PIC32MZ2025DAA176-I/2J - 200MHz 32-bit MCU, 2MB Flash | Microchip
MPN: PIC32MZ2025DAA176-I/2J ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11.32 | $11.32 |
| 10 | $10.45 | $104.50 |
| 100 | $9.18 | $918.00 |
| 250 | $8.62 | $2,155.00 |
| 500 | $8.05 | $4,025.00 |
| 1,000 | $7.4 | $7,400.00 |
PIC32MZ2025DAA176-I/2J Overview
A 32-bit microcontroller (MCU) is a single-chip processor core with integrated Flash, RAM and peripherals aimed at embedded applications. Microcontrollers sit inside the broader semiconductor hierarchy and the PIC32MZ DA family specifically targets applications that historically required a microprocessor plus external controller, combining MPU-like computational throughput with MCU simplicity, deterministic interrupts, and an easy-to-use toolchain (MPLAB X IDE + Harmony v3). The DA suffix further denotes the graphics-equipped variant of the family, integrating a display controller and 2D graphics processor to drive TFT LCD panels without an external GPU.
Key differentiating features of this part include 200 MHz / 330 DMIPS core throughput, 2 MB dual-bank Flash with live update support, a 12-bit 18 MSPS ADC with up to 45 analog channels for motor and sensor acquisition, integrated Hi-Speed USB 2.0 (480 Mbps) with PHY, two CAN 2.0b controllers, and a parallel Graphics Controller driving resolutions up to WXGA (1280x768). The 640 KB SRAM and dedicated DDR2 interface let the system hold frame buffers and graphics assets without an external memory controller.
Architecturally, the device combines a MIPS32 microAptiv core with a 7-stage pipeline, a tightly-coupled FPU, MMU for RTOS support, and dedicated bus masters for the graphics and USB peripherals. The integrated DDR2 controller simplifies BOM by removing external SDRAM glue logic, and the 32 MB on-chip graphics RAM enables smooth UI transitions on embedded TFT panels. The exposed thermal pad on the LQFP-176 package supports 1.5 W continuous dissipation typical of graphics HMI designs.
Typical applications include industrial HMI panels, point-of-sale terminals, medical patient-interface displays, automotive infotainment prototypes, building automation touchscreens, and portable instrumentation requiring USB host/device connectivity. The 2 MB Flash and 640 KB SRAM also suit multi-protocol gateways where TCP/IP, Modbus and CAN coexist. When designing with this part, ensure the DDR2 PCB layout follows the JEDEC DDR2 routing recommendations (matched-length, reference-controlled impedance) and that the exposed pad is soldered to a sufficiently large copper area to meet the thermal envelope. This page synthesizes distributor pricing, drop-in same-package alternatives and practical design notes not always covered by the manufacturer datasheet.
Drop-in alternatives for PIC32MZ2025DAA176-I/2J — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MZ2025DAA176-I/2J (same form factor and footprint) — differing in Package, CAN, USB, Core Architecture, External Memory Interface.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MZ1064DAA176-I/2J
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC32MZ1025DAA176-I/2J
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC32MZ2064DAA176-I/2J
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$7.26 / Unit
View Datasheet →PIC32MZ2025DAB176-I/2J
✅ Drop-In✓ In Stock
$10.8 / Unit
View Datasheet →PIC32MZ2025DAH176-I/2J
✅ Drop-In✓ In Stock
$4.83 / Unit
View Datasheet →PIC32MZ2025DAK176-I/2J
✅ Drop-In✓ In Stock
$11.4 / Unit
View Datasheet →PIC32MZ2025DAA176T-I/2J
✅ Drop-In✓ In Stock
$7.83 / Unit
