NT5CB256M16CP-DI - 4Gb DDR3L SDRAM 256Mx16 | Nanya
N.º da peça: NT5CB256M16CP-DI ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.8 | $78,00 |
| 100 | $7.2 | $720,00 |
| 500 | $6.8 | $3.400,00 |
| 1.000 | $6.5 | $6.500,00 |
NT5CB256M16CP-DI Visão geral
DDR3L SDRAM is a type of dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by about 20% while maintaining similar performance. It is part of the DDR3 memory family, which uses double data rate architecture to transfer data on both edges of the clock. DDR3L is widely used in mobile, embedded, and industrial applications where power efficiency is critical.
Key features include a 256Mx16 organization (4Gb density), 1.35V supply voltage, 96-ball TFBGA package, and support for data rates up to 1600 Mbps/pin. The device has a programmable CAS latency of 5-11, write latency of 5-9, and additive latency of 0-13. It also features 8 internal banks, differential clock inputs, and on-die termination. The operating temperature range is -40°C to +95°C (industrial) and -40°C to +105°C (automotive).
The NT5CB256M16CP-DI uses a 70nm process technology, enabling high density and low power consumption. It incorporates DLL (delay-locked loop) for precise timing, and supports self-refresh and partial array self-refresh for power saving. The device is RoHS compliant and lead-free.
Typical applications include embedded systems, networking equipment, industrial automation, automotive infotainment, and solid-state drives. Its low voltage and wide temperature range make it suitable for harsh environments.
When designing with this memory, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to minimize signal integrity issues. The device requires a stable 1.35V supply and reference voltage (VREF) for optimal operation.
Alternativas drop-in para NT5CB256M16CP-DI — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com NT5CB256M16CP-DI (mesmo formato e footprint) — diferindo em Package, Data Rate, Supply Voltage, Operating Temperature, Burst Length.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
NT5CB256M16DP-DI
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
NT5CB256M16CP-DII
✅ Drop-In✓ Em estoque
$5.5682 / unidade
Ver ficha técnica →MT41K256M16HA-125
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6.3636 / unidade
Ver ficha técnica →K4B4G1646E-BYMA
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$14.3182 / unidade
Ver ficha técnica →IS43TR16512B-125K
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
NT5CB256M16CP-DI Classificações máximas e características elétricas
| Tipo de memória | DDR3L SDRAM |
| Organização da memória | 256M x 16 |
| Density | 4 Gb |
| Tensão de alimentação | 1.35 V (DDR3L) |
| Taxa de dados | 1600 Mbps/pin (max) |
| Encapsulamento | TFBGA-96 |
| Number of Banks | 8 |
| CAS Latency (CL) | 5, 6, 7, 8, 9, 10, 11 |
| Write Latency (CWL) | 5, 6, 7, 8, 9 |
| Additive Latency | 0-13 |
| Faixa de temperatura de operação | -40°C to +95°C (industrial), -40°C to +105°C (automotive) |
| RoHS | Compliant |
| Lead-Free | Yes |
| Differential Clock Input | Yes (CK, CK#) |
| On-Die Termination (ODT) | Yes |
Configuração de pinos do NT5CB256M16CP-DI
| Pino A1 | VDD — Power supply (1.35V) |
| Pino A2 | DQ0 — Data input/output 0 |
| Pino A3 | DQ1 — Data input/output 1 |
| Pino A4 | VSS — Ground |
| Pino A5 | DQ2 — Data input/output 2 |
| Pino A6 | DQ3 — Data input/output 3 |
| Pino A7 | VDD — Power supply (1.35V) |
| Pino A8 | DQ4 — Data input/output 4 |
