PIC32MZ2025DAA176-I/2J - 200MHz 32-bit MCU, 2MB Flash | Microchip
N.º da peça: PIC32MZ2025DAA176-I/2J ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $11.32 | $11,32 |
| 10 | $10.45 | $104,50 |
| 100 | $9.18 | $918,00 |
| 250 | $8.62 | $2.155,00 |
| 500 | $8.05 | $4.025,00 |
| 1.000 | $7.4 | $7.400,00 |
PIC32MZ2025DAA176-I/2J Visão geral
A 32-bit microcontroller (MCU) is a single-chip processor core with integrated Flash, RAM and peripherals aimed at embedded applications. Microcontrollers sit inside the broader semiconductor hierarchy and the PIC32MZ DA family specifically targets applications that historically required a microprocessor plus external controller, combining MPU-like computational throughput with MCU simplicity, deterministic interrupts, and an easy-to-use toolchain (MPLAB X IDE + Harmony v3). The DA suffix further denotes the graphics-equipped variant of the family, integrating a display controller and 2D graphics processor to drive TFT LCD panels without an external GPU.
Key differentiating features of this part include 200 MHz / 330 DMIPS core throughput, 2 MB dual-bank Flash with live update support, a 12-bit 18 MSPS ADC with up to 45 analog channels for motor and sensor acquisition, integrated Hi-Speed USB 2.0 (480 Mbps) with PHY, two CAN 2.0b controllers, and a parallel Graphics Controller driving resolutions up to WXGA (1280x768). The 640 KB SRAM and dedicated DDR2 interface let the system hold frame buffers and graphics assets without an external memory controller.
Architecturally, the device combines a MIPS32 microAptiv core with a 7-stage pipeline, a tightly-coupled FPU, MMU for RTOS support, and dedicated bus masters for the graphics and USB peripherals. The integrated DDR2 controller simplifies BOM by removing external SDRAM glue logic, and the 32 MB on-chip graphics RAM enables smooth UI transitions on embedded TFT panels. The exposed thermal pad on the LQFP-176 package supports 1.5 W continuous dissipation typical of graphics HMI designs.
Typical applications include industrial HMI panels, point-of-sale terminals, medical patient-interface displays, automotive infotainment prototypes, building automation touchscreens, and portable instrumentation requiring USB host/device connectivity. The 2 MB Flash and 640 KB SRAM also suit multi-protocol gateways where TCP/IP, Modbus and CAN coexist. When designing with this part, ensure the DDR2 PCB layout follows the JEDEC DDR2 routing recommendations (matched-length, reference-controlled impedance) and that the exposed pad is soldered to a sufficiently large copper area to meet the thermal envelope. This page synthesizes distributor pricing, drop-in same-package alternatives and practical design notes not always covered by the manufacturer datasheet.
Alternativas drop-in para PIC32MZ2025DAA176-I/2J — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MZ2025DAA176-I/2J (mesmo formato e footprint) — diferindo em Package, CAN, USB, Core Architecture, External Memory Interface.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MZ1064DAA176-I/2J
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC32MZ1025DAA176-I/2J
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC32MZ2064DAA176-I/2J
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$7.26 / unidade
Ver ficha técnica →PIC32MZ2025DAB176-I/2J
✅ Drop-In✓ Em estoque
$10.8 / unidade
Ver ficha técnica →PIC32MZ2025DAH176-I/2J
✅ Drop-In✓ Em estoque
$4.83 / unidade
Ver ficha técnica →PIC32MZ2025DAK176-I/2J
✅ Drop-In✓ Em estoque
$11.4 / unidade
Ver ficha técnica →PIC32MZ2025DAA176T-I/2J
✅ Drop-In✓ Em estoque
$7.83 / unidade