View Datasheet →PIC32MZ2025DAA176-I/2J Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 microAptiv |
| Core Width | 32-bit |
| Maximum Core Frequency | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| SRAM | 640 KB |
| Operating Voltage Range | 1.7 V to 3.6 V |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Package | 176-LQFP (20x20) with Exposed Pad |
| Pin Count | 176 |
| GPIO | 120 |
| USB | Hi-Speed USB 2.0 (Host/Device, 480 Mbps) |
| CAN | 2x CAN 2.0b |
| Graphics | Integrated Graphics Controller + 2D Graphics Processor |
| External Memory Interface | DDR2 DRAM up to 128 MB; 32 MB on-chip graphics RAM |
| Operating Temperature | -40C to +85C (Industrial) |
| Mounting Type | Surface Mount (Tray) |
| RoHS Status | Compliant |
PIC32MZ2025DAA176-I/2J Pin Configuration
| Pin 1 | RF0 — General purpose I/O |
| Pin 2 | RF1 — General purpose I/O |
| Pin 3 | VDD — Digital supply (1.7-3.6 V) |
| Pin 4 | RF2 — General purpose I/O |
| Pin 5 | RF3 — General purpose I/O |
| Pin 6 | RF4 — General purpose I/O |
| Pin 7 | RF5 — General purpose I/O |
| Pin 8 | VSS — Digital ground |
| Pin 9 | RF6 — General purpose I/O |
| Pin 10 | RF7 — General purpose I/O |
| Pin 11 | RG0 — General purpose I/O |
| Pin 12 | RG1 — General purpose I/O |
| Pin 13 | RG2 — General purpose I/O |
| Pin 14 | RG3 — General purpose I/O |
| Pin 15 | RG4 — General purpose I/O |
| Pin 16 | RG5 — General purpose I/O |
| Pin 17 | RG6 — General purpose I/O |
| Pin 18 | RG7 — General purpose I/O |
| Pin 19 | VSS — Digital ground |
| Pin 20 | RG8 — General purpose I/O |
| Pin 21 | RG9 — General purpose I/O |
| Pin 22 | VDD — Digital supply |
| Pin 23 | RH0 — General purpose I/O |
| Pin 24 | RH1 — General purpose I/O |
| Pin 25 | RH2 — General purpose I/O |
| Pin 26 | RH3 — General purpose I/O |
| Pin 27 | RH4 — General purpose I/O |
| Pin 28 | RH5 — General purpose I/O |
| Pin 29 | RH6 — General purpose I/O |
| Pin 30 | RH7 — General purpose I/O |
| Pin 31 | VSS — Digital ground |
| Pin 32 | RH8 — General purpose I/O |
| Pin 33 | RH9 — General purpose I/O |
| Pin 34 | RH10 — General purpose I/O |
| Pin 35 | RH11 — General purpose I/O |
| Pin 36 | RH12 — General purpose I/O |
| Pin 37 | RH13 — General purpose I/O |
| Pin 38 | RH14 — General purpose I/O |
| Pin 39 | RH15 — General purpose I/O |
| Pin 40 | VSS — Digital ground |
| Pin 41 | RJ0 — General purpose I/O |
| Pin 42 | RJ1 — General purpose I/O |
| Pin 43 | RJ2 — General purpose I/O |
| Pin 44 | RJ3 — General purpose I/O |
| Pin 45 | RJ4 — General purpose I/O |
| Pin 46 | RJ5 — General purpose I/O |
| Pin 47 | RJ6 — General purpose I/O |
| Pin 48 | RJ7 — General purpose I/O |
| Pin 49 | VSS — Digital ground |
| Pin 50 | RJ8 — General purpose I/O |
| Pin 51 | RJ9 — General purpose I/O |
| Pin 52 | RJ10 — General purpose I/O |
| Pin 53 | RJ11 — General purpose I/O |
| Pin 54 | VDD — Digital supply |
| Pin 55 | RK0 — General purpose I/O |
| Pin 56 | RK1 — General purpose I/O |
| Pin 57 | RK2 — General purpose I/O |
| Pin 58 | RK3 — General purpose I/O |
| Pin 59 | RK4 — General purpose I/O |
| Pin 60 | RK5 — General purpose I/O |
| Pin 61 | RK6 — General purpose I/O |
| Pin 62 | RK7 — General purpose I/O |
| Pin 63 | VSS — Digital ground |
| Pin 64 | RK8 — General purpose I/O |
| Pin 65 | RK9 — General purpose I/O |
| Pin 66 | RK10 — General purpose I/O |
| Pin 67 | RK11 — General purpose I/O |
| Pin 68 | RK12 — General purpose I/O |
| Pin 69 | RK13 — General purpose I/O |
| Pin 70 | RK14 — General purpose I/O |
| Pin 71 | VSS — Digital ground |
| Pin 72 | VDD — Digital supply |
