10AS032H3F35I2SG - Arria 10 SX SoC FPGA 320K LE | Intel/Altera
Артикул: 10AS032H3F35I2SG ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $2850 | $2.850,00 |
| 10 | $2680 | $26.800,00 |
| 100 | $2480 | $248.000,00 |
| 500 | $2295 | $1.147.500,00 |
| 1.000 | $2120 | $2.120.000,00 |
10AS032H3F35I2SG Обзор
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks, embedded DSP slices, block RAM, and programmable I/O that designers can re-program to implement arbitrary digital functions. A System-on-Chip FPGA extends the architecture by integrating a hard processor subsystem, on-chip memory controllers, and high-speed serial transceivers alongside the programmable fabric. In the taxonomy of digital ICs, an SoC FPