, MC9S12XEP768CAG is pin-compatible on the 112-LQFP footprint with a larger 768 KB flash, allowing firmware headroom without PCB changes. All replacements require the same 5 V I/O power domain.
MC9S12XD256CAL vs MC9S12XEP768CAG - which should I choose?
Choose MC9S12XD256CAL only for maintaining existing designs, since it is NRND. Choose MC9S12XEP768CAG for new or refreshed designs: it uses the newer S12XE core in the same 112-LQFP footprint with 768 KB flash versus 256 KB - three times the code space - plus an XGATE co-processor. Both run 5 V I/O with CAN/SCI/SPI peripherals, so the S12XE typically requires only minor clock configuration changes to firmware.
When should I choose MC9S12XD256CAL over MC9S12XDT256CAG?
Choose the MC9S12XD256CAL when your bill of materials, existing firmware validation, or automotive customer qualification already specifies the CAL variant - requalification cost usually outweighs component differences. Choose MC9S12XDT256CAG when starting a new PCB layout or when the DT sub-family peripheral set (enhanced TIM timer suite) better matches your timing requirements. Both share the HCS12X core, 256 KB flash, and 112-pin LQFP package.
Is there a cross-brand equivalent for MC9S12XD256CAL?
No direct cross-vendor drop-in equivalent exists for the MC9S12XD256CAL. The HCS12X architecture, its 5 V I/O domain, and the S12XD peripheral map are proprietary to NXP (formerly Freescale), so ST, Infineon, and Renesas 16-bit MCUs are functional substitutes only, requiring PCB and firmware redesign. The ETEI cross-reference database confirms that the closest equivalents are other 256 KB HCS12XD/XDG family members from NXP itself.
What are the key specifications of MC9S12XD256CAL that engineers should know?
The MC9S12XD256CAL is a 16-bit HCS12X CISC microcontroller: 80 MHz bus frequency, 256 KB flash, 12 KB RAM, 119 I/O lines, 2.35-2.75 V core supply with 5 V I/O, CAN/SCI/SPI connectivity, integrated clock and reset generator, AEC-Q100 automotive qualification, -40C to +125C operation, and a 112-pin LQFP (20x20 mm) surface-mount package in trays. Status is NRND per NXP. These parameters define both its automotive suitability and its migration path.
Does MC9S12XD256CAL support CAN bus for automotive networks?
Yes, the MC9S12XD256CAL includes CAN controller peripherals, as listed in the DigiKey specification for the part (Connectivity: CANbus, SCI, SPI). This makes it suitable for body electronics, gateways, and node controllers on vehicle CAN networks. An external CAN transceiver, such as an NXP TJA1050/TJA1042, is required to drive the physical differential bus, since the MCU integrates only the protocol controller.
What supply voltage does the MC9S12XD256CAL require?
The MC9S12XD256CAL requires a 2.35 V to 2.75 V core supply (nominally 2.5 V) alongside a 5 V I/O supply, matching the Arrow listing of 2.5V/5V operation. In practice, the 5 V rail is applied and an on-chip regulator or external 2.5 V rail powers the core depending on the board design; consult the power-supply chapter of the S12XD family datasheet. Decouple both rails with 0.1 uF ceramics at each supply pin pair.
Can MC9S12XD256CAL run my existing HCS12 (S12) firmware?
Yes, largely. The HCS12X CPU is upward compatible with the HCS12 instruction set: interrupt stacking and the programmer's model are identical to HCS12, with enhancements including an instruction queue and enhanced indexed addressing, per the Freescale datasheet feature list. Code compiled for an S12 device typically runs on the S12XD after adjusting the clock configuration and linker memory map; peripheral register addresses may differ between families and should be verified.
What is the lead time and stock availability for MC9S12XD256CAL?
Because the MC9S12XD256CAL is NRND, lead times vary by channel: DigiKey and Mouser list same-day shipping from existing stock (

Dados de referência de engenharia para MC9S12XD256CAL — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the MC9S12XD256CAL when you are maintaining or re-qualifying an existing HCS12XD design whose firmware, calibration data, and automotive customer validation are already built on the S12XD dual-supply platform - requalification cost almost always exceeds any migration benefit here. For new PCB designs, select MC9S12XEP768CAG instead: same 112-LQFP footprint, active lifecycle status, and 3x the flash (768 KB vs 256 KB), needing only firmware-level peripheral map changes. Choose MC9S12XD256MAL when the AEC-Q100 CAL grade is not contractually required and cost matters. Choose MC9S12XDT256CAG if your application depends on the DT sub-family's enhanced timer suite. Cross-brand alternatives do not exist as drop-ins - any ST, Infineon, or Renesas substitute is a redesign-level change, not a replacement. Confirm stock at time of order since all XDX variants are NRND.