| Pino A9 | DQ5 — Data input/output 5 |
| Pino A10 | VSS — Ground |
| Pino A11 | DQ6 — Data input/output 6 |
| Pino A12 | DQ7 — Data input/output 7 |
| Pino B1 | VSS — Ground |
| Pino B2 | DQ8 — Data input/output 8 |
| Pino B3 | DQ9 — Data input/output 9 |
| Pino B4 | VDD — Power supply (1.35V) |
| Pino B5 | DQ10 — Data input/output 10 |
| Pino B6 | DQ11 — Data input/output 11 |
| Pino B7 | VSS — Ground |
| Pino B8 | DQ12 — Data input/output 12 |
| Pino B9 | DQ13 — Data input/output 13 |
| Pino B10 | VDD — Power supply (1.35V) |
| Pino B11 | DQ14 — Data input/output 14 |
| Pino B12 | DQ15 — Data input/output 15 |
| Pino C1 | VDD — Power supply (1.35V) |
| Pino C2 | VSS — Ground |
| Pino C3 | VDD — Power supply (1.35V) |
| Pino C4 | VSS — Ground |
| Pino C5 | VDD — Power supply (1.35V) |
| Pino C6 | VSS — Ground |
| Pino C7 | VDD — Power supply (1.35V) |
| Pino C8 | VSS — Ground |
| Pino C9 | VDD — Power supply (1.35V) |
| Pino C10 | VSS — Ground |
| Pino C11 | VDD — Power supply (1.35V) |
| Pino C12 | VSS — Ground |
| Pino D1 | VSS — Ground |
| Pino D2 | VDD — Power supply (1.35V) |
| Pino D3 | VSS — Ground |
| Pino D4 | VDD — Power supply (1.35V) |
| Pino D5 | VSS — Ground |
| Pino D6 | VDD — Power supply (1.35V) |
| Pino D7 | VSS — Ground |
| Pino D8 | VDD — Power supply (1.35V) |
| Pino D9 | VSS — Ground |
| Pino D10 | VDD — Power supply (1.35V) |
| Pino D11 | VSS — Ground |
| Pino D12 | VDD — Power supply (1.35V) |
| Pino E1 | VDD — Power supply (1.35V) |
| Pino E2 | VSS — Ground |
| Pino E3 | VDD — Power supply (1.35V) |
| Pino E4 | VSS — Ground |
| Pino E5 | VDD — Power supply (1.35V) |
| Pino E6 | VSS — Ground |
| Pino E7 | VDD — Power supply (1.35V) |
| Pino E8 | VSS — Ground |
| Pino E9 | VDD — Power supply (1.35V) |
| Pino E10 | VSS — Ground |
| Pino E11 | VDD — Power supply (1.35V) |
| Pino E12 | VSS — Ground |
| Pino F1 | VSS — Ground |
| Pino F2 | VDD — Power supply (1.35V) |
| Pino F3 | VSS — Ground |
| Pino F4 | VDD — Power supply (1.35V) |
| Pino F5 | VSS — Ground |
| Pino F6 | VDD — Power supply (1.35V) |
| Pino F7 | VSS — Ground |
| Pino F8 | VDD — Power supply (1.35V) |
| Pino F9 | VSS — Ground |
| Pino F10 | VDD — Power supply (1.35V) |
| Pino F11 | VSS — Ground |
| Pino F12 | VDD — Power supply (1.35V) |
| Pino G1 | VDD — Power supply (1.35V) |
| Pino G2 | VSS — Ground |
| Pino G3 | VDD — Power supply (1.35V) |
| Pino G4 | VSS — Ground |
| Pino G5 | VDD — Power supply (1.35V) |
| Pino G6 | VSS — Ground |
| Pino G7 | VDD — Power supply (1.35V) |
| Pino G8 | VSS — Ground |
| Pino G9 | VDD — Power supply (1.35V) |
| Pino G10 | VSS — Ground |
| Pino G11 | VDD — Power supply (1.35V) |
| Pino G12 | VSS — Ground |
| Pino H1 | VSS — Ground |
| Pino H2 | VDD — Power supply (1.35V) |
| Pino H3 | VSS — Ground |
| Pino H4 | VDD — Power supply (1.35V) |
| Pino H5 | VSS — Ground |
| Pino H6 | VDD — Power supply (1.35V) |
| Pino H7 | VSS — Ground |
| Pino H8 | VDD — Power supply (1.35V) |
| Pino H9 | VSS — Ground |
| Pino H10 | VDD — Power supply (1.35V) |
| Pino H11 | VSS — Ground |
| Pino H12 | VDD — Power supply (1.35V) |
| Pino J1 | VDD — Power supply (1.35V) |
| Pino J2 | VSS — Ground |
| Pino J3 | VDD — Power supply (1.35V) |
| Pino J4 | VSS — Ground |
| Pino J5 | VDD — Power supply (1.35V) |
| Pino J6 | VSS — Ground |
| Pino J7 | VDD — Power supply (1.35V) |
| Pino J8 | VSS — Ground |
| Pino J9 | VDD — Power supply (1.35V) |
| Pino J10 | VSS — Ground |
| Pino J11 | VDD — Power supply (1.35V) |
| Pino J12 | VSS — Ground |
