NT5CC256M16CP-DIB1 - 4Gb DDR3L SDRAM 256Mx16 | Nanya
N.º da peça: NT5CC256M16CP-DIB1 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.8 | $78,00 |
| 100 | $7.1 | $710,00 |
| 500 | $6.5 | $3.250,00 |
| 1.000 | $6 | $6.000,00 |
NT5CC256M16CP-DIB1 Visão geral
DDR3L SDRAM is a type of dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption while maintaining high bandwidth. It is part of the memory hierarchy in computing systems, serving as the main system memory for processors, and is widely used in embedded systems, networking equipment, and automotive infotainment.
Key features include a 4Gb density, 16-bit I/O width, 8 internal banks, programmable CAS latency (CL) and write latency (CWL), on-die termination (ODT), and a configurable output drive strength. The device supports a burst length of 8 and a burst chop of 4, with a self-refresh mode for low-power standby. The -DIB1 speed grade indicates DDR3L-1600 with timing parameters of CL=11, CWL=8, and tRCD/tRP=11.
The architecture uses a 70nm process technology, providing a balance of performance and power efficiency. The differential clock inputs and data strobes ensure signal integrity for high-speed operation. The device includes programmable mode registers for flexible configuration, and it supports DLL-off mode for reduced power consumption in low-frequency applications.
Typical applications include solid-state drives (SSDs), network routers, industrial automation controllers, automotive infotainment systems, and embedded computing platforms. The low 1.35V operation makes it ideal for power-sensitive designs, while the industrial and automotive temperature grades ensure reliability in harsh environments.
When designing with this device, ensure proper decoupling capacitors near the power pins and follow the PCB layout guidelines for DDR3 routing to maintain signal integrity. The device requires a 1.35V supply and a separate VDDQ, with careful attention to the reference voltage (VREF) for the address and control signals.
Alternativas drop-in para NT5CC256M16CP-DIB1 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com NT5CC256M16CP-DIB1 (mesmo formato e footprint) — diferindo em Package, Data Rate, Supply Voltage, Burst Length, CAS Latency.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
NT5CB256M16CP-DII
✅ Drop-In✓ Em estoque
$5.5682 / unidade
Ver ficha técnica →NT5CB256M16CP-DIH
✅ Drop-In✓ Em estoque
$6.5 / unidade
Ver ficha técnica →NT5CB256M16CP-DI
✅ Drop-In✓ Em estoque
$6.5 / unidade
Ver ficha técnica →AS4C256M16D3LC-12BIN
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$42 / unidade
Ver ficha técnica →IS43TR16256A-125KBLA2
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MT41K256M16HA-125IT:E
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4.5 / unidade
Ver ficha técnica →NT5CC256M16CP-DIB1 Classificações máximas e características elétricas
| Tipo de memória | DDR3L SDRAM |
| Density | 4Gb |
| Organização da memória | 256M x 16 |
| Tensão de alimentação | 1.35V |
| Taxa de dados | 1600Mbps (DDR3L-1600) |
| Encapsulamento | TFBGA-96, 9x13mm, 0.8mm pitch |
| Number of Banks | 8 |
| CAS Latency (CL) | 11 |
| Write Latency (CWL) | 8 |
| tRCD/tRP | 11 |
| Burst Length | 8 (BL8) and 4 (BC4) |
| Temperatura de operação | 0C to +95C (Tcase) |
| RoHS | Compliant |
| Livre de halogênio | Yes |
| Lead Free | Yes |
Configuração de pinos do NT5CC256M16CP-DIB1
| Pino A1 | VDD — Power supply (1.35V) |
| Pino A2 | VSS — Ground |
| Pino A3 | DQ0 — Data input/output 0 |
| Pino A4 | DQ1 — Data input/output 1 |
| Pino A5 | VDDQ — DQ power supply |
| Pino A6 | DQ2 — Data input/output 2 |
| Pino A7 | DQ3 — Data input/output 3 |
| Pino A8 | VSSQ — DQ ground |
| Pino A9 | DQ4 — Data input/output 4 |
| Pino A10 | DQ5 — Data input/output 5 |
| Pino A11 | VDDQ — DQ power supply |
| Pino A12 | DQ6 — Data input/output 6 |
| Pino A13 | DQ7 — Data input/output 7 |
| Pino A14 | VSS — Ground |
| Pino A15 | VDD — Power supply |
Aplicações típicas
NT5CC256M16CP-DIB1 é adequado para 6 aplicaçãos: Embedded Computing, Networking Equipment, Automotive Infotainment, Industrial Automation, Solid-State Drives (SSD), Test and Measurement.