Comparação com alternativas

Parâmetro Este produto MC9S12XD256MAL MC9S12XDT256CAG MC9S12XEP768CAG
Package 112-LQFP (20x20 mm) 112-LQFP - same footprint 112-LQFP - same footprint 112-LQFP - same footprint
Brand NXP Semiconductors (Freescale) NXP Semiconductors (Freescale) NXP Semiconductors (Freescale) NXP Semiconductors (Freescale)
Core / Bus Speed HCS12X 16-bit @ 80 MHz HCS12X 16-bit @ 80 MHz HCS12X 16-bit @ 80 MHz S12XE 16-bit @ 50 MHz
Flash Memory 256 KB 256 KB 256 KB 768 KB
Supply Voltage 2.35-2.75 V core / 5 V I/O 2.35-2.75 V core / 5 V I/O 5 V single-supply 5 V single-supply
Lifecycle Status NRND NRND NRND / limited availability Active

Principais diferenciais

  • Largest flash among same-package 256 KB-class alternatives at same cost tier is not available - instead the CAL grade adds AEC-Q100 automotive qualification (vs MC9S12XD256MAL)
  • Active-state 3x flash upgrade without PCB change (vs MC9S12XEP768CAG)
  • S12XD dual-supply architecture (2.5 V core / 5 V I/O) (vs MC9S12XDT256CAG)

Notas de projeto

The MC9S12XD256CAL requires a 2.35-2.75 V core rail in addition to the 5 V I/O domain (per the digchip specification table listing supply voltage 2.35 to 2.75 V). Provide independent decoupling - 0.1 uF ceramic at each VDD/VDDIO pin pair plus 10 uF bulk - and sequence the 5 V rail so the core rail is never driven above 2.75 V. If using an NXP system basis chip such as the MC33989, its built-in sequencing and watchdog satisfy most automotive power-supply requirements for S12XD designs.

At the 80 MHz bus frequency produced by the CRG PLL, keep the crystal and PLL loop-filter components within 10 mm of the EXTAL/XTAL pins and route the filter as a quiet analog island with a local ground. Unused I/O should be configured as outputs driving low or inputs with pull-ups to prevent floating-pin EMI. The S12XD hardware design application notes from NXP (AN-level guides for the S12XD family) provide reference layouts; follow the single-point ground recommendation for mixed 5 V I/O and analog ADC sections.

The most common pitfall is ignoring the NRND status: designs qualified on this part must plan a last-time-buy or migration strategy now. The pin-compatible MC9S12XEP768CAG (S12XE, active) minimizes PCB rework, but its peripheral map differs slightly, so firmware registers must be re-validated. Also, the 112-LQFP has a 0.5 mm pin pitch - inspect solder joints with X-ray or AOI, since bridging on fine-pitch S12 packages is a leading field-return cause. Do not exceed the 2.75 V core maximum during debugging with external supplies.

Informações de conformidade

RoHS
Compliant
REACH
Unknown
AEC-Q100
Qualified
Sem chumbo
Yes
Sem halogênios
Unknown
Minerais de conflito
Unknown

AEC-Q100 automotive qualification confirmed by Arrow product listing. RoHS compliance and lead-free status standard for NXP S12XD automotive family; REACH and halogen-free status not stated in the provided data.

Dados verificados em: 2026-10-18 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

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Componentes & termos relacionados

NXP Semiconductors Freescale Semiconductor MC9S12XD256CAL MC9S12XD256MAL MC9S12XDT256CAG MC9S12XEP768CAG MC9S12XEQ384CAG HCS12X S12XD family microcontroller 16-bit CISC CPU AEC-Q100 NRND 112-LQFP QFP package family surface mount CAN bus XGATE co-processor clock and reset generator (CRG) body control module instrument cluster flash memory RoHS
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