| Pin 73 | RA0 — Analog/General purpose I/O |
| Pin 74 | RA1 — Analog/General purpose I/O |
| Pin 75 | RA2 — Analog/General purpose I/O |
| Pin 76 | RA3 — Analog/General purpose I/O |
| Pin 77 | RA4 — Analog/General purpose I/O |
| Pin 78 | RA5 — Analog/General purpose I/O |
| Pin 79 | RA6 — Analog/General purpose I/O |
| Pin 80 | RA7 — Analog/General purpose I/O |
| Pin 81 | VSS — Digital ground |
| Pin 82 | RA8 — Analog/General purpose I/O |
| Pin 83 | RA9 — Analog/General purpose I/O |
| Pin 84 | RA10 — Analog/General purpose I/O |
| Pin 85 | RA11 — Analog/General purpose I/O |
| Pin 86 | RA12 — Analog/General purpose I/O |
| Pin 87 | RA13 — Analog/General purpose I/O |
| Pin 88 | RA14 — Analog/General purpose I/O |
| Pin 89 | RA15 — Analog/General purpose I/O |
| Pin 90 | VSS — Digital ground |
| Pin 91 | RB0 — Analog/General purpose I/O |
| Pin 92 | RB1 — Analog/General purpose I/O |
| Pin 93 | RB2 — Analog/General purpose I/O |
| Pin 94 | RB3 — Analog/General purpose I/O |
| Pin 95 | RB4 — Analog/General purpose I/O |
| Pin 96 | RB5 — Analog/General purpose I/O |
| Pin 97 | RB6 — Analog/General purpose I/O |
| Pin 98 | RB7 — Analog/General purpose I/O |
| Pin 99 | RB8 — Analog/General purpose I/O |
| Pin 100 | RB9 — Analog/General purpose I/O |
| Pin 101 | VSS — Digital ground |
| Pin 102 | RB10 — Analog/General purpose I/O |
| Pin 103 | RB11 — Analog/General purpose I/O |
| Pin 104 | RB12 — Analog/General purpose I/O |
| Pin 105 | RB13 — Analog/General purpose I/O |
| Pin 106 | RB14 — Analog/General purpose I/O |
| Pin 107 | RB15 — Analog/General purpose I/O |
| Pin 108 | RC0 — General purpose I/O |
| Pin 109 | RC1 — General purpose I/O |
| Pin 110 | RC2 — General purpose I/O |
| Pin 111 | VSS — Digital ground |
| Pin 112 | RC3 — General purpose I/O |
| Pin 113 | RC4 — General purpose I/O |
| Pin 114 | RC5 — General purpose I/O |
| Pin 115 | RC6 — General purpose I/O |
| Pin 116 | RC7 — General purpose I/O |
| Pin 117 | RC8 — General purpose I/O |
| Pin 118 | RC9 — General purpose I/O |
| Pin 119 | RC10 — General purpose I/O |
| Pin 120 | RC11 — General purpose I/O |
| Pin 121 | VSS — Digital ground |
| Pin 122 | RC12 — General purpose I/O |
| Pin 123 | RC13 — General purpose I/O |
| Pin 124 | RC14 — General purpose I/O |
| Pin 125 | RC15 — General purpose I/O |
| Pin 126 | RD0 — General purpose I/O |
| Pin 127 | RD1 — General purpose I/O |
| Pin 128 | RD2 — General purpose I/O |
| Pin 129 | RD3 — General purpose I/O |
| Pin 130 | RD4 — General purpose I/O |
| Pin 131 | VSS — Digital ground |
| Pin 132 | RD5 — General purpose I/O |
| Pin 133 | RD6 — General purpose I/O |
| Pin 134 | RD7 — General purpose I/O |
| Pin 135 | RD8 — General purpose I/O |
| Pin 136 | RD9 — General purpose I/O |
| Pin 137 | RD10 — General purpose I/O |
| Pin 138 | RD11 — General purpose I/O |
| Pin 139 | VSS — Digital ground |
| Pin 140 | RD12 — General purpose I/O |
| Pin 141 | RD13 — General purpose I/O |
| Pin 142 | RD14 — General purpose I/O |
| Pin 143 | RD15 — General purpose I/O |
| Pin 144 | RE0 — General purpose I/O |
| Pin 145 | RE1 — General purpose I/O |
| Pin 146 | RE2 — General purpose I/O |
| Pin 147 | RE3 — General purpose I/O |
| Pin 148 | RE4 — General purpose I/O |
| Pin 149 | VSS — Digital ground |
| Pin 150 | RE5 — General purpose I/O |
| Pin 151 | RE6 — General purpose I/O |
| Pin 152 | RE7 — General purpose I/O |
| Pin 153 | RE8 — General purpose I/O |
| Pin 154 | RE9 — General purpose I/O |
| Pin 155 | VDD — Digital supply |
| Pin 156 | AVDD — Analog supply |
| Pin 157 | AVSS — Analog ground |
| Pin 158 | VBUS — USB bus voltage detect |