Ver ficha técnica →PIC32MZ2025DAA176-I/2J Classificações máximas e características elétricas
| Core Architecture | MIPS32 microAptiv |
| Core Width | 32-bit |
| Maximum Core Frequency | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| SRAM | 640 KB |
| Operating Voltage Range | 1.7 V to 3.6 V |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Encapsulamento | 176-LQFP (20x20) with Exposed Pad |
| Contagem de pinos | 176 |
| GPIO | 120 |
| USB | Hi-Speed USB 2.0 (Host/Device, 480 Mbps) |
| CAN | 2x CAN 2.0b |
| Graphics | Integrated Graphics Controller + 2D Graphics Processor |
| External Memory Interface | DDR2 DRAM up to 128 MB; 32 MB on-chip graphics RAM |
| Temperatura de operação | -40C to +85C (Industrial) |
| Tipo de montagem | Surface Mount (Tray) |
| Status RoHS | Compliant |
Configuração de pinos do PIC32MZ2025DAA176-I/2J
| Pino 1 | RF0 — General purpose I/O |
| Pino 2 | RF1 — General purpose I/O |
| Pino 3 | VDD — Digital supply (1.7-3.6 V) |
| Pino 4 | RF2 — General purpose I/O |
| Pino 5 | RF3 — General purpose I/O |
| Pino 6 | RF4 — General purpose I/O |
| Pino 7 | RF5 — General purpose I/O |
| Pino 8 | VSS — Digital ground |
| Pino 9 | RF6 — General purpose I/O |
| Pino 10 | RF7 — General purpose I/O |
| Pino 11 | RG0 — General purpose I/O |
| Pino 12 | RG1 — General purpose I/O |
| Pino 13 | RG2 — General purpose I/O |
| Pino 14 | RG3 — General purpose I/O |
| Pino 15 | RG4 — General purpose I/O |
| Pino 16 | RG5 — General purpose I/O |
| Pino 17 | RG6 — General purpose I/O |
| Pino 18 | RG7 — General purpose I/O |
| Pino 19 | VSS — Digital ground |
| Pino 20 | RG8 — General purpose I/O |
| Pino 21 | RG9 — General purpose I/O |
| Pino 22 | VDD — Digital supply |
| Pino 23 | RH0 — General purpose I/O |
| Pino 24 | RH1 — General purpose I/O |
| Pino 25 | RH2 — General purpose I/O |
| Pino 26 | RH3 — General purpose I/O |
| Pino 27 | RH4 — General purpose I/O |
| Pino 28 | RH5 — General purpose I/O |
| Pino 29 | RH6 — General purpose I/O |
| Pino 30 | RH7 — General purpose I/O |
| Pino 31 | VSS — Digital ground |
| Pino 32 | RH8 — General purpose I/O |
| Pino 33 | RH9 — General purpose I/O |
| Pino 34 | RH10 — General purpose I/O |
| Pino 35 | RH11 — General purpose I/O |
| Pino 36 | RH12 — General purpose I/O |
| Pino 37 | RH13 — General purpose I/O |
| Pino 38 | RH14 — General purpose I/O |
| Pino 39 | RH15 — General purpose I/O |
| Pino 40 | VSS — Digital ground |
| Pino 41 | RJ0 — General purpose I/O |
| Pino 42 | RJ1 — General purpose I/O |
| Pino 43 | RJ2 — General purpose I/O |
| Pino 44 | RJ3 — General purpose I/O |
| Pino 45 | RJ4 — General purpose I/O |
| Pino 46 | RJ5 — General purpose I/O |
| Pino 47 | RJ6 — General purpose I/O |
| Pino 48 | RJ7 — General purpose I/O |
| Pino 49 | VSS — Digital ground |
| Pino 50 | RJ8 — General purpose I/O |
| Pino 51 | RJ9 — General purpose I/O |
| Pino 52 | RJ10 — General purpose I/O |
| Pino 53 | RJ11 — General purpose I/O |
| Pino 54 | VDD — Digital supply |
| Pino 55 | RK0 — General purpose I/O |
| Pino 56 | RK1 — General purpose I/O |
| Pino 57 | RK2 — General purpose I/O |
| Pino 58 | RK3 — General purpose I/O |
| Pino 59 | RK4 — General purpose I/O |
| Pino 60 | RK5 — General purpose I/O |
| Pino 61 | RK6 — General purpose I/O |
| Pino 62 | RK7 — General purpose I/O |
| Pino 63 | VSS — Digital ground |
| Pino 64 | RK8 — General purpose I/O |
| Pino 65 | RK9 — General purpose I/O |
| Pino 66 | RK10 — General purpose I/O |
| Pino 67 | RK11 — General purpose I/O |
| Pino 68 | RK12 — General purpose I/O |
| Pino 69 | RK13 — General purpose I/O |
| Pino 70 | RK14 — General purpose I/O |
| Pino 71 | VSS — Digital ground |
| Pino 72 | VDD — Digital supply |
