MRF6S21100NR1 vs MRF6S21100NBR1 Сравнение
Подробное сравнение бок о бок MRF6S21100NR1 от NXP Semiconductors и MRF6S21100NBR1 от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | MRF6S21100NR1 | MRF6S21100NBR1 |
|---|---|---|
| Бренд | NXP Semiconductors | NXP Semiconductors |
| Категория | MOSFETs | MOSFETs |
| Статус жизненного цикла | Активен | Obsolete |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $21,24 | $25,00 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP Semiconductors (formerly Freescale) |
| Тип транзистора | LDMOS, N-Channel Enhancement-Mode Lateral MOSFET | N-Channel Enhancement-Mode LDMOS (Lateral MOSFET) |
| Technology | RF Power LDMOS (7th-generation) | LDMOS, enhancement-mode |
| Frequency Band | 2110 MHz to 2170 MHz (W-CDMA downlink) | — |
| Drain Voltage (VDD) | 28 V | — |
| Drain Current (Continuous) | 1.05 A | — |
| Drain Current (Pulsed) | [DATA_NEEDED: pulsed drain current value] | — |
| Power Gain | 14.5 dB typical at 2.11 GHz | — |
| Output Power (Pout) | 23 W average (W-CDMA) | — |
| Quiescent Current (IDQ) | 1600 mA | — |
| Корпус / Типоразмер | TO-270 WB-4 (Case 1486-03, Style 1) | TO-272 WB-4 (plastic over-molded) |
| Тип монтажа | Surface Mount (plastic overmold) | Surface Mount / Flange Mount with PCB thermal pad |
| Operating Mode | Class AB | — |
| Modulation Support | W-CDMA, TDMA, CDMA, multi-carrier | — |
| Drain-Source Breakdown (V(BR)DSS) | 68 V (rated) | — |
| Статус RoHS | [DATA_NEEDED: confirm RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Operating Frequency Range | — | 2110 MHz to 2170 MHz |
| Drain Supply Voltage (Typical) | — | 28 V |
| Pout (Average, W-CDMA) | — | 23 W |
| Power Gain (Typical) | — | 14.5 dB |
| Operating Current (at Pout) | — | 1.05 A |
| Quiescent Current (IDQ, Typical) | — | 1600 mA |
| Drain Voltage Rated | — | 68 V |
| Supplier Device Package | — | TO-272BB |
| Application | — | W-CDMA base station, TD-SCDMA, multicarrier PA, cellular final-stage |
| Part Status | — | Obsolete |
| Рабочая температура | — | [DATA_NEEDED: operating temperature range] |