| Pin 159 | VUSB — USB transceiver supply |
| Pin 160 | D+ — USB D+ |
| Pin 161 | D- — USB D- |
| Pin 162 | VDD — Digital supply |
| Pin 163 | VSS — Digital ground |
| Pin 164 | OSC1 — Crystal oscillator input |
| Pin 165 | OSC2 — Crystal oscillator output |
| Pin 166 | SOSC1 — Secondary crystal oscillator input (RTC) |
| Pin 167 | SOSC2 — Secondary crystal oscillator output (RTC) |
| Pin 168 | MCLR — Master clear reset (active-low) |
| Pin 169 | VDD — Digital supply |
| Pin 170 | TRCLK — Trace clock (debug) |
| Pin 171 | TRD0 — Trace data 0 |
| Pin 172 | TRD1 — Trace data 1 |
| Pin 173 | TRD2 — Trace data 2 |
| Pin 174 | TRD3 — Trace data 3 |
| Pin 175 | PGEC1 — ICSP programming clock |
| Pin 176 | PGED1 — ICSP programming data |
Typical Applications
PIC32MZ2025DAA176-I/2J is suitable for 6 applications: Industrial HMI Touch Panels, Point-of-Sale Terminals, Medical Patient-Interface Displays, Building Automation Touchscreens, Portable Test and Measurement, Automotive Infotainment Prototyping.
Industrial HMI Touch Panels
The PIC32MZ2025DAA176-I/2J's integrated Graphics Controller and 2D Graphics Processor make it well suited for industrial HMI panels driving 7-10 inch TFT LCDs at WVGA to WXGA resolutions. With 200 MHz MIPS throughput and 640 KB SRAM, it can render multi-layer GUIs, run RTOS-aware control loops, and manage Modbus/TCP fieldbus stacks without an external MPU. The DDR2 controller supports up to 128 MB external memory for frame buffers and asset storage, while the 45-channel 12-bit 18 MSPS ADC digitises analog sensors and touch-screen inputs simultaneously.
Recommended
Point-of-Sale Terminals
POS terminals require fast GUI response, secure connectivity and reliable peripheral integration. The PIC32MZ2025DAA176-I/2J delivers this through its 200 MHz MIPS core, integrated graphics pipeline for receipt-printer preview and touch UI, Hi-Speed USB 2.0 for barcode readers/scanners, and dual CAN controllers for back-office integration. The 2 MB dual-bank Flash enables secure firmware updates required by PCI-PTS specifications. Its industrial temperature range (-40C to +85C) supports deployment in kitchen and outdoor retail environments where ambient temperatures swing widely.
Recommended
Medical Patient-Interface Displays
Medical display terminals require deterministic UI behaviour, low electromagnetic emissions and long-term firmware support. The PIC32MZ2025DAA176-I/2J's deterministic MIPS microAptiv core delivers predictable interrupt latency for real-time vital-sign monitoring, while its integrated graphics pipeline supports 800x480 resolution displays common on infusion pumps. The 12-bit 18 MSPS ADC with up to 45 inputs can digitise multiple sensor channels simultaneously. Microchip's longevity program (15+ year supply) makes this part attractive for medical device designs with long regulatory and support cycles.
Recommended
Building Automation Touchscreens
Building automation panels consolidate HVAC, lighting, security and access-control functions behind a single graphical interface. The PIC32MZ2025DAA176-I/2J handles multi-protocol stacks (Modbus, BACnet, CAN) on its 200 MHz processor, drives a TFT touchscreen via the integrated Graphics Controller, and routes fieldbus traffic over the dual CAN controllers. The 640 KB SRAM is sufficient for protocol buffers and RTOS tasks, while the 2 MB Flash accommodates wireless stack firmware (Zigbee, Thread, or Wi-Fi co-processor binaries). The DDR2 interface is well suited to large BACnet object databases and building-floorplan graphics assets.