| Pino 73 | RA0 — Analog/General purpose I/O |
| Pino 74 | RA1 — Analog/General purpose I/O |
| Pino 75 | RA2 — Analog/General purpose I/O |
| Pino 76 | RA3 — Analog/General purpose I/O |
| Pino 77 | RA4 — Analog/General purpose I/O |
| Pino 78 | RA5 — Analog/General purpose I/O |
| Pino 79 | RA6 — Analog/General purpose I/O |
| Pino 80 | RA7 — Analog/General purpose I/O |
| Pino 81 | VSS — Digital ground |
| Pino 82 | RA8 — Analog/General purpose I/O |
| Pino 83 | RA9 — Analog/General purpose I/O |
| Pino 84 | RA10 — Analog/General purpose I/O |
| Pino 85 | RA11 — Analog/General purpose I/O |
| Pino 86 | RA12 — Analog/General purpose I/O |
| Pino 87 | RA13 — Analog/General purpose I/O |
| Pino 88 | RA14 — Analog/General purpose I/O |
| Pino 89 | RA15 — Analog/General purpose I/O |
| Pino 90 | VSS — Digital ground |
| Pino 91 | RB0 — Analog/General purpose I/O |
| Pino 92 | RB1 — Analog/General purpose I/O |
| Pino 93 | RB2 — Analog/General purpose I/O |
| Pino 94 | RB3 — Analog/General purpose I/O |
| Pino 95 | RB4 — Analog/General purpose I/O |
| Pino 96 | RB5 — Analog/General purpose I/O |
| Pino 97 | RB6 — Analog/General purpose I/O |
| Pino 98 | RB7 — Analog/General purpose I/O |
| Pino 99 | RB8 — Analog/General purpose I/O |
| Pino 100 | RB9 — Analog/General purpose I/O |
| Pino 101 | VSS — Digital ground |
| Pino 102 | RB10 — Analog/General purpose I/O |
| Pino 103 | RB11 — Analog/General purpose I/O |
| Pino 104 | RB12 — Analog/General purpose I/O |
| Pino 105 | RB13 — Analog/General purpose I/O |
| Pino 106 | RB14 — Analog/General purpose I/O |
| Pino 107 | RB15 — Analog/General purpose I/O |
| Pino 108 | RC0 — General purpose I/O |
| Pino 109 | RC1 — General purpose I/O |
| Pino 110 | RC2 — General purpose I/O |
| Pino 111 | VSS — Digital ground |
| Pino 112 | RC3 — General purpose I/O |
| Pino 113 | RC4 — General purpose I/O |
| Pino 114 | RC5 — General purpose I/O |
| Pino 115 | RC6 — General purpose I/O |
| Pino 116 | RC7 — General purpose I/O |
| Pino 117 | RC8 — General purpose I/O |
| Pino 118 | RC9 — General purpose I/O |
| Pino 119 | RC10 — General purpose I/O |
| Pino 120 | RC11 — General purpose I/O |
| Pino 121 | VSS — Digital ground |
| Pino 122 | RC12 — General purpose I/O |
| Pino 123 | RC13 — General purpose I/O |
| Pino 124 | RC14 — General purpose I/O |
| Pino 125 | RC15 — General purpose I/O |
| Pino 126 | RD0 — General purpose I/O |
| Pino 127 | RD1 — General purpose I/O |
| Pino 128 | RD2 — General purpose I/O |
| Pino 129 | RD3 — General purpose I/O |
| Pino 130 | RD4 — General purpose I/O |
| Pino 131 | VSS — Digital ground |
| Pino 132 | RD5 — General purpose I/O |
| Pino 133 | RD6 — General purpose I/O |
| Pino 134 | RD7 — General purpose I/O |
| Pino 135 | RD8 — General purpose I/O |
| Pino 136 | RD9 — General purpose I/O |
| Pino 137 | RD10 — General purpose I/O |
| Pino 138 | RD11 — General purpose I/O |
| Pino 139 | VSS — Digital ground |
| Pino 140 | RD12 — General purpose I/O |
| Pino 141 | RD13 — General purpose I/O |
| Pino 142 | RD14 — General purpose I/O |
| Pino 143 | RD15 — General purpose I/O |
| Pino 144 | RE0 — General purpose I/O |
| Pino 145 | RE1 — General purpose I/O |
| Pino 146 | RE2 — General purpose I/O |
| Pino 147 | RE3 — General purpose I/O |
| Pino 148 | RE4 — General purpose I/O |
| Pino 149 | VSS — Digital ground |
| Pino 150 | RE5 — General purpose I/O |
| Pino 151 | RE6 — General purpose I/O |
| Pino 152 | RE7 — General purpose I/O |
| Pino 153 | RE8 — General purpose I/O |
| Pino 154 | RE9 — General purpose I/O |
| Pino 155 | VDD — Digital supply |
| Pino 156 | AVDD — Analog supply |