Embedded Computing
The NT5CC256M16CP-DIB1 provides 4Gb of DDR3L memory for embedded processors, offering high bandwidth and low power. Its 1.35V operation reduces thermal load, making it suitable for compact industrial PCs and single-board computers. The 256Mx16 organization simplifies board layout with fewer chips, and the industrial temperature range ensures reliability in factory automation and outdoor kiosks.
Recomendado
Networking Equipment
In routers, switches, and network appliances, the NT5CC256M16CP-DIB1 provides fast packet buffering and routing table storage. Its 1600Mbps data rate supports high-throughput processing, while the low 1.35V supply minimizes power in always-on equipment. The 8 internal banks enable efficient interleaving for reduced latency, and the TFBGA package allows dense PCB layouts in space-constrained line cards.
Recomendado
Automotive Infotainment
The NT5CC256M16CP-DIB1 is designed for automotive infotainment systems, providing reliable memory for navigation, audio, and display processing. Its automotive temperature grade (-40C to +95C) ensures operation in extreme environments, and the 1.35V supply reduces heat in sealed dashboards. The high bandwidth supports smooth graphics rendering and quick boot times, while the JEDEC compliance ensures compatibility with automotive SoCs.
Recomendado
Industrial Automation
For PLCs, robotics, and industrial controllers, the NT5CC256M16CP-DIB1 offers robust memory with a wide temperature range and low power consumption. Its 4Gb density supports complex control algorithms and data logging, while the 1.35V operation reduces energy costs in 24/7 operation. The device's reliability in harsh environments makes it suitable for factory floors and outdoor installations.
Recomendado
Solid-State Drives (SSD)
The NT5CC256M16CP-DIB1 is used as DRAM cache in SSDs, improving random read/write performance and extending flash lifespan. Its high bandwidth and low latency enable fast data buffering, while the 1.35V supply reduces power in portable SSDs. The small TFBGA package allows compact drive designs, and the industrial temperature grade supports enterprise and automotive storage.
Recomendado
Test and Measurement
In oscilloscopes, signal analyzers, and data acquisition systems, the NT5CC256M16CP-DIB1 provides high-speed data buffering for capturing and processing signals. Its 1600Mbps data rate supports real-time sampling, while the 8 banks enable efficient data interleaving. The low power consumption is beneficial for portable instruments, and the industrial temperature range ensures accuracy in varying environments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para NT5CC256M16CP-DIB1 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | NT5CB256M16CP-DII | AS4C256M16D3LC-12BIN | IS43TR16256A-125KBLA2 |
|---|---|---|---|---|
| Package | TFBGA-96 | TFBGA-96 | TFBGA-96 | TFBGA-96 |
| Brand | Nanya Technology | Nanya Technology | Alliance Memory | ISSI |
| Density | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Data Rate | 1600Mbps | 1866Mbps | 1600Mbps | 1600Mbps |
| CAS Latency | 11 | 13 | 11 | 11 |
| Operating Temperature | 0C to +95C | 0C to +95C | -40C to +95C | -40C to +95C |
Principais diferenciais
- Lower voltage operation (vs Standard DDR3 parts)
- Automotive and industrial temperature grades (vs Commercial-only parts)
- High density in a small package (vs Lower density alternatives)
Notas de projeto
For DDR3L routing, maintain 50-ohm single-ended and 100-ohm differential impedance for DQ, DQS, and clock signals. Keep trace lengths matched within 50 mils for each byte lane. Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin, and use a solid ground plane beneath the memory device to minimize noise.
The NT5CC256M16CP-DIB1 requires a clean 1.35V supply for VDD and VDDQ. Use a low-dropout regulator or a switching regulator with low ripple (<50mV) to avoid data corruption. Ensure the VREF voltage is set to 0.675V (half of VDDQ) with a precision resistor divider and bypass capacitor.
Although the device operates at 1.35V, it can dissipate significant power during heavy read/write activity. Ensure adequate airflow or a thermal pad on the PCB to keep the case temperature below 95C. For industrial applications, consider derating the data rate if ambient temperatures exceed 85C.
Informações de conformidade
RoHS and halogen-free per datasheet. AEC-Q100 not applicable for DRAM; automotive grade is per Nanya's own qualification.