| Pino K1 | VSS — Ground |
| Pino K2 | VDD — Power supply (1.35V) |
| Pino K3 | VSS — Ground |
| Pino K4 | VDD — Power supply (1.35V) |
| Pino K5 | VSS — Ground |
| Pino K6 | VDD — Power supply (1.35V) |
| Pino K7 | VSS — Ground |
| Pino K8 | VDD — Power supply (1.35V) |
| Pino K9 | VSS — Ground |
| Pino K10 | VDD — Power supply (1.35V) |
| Pino K11 | VSS — Ground |
| Pino K12 | VDD — Power supply (1.35V) |
| Pino L1 | VDD — Power supply (1.35V) |
| Pino L2 | VSS — Ground |
| Pino L3 | VDD — Power supply (1.35V) |
| Pino L4 | VSS — Ground |
| Pino L5 | VDD — Power supply (1.35V) |
| Pino L6 | VSS — Ground |
| Pino L7 | VDD — Power supply (1.35V) |
| Pino L8 | VSS — Ground |
| Pino L9 | VDD — Power supply (1.35V) |
| Pino L10 | VSS — Ground |
| Pino L11 | VDD — Power supply (1.35V) |
| Pino L12 | VSS — Ground |
| Pino M1 | VSS — Ground |
| Pino M2 | VDD — Power supply (1.35V) |
| Pino M3 | VSS — Ground |
| Pino M4 | VDD — Power supply (1.35V) |
| Pino M5 | VSS — Ground |
| Pino M6 | VDD — Power supply (1.35V) |
| Pino M7 | VSS — Ground |
| Pino M8 | VDD — Power supply (1.35V) |
| Pino M9 | VSS — Ground |
| Pino M10 | VDD — Power supply (1.35V) |
| Pino M11 | VSS — Ground |
| Pino M12 | VDD — Power supply (1.35V) |
| Pino N1 | VDD — Power supply (1.35V) |
| Pino N2 | VSS — Ground |
| Pino N3 | VDD — Power supply (1.35V) |
| Pino N4 | VSS — Ground |
| Pino N5 | VDD — Power supply (1.35V) |
| Pino N6 | VSS — Ground |
| Pino N7 | VDD — Power supply (1.35V) |
| Pino N8 | VSS — Ground |
| Pino N9 | VDD — Power supply (1.35V) |
| Pino N10 | VSS — Ground |
| Pino N11 | VDD — Power supply (1.35V) |
| Pino N12 | VSS — Ground |
Aplicações típicas
NT5CB256M16CP-DI é adequado para 6 aplicaçãos: Embedded Systems, Networking Equipment, Industrial Automation, Automotive Infotainment, Solid-State Drives (SSD), Test and Measurement.
Embedded Systems
The NT5CB256M16CP-DI provides 4Gb of DDR3L memory in a compact TFBGA-96 package, ideal for embedded processors and SoCs. Its 1.35V operation reduces power consumption, extending battery life in portable devices. The wide temperature range (-40°C to +95°C) ensures reliable operation in industrial environments. With data rates up to 1600 Mbps, it supports high-bandwidth applications like real-time data processing and multitasking. The 256Mx16 organization offers a good balance between density and bus width, simplifying PCB layout and routing.
Recomendado
Networking Equipment
In networking switches and routers, the NT5CB256M16CP-DI provides high-speed packet buffering and routing table storage. Its DDR3-1600 data rate ensures low latency for data forwarding, while the 4Gb density accommodates large forwarding tables. The 1.35V supply reduces power dissipation in dense line cards, and the industrial temperature range supports outdoor and harsh environment deployments. The 96-ball TFBGA package allows high-density board assembly, critical for space-constrained networking modules.
Recomendado
Industrial Automation
The NT5CB256M16CP-DI is designed for industrial automation controllers, PLCs, and robotics. Its extended temperature range (-40°C to +95°C) ensures reliable operation in factory floors and outdoor installations. The 1.35V low-voltage operation reduces heat generation, improving system reliability. With 4Gb density, it can store large program code and data logs. The device's on-die termination and differential clock inputs enhance signal integrity in noisy industrial environments, reducing bit errors.