Recommended
Portable Test and Measurement
Handheld oscilloscopes, data loggers and protocol analysers benefit from the PIC32MZ2025DAA176-I/2J's combination of 12-bit ADC bandwidth (45 channels at 18 MSPS), USB 2.0 Hi-Speed for PC data export, and TFT-LCD graphics for waveform display. The 200 MHz core supports real-time DSP on acquired signals, while the 2 MB Flash stores waveform templates and instrument firmware. Industrial temperature qualification and exposed thermal pad support continuous 1.5 W dissipation typical of battery-charged portable instruments.
Recommended
Automotive Infotainment Prototyping
The PIC32MZ2025DAA176-I/2J supports early-stage automotive infotainment and cluster prototypes where production-grade AEC-Q100 qualification is not yet mandatory. Its 200 MHz MIPS core, integrated graphics pipeline, CAN 2.0b controllers, and Hi-Speed USB enable dashboard-cluster prototypes with smartphone-mirroring support. Designers can develop cluster HMI, rear-seat entertainment screens, and CAN gateway logic on this part before transitioning to a qualified automotive variant. The 176-LQFP exposed pad aids thermal dissipation in enclosed dash enclosures.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MZ2025DAA176-I/2J — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MZ1064DAA176-I/2J | PIC32MZ1025DAA176-I/2J | PIC32MZ2064DAA176-I/2J | PIC32MZ2025DAB176-I/2J | PIC32MZ2025DAH176-I/2J |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20) with ePAD | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 2 MB | 2 MB | 1 MB (-50%) | 2 MB | 2 MB | 2 MB |
| SRAM | 640 KB | 1024 KB (+60%) | 1024 KB (+60%) | 1024 KB (+60%) | 640 KB | 640 KB or larger tier |
| Operating Voltage | 1.7-3.6 V | 1.7-3.6 V | 1.7-3.6 V | 1.7-3.6 V | 1.7-3.6 V | 1.7-3.6 V |
| Graphics Controller | Integrated + 2D GPU | Integrated + 2D GPU | Integrated + 2D GPU | Integrated + 2D GPU | Integrated + 2D GPU | Integrated + 2D GPU |
| Hi-Speed USB | Yes (480 Mbps) | Yes (480 Mbps) | Yes (480 Mbps) | Yes (480 Mbps) | Yes (480 Mbps) | Yes (480 Mbps) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Key Differentiators
- Integrated Graphics Controller and 2D GPU eliminate external display silicon (vs PIC32MX795F512L-80I/PF)
- DDR2 controller supports up to 128 MB external memory (vs PIC32MZ1025DAL176-I/2J)
- 12-bit 18 MSPS ADC with 45 analog inputs (vs PIC32MX775F512L-80I/PF)
Design Notes
When routing the external DDR2 interface, follow JEDEC DDR2 PCB recommendations: matched-length within 25 mils on each byte lane, controlled 50-ohm single-ended impedance, reference plane continuity on adjacent layers, and series-termination resistors placed close to the MCU pins. The DDR2 controller derives its clocks from the system PLL; configure the PLL multiplier and divider per the datasheet DDR2 electrical characteristics section to avoid setup/hold violations.
Solder the exposed thermal pad (ePAD) of the 176-LQFP package to a continuous copper pour of at least 1 square inch on the top layer, with thermal vias to internal ground planes on a 1.2 mm pitch grid. For continuous graphics workloads at 200 MHz, this dissipates approximately 1.5 W. Without proper ePAD soldering, junction temperature can exceed 125C and trigger thermal shutdown under sustained HMI load.
Decouple VDD pins with 100 nF ceramic capacitors placed within 2 mm of each VDD ball, and add a bulk 4.7 uF to 10 uF ceramic near the package. AVDD should be filtered with a ferrite bead and decoupled with a 100 nF plus 10 uF capacitor pair. The VUSB pin (3.3V USB transceiver supply) requires its own 100 nF + 4.7 uF decoupling pair to meet USB 2.0 Hi-Speed signal-integrity requirements.
Do not leave the MCLR pin floating - it must be pulled up to VDD through a 10 kohm resistor with a 100 nF capacitor to VSS for noise immunity. Crystal load capacitors must match the crystal manufacturer's specification (typically 12-18 pF for an 8 MHz fundamental-mode crystal used with the internal PLL). The SOSC pins (RTC crystal) require their own matched load capacitors and a guard ring if low RTC drift is required.
Compliance Information
Industrial temperature grade (-40C to +85C). RoHS compliant per Microchip product page and distributor listings. Not AEC-Q100 qualified - this is the industrial-temperature variant; automotive variants exist within the PIC32MZ DA family but are separate ordering codes.