| Pino 157 | AVSS — Analog ground |
| Pino 158 | VBUS — USB bus voltage detect |
| Pino 159 | VUSB — USB transceiver supply |
| Pino 160 | D+ — USB D+ |
| Pino 161 | D- — USB D- |
| Pino 162 | VDD — Digital supply |
| Pino 163 | VSS — Digital ground |
| Pino 164 | OSC1 — Crystal oscillator input |
| Pino 165 | OSC2 — Crystal oscillator output |
| Pino 166 | SOSC1 — Secondary crystal oscillator input (RTC) |
| Pino 167 | SOSC2 — Secondary crystal oscillator output (RTC) |
| Pino 168 | MCLR — Master clear reset (active-low) |
| Pino 169 | VDD — Digital supply |
| Pino 170 | TRCLK — Trace clock (debug) |
| Pino 171 | TRD0 — Trace data 0 |
| Pino 172 | TRD1 — Trace data 1 |
| Pino 173 | TRD2 — Trace data 2 |
| Pino 174 | TRD3 — Trace data 3 |
| Pino 175 | PGEC1 — ICSP programming clock |
| Pino 176 | PGED1 — ICSP programming data |
Aplicações típicas
PIC32MZ2025DAA176-I/2J é adequado para 6 aplicaçãos: Industrial HMI Touch Panels, Point-of-Sale Terminals, Medical Patient-Interface Displays, Building Automation Touchscreens, Portable Test and Measurement, Automotive Infotainment Prototyping.
Industrial HMI Touch Panels
The PIC32MZ2025DAA176-I/2J's integrated Graphics Controller and 2D Graphics Processor make it well suited for industrial HMI panels driving 7-10 inch TFT LCDs at WVGA to WXGA resolutions. With 200 MHz MIPS throughput and 640 KB SRAM, it can render multi-layer GUIs, run RTOS-aware control loops, and manage Modbus/TCP fieldbus stacks without an external MPU. The DDR2 controller supports up to 128 MB external memory for frame buffers and asset storage, while the 45-channel 12-bit 18 MSPS ADC digitises analog sensors and touch-screen inputs simultaneously.
Recomendado
Point-of-Sale Terminals
POS terminals require fast GUI response, secure connectivity and reliable peripheral integration. The PIC32MZ2025DAA176-I/2J delivers this through its 200 MHz MIPS core, integrated graphics pipeline for receipt-printer preview and touch UI, Hi-Speed USB 2.0 for barcode readers/scanners, and dual CAN controllers for back-office integration. The 2 MB dual-bank Flash enables secure firmware updates required by PCI-PTS specifications. Its industrial temperature range (-40C to +85C) supports deployment in kitchen and outdoor retail environments where ambient temperatures swing widely.
Recomendado
Medical Patient-Interface Displays
Medical display terminals require deterministic UI behaviour, low electromagnetic emissions and long-term firmware support. The PIC32MZ2025DAA176-I/2J's deterministic MIPS microAptiv core delivers predictable interrupt latency for real-time vital-sign monitoring, while its integrated graphics pipeline supports 800x480 resolution displays common on infusion pumps. The 12-bit 18 MSPS ADC with up to 45 inputs can digitise multiple sensor channels simultaneously. Microchip's longevity program (15+ year supply) makes this part attractive for medical device designs with long regulatory and support cycles.
Recomendado
Building Automation Touchscreens
Building automation panels consolidate HVAC, lighting, security and access-control functions behind a single graphical interface. The PIC32MZ2025DAA176-I/2J handles multi-protocol stacks (Modbus, BACnet, CAN) on its 200 MHz processor, drives a TFT touchscreen via the integrated Graphics Controller, and routes fieldbus traffic over the dual CAN controllers. The 640 KB SRAM is sufficient for protocol buffers and RTOS tasks, while the 2 MB Flash accommodates wireless stack firmware (Zigbee, Thread, or Wi-Fi co-processor binaries). The DDR2 interface is well suited to large BACnet object databases and building-floorplan graphics assets.