Recomendado
Automotive Infotainment
The NT5CB256M16CP-DI is AEC-Q100 qualified for automotive applications, making it suitable for infotainment systems, instrument clusters, and ADAS. It operates over the automotive temperature range (-40°C to +105°C) and meets stringent reliability requirements. The 1.35V supply reduces power consumption in vehicles, and the 4Gb density supports navigation maps, multimedia, and real-time sensor data. The TFBGA-96 package is robust against vibration and thermal cycling, ensuring long-term durability.
Recomendado
Solid-State Drives (SSD)
In SSDs, the NT5CB256M16CP-DI is used as a DRAM cache or buffer for FTL (Flash Translation Layer) tables. Its high data rate (1600 Mbps) enables fast read/write operations, while the 4Gb density provides ample cache capacity. The low 1.35V operation reduces power consumption, extending battery life in portable SSDs. The industrial temperature range supports enterprise and industrial SSDs that operate in demanding environments. The 256Mx16 organization offers high bandwidth for parallel data access.
Recomendado
Test and Measurement
The NT5CB256M16CP-DI is used in oscilloscopes, logic analyzers, and data acquisition systems for high-speed data buffering. Its DDR3-1600 data rate supports high-sample-rate capture, and the 4Gb density allows long recording times. The 1.35V supply reduces heat in benchtop instruments, and the industrial temperature range ensures accuracy in varying lab conditions. The TFBGA-96 package enables compact instrument designs, and the device's low power consumption contributes to energy-efficient operation.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para NT5CB256M16CP-DI — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | NT5CB256M16DP-DI | NT5CB256M16CP-DII | MT41K256M16HA-125 | K4B4G1646E-BYMA | IS43TR16512B-125K |
|---|---|---|---|---|---|---|
| Package | TFBGA-96 | TFBGA-96 | TFBGA-96 | TFBGA-96 | TFBGA-96 | TFBGA-96 |
| Brand | Nanya Technology Corporation | Nanya Technology Corporation | Nanya Technology Corporation | Micron Technology | Samsung Electronics | ISSI |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V |
| Data Rate | 1600 Mbps | 1600 Mbps | 1600 Mbps | 1600 Mbps | 1600 Mbps | 1600 Mbps |
| Operating Temperature | -40°C to +95°C (industrial), -40°C to +105°C (automotive) | -40°C to +95°C (industrial), -40°C to +105°C (automotive) | -40°C to +95°C (industrial), -40°C to +105°C (automotive) | 0°C to +95°C (commercial), -40°C to +95°C (industrial) | 0°C to +95°C (commercial), -40°C to +95°C (industrial) | 0°C to +95°C (commercial), -40°C to +95°C (industrial) |
| CAS Latency | 5-11 | 5-11 | 5-11 | 5-11 | 5-11 | 5-11 |
Principais diferenciais
- Automotive temperature range up to +105°C (vs MT41K256M16HA-125)
- AEC-Q100 qualified (vs K4B4G1646E-BYMA)
- Wide operating temperature range (vs IS43TR16512B-125K)
Notas de projeto
For DDR3L routing, maintain 50-ohm single-ended and 100-ohm differential impedance for DQ, DQS, and clock signals. Keep trace lengths matched within +/-20 mils for data groups and +/-50 mils for address/command. Use a solid ground plane beneath the memory device and place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin. Follow the layout guidelines in the Nanya datasheet for optimal signal integrity.
The NT5CB256M16CP-DI requires a stable 1.35V supply (VDD and VDDQ) and a reference voltage (VREF) at 0.675V (half of VDD). Use a low-noise LDO or a dedicated DDR3L power solution to provide these rails. Ensure the power supply can handle peak current spikes during read/write operations. Place bulk capacitors (10uF) near the memory power pins and add ferrite beads to isolate VDDQ from VDD if needed.
The TFBGA-96 package has a thermal resistance (theta_JA) of approximately 30°C/W. For industrial applications up to 95°C ambient, ensure adequate airflow or a heatsink if the memory is heavily accessed. The maximum junction temperature is 115°C for industrial grade. Calculate power dissipation based on operating frequency and load; typical DDR3L power is around 1-2W for 4Gb at 1600 Mbps. Provide thermal vias under the package to improve heat dissipation.
Informações de conformidade
RoHS and REACH compliant per Abacus Technologies. AEC-Q100 qualified for automotive applications. Conflict-free per DRC status.