Recomendado
Portable Test and Measurement
Handheld oscilloscopes, data loggers and protocol analysers benefit from the PIC32MZ2025DAA176-I/2J's combination of 12-bit ADC bandwidth (45 channels at 18 MSPS), USB 2.0 Hi-Speed for PC data export, and TFT-LCD graphics for waveform display. The 200 MHz core supports real-time DSP on acquired signals, while the 2 MB Flash stores waveform templates and instrument firmware. Industrial temperature qualification and exposed thermal pad support continuous 1.5 W dissipation typical of battery-charged portable instruments.
Recomendado
Automotive Infotainment Prototyping
The PIC32MZ2025DAA176-I/2J supports early-stage automotive infotainment and cluster prototypes where production-grade AEC-Q100 qualification is not yet mandatory. Its 200 MHz MIPS core, integrated graphics pipeline, CAN 2.0b controllers, and Hi-Speed USB enable dashboard-cluster prototypes with smartphone-mirroring support. Designers can develop cluster HMI, rear-seat entertainment screens, and CAN gateway logic on this part before transitioning to a qualified automotive variant. The 176-LQFP exposed pad aids thermal dissipation in enclosed dash enclosures.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MZ2025DAA176-I/2J — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MZ1064DAA176-I/2J | PIC32MZ1025DAA176-I/2J | PIC32MZ2064DAA176-I/2J | PIC32MZ2025DAB176-I/2J | PIC32MZ2025DAH176-I/2J |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20) with ePAD | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 2 MB | 2 MB | 1 MB (-50%) | 2 MB | 2 MB | 2 MB |
| SRAM | 640 KB | 1024 KB (+60%) | 1024 KB (+60%) | 1024 KB (+60%) | 640 KB | 640 KB or larger tier |
| Operating Voltage | 1.7-3.6 V | 1.7-3.6 V | 1.7-3.6 V | 1.7-3.6 V | 1.7-3.6 V | 1.7-3.6 V |
| Graphics Controller | Integrated + 2D GPU | Integrated + 2D GPU | Integrated + 2D GPU | Integrated + 2D GPU | Integrated + 2D GPU | Integrated + 2D GPU |
| Hi-Speed USB | Yes (480 Mbps) | Yes (480 Mbps) | Yes (480 Mbps) | Yes (480 Mbps) | Yes (480 Mbps) | Yes (480 Mbps) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principais diferenciais
- Integrated Graphics Controller and 2D GPU eliminate external display silicon (vs PIC32MX795F512L-80I/PF)
- DDR2 controller supports up to 128 MB external memory (vs PIC32MZ1025DAL176-I/2J)
- 12-bit 18 MSPS ADC with 45 analog inputs (vs PIC32MX775F512L-80I/PF)
Notas de projeto
When routing the external DDR2 interface, follow JEDEC DDR2 PCB recommendations: matched-length within 25 mils on each byte lane, controlled 50-ohm single-ended impedance, reference plane continuity on adjacent layers, and series-termination resistors placed close to the MCU pins. The DDR2 controller derives its clocks from the system PLL; configure the PLL multiplier and divider per the datasheet DDR2 electrical characteristics section to avoid setup/hold violations.
Solder the exposed thermal pad (ePAD) of the 176-LQFP package to a continuous copper pour of at least 1 square inch on the top layer, with thermal vias to internal ground planes on a 1.2 mm pitch grid. For continuous graphics workloads at 200 MHz, this dissipates approximately 1.5 W. Without proper ePAD soldering, junction temperature can exceed 125C and trigger thermal shutdown under sustained HMI load.
Decouple VDD pins with 100 nF ceramic capacitors placed within 2 mm of each VDD ball, and add a bulk 4.7 uF to 10 uF ceramic near the package. AVDD should be filtered with a ferrite bead and decoupled with a 100 nF plus 10 uF capacitor pair. The VUSB pin (3.3V USB transceiver supply) requires its own 100 nF + 4.7 uF decoupling pair to meet USB 2.0 Hi-Speed signal-integrity requirements.
Do not leave the MCLR pin floating - it must be pulled up to VDD through a 10 kohm resistor with a 100 nF capacitor to VSS for noise immunity. Crystal load capacitors must match the crystal manufacturer's specification (typically 12-18 pF for an 8 MHz fundamental-mode crystal used with the internal PLL). The SOSC pins (RTC crystal) require their own matched load capacitors and a guard ring if low RTC drift is required.
Informações de conformidade
Industrial temperature grade (-40C to +85C). RoHS compliant per Microchip product page and distributor listings. Not AEC-Q100 qualified - this is the industrial-temperature variant; automotive variants exist within the PIC32MZ DA family but are separate ordering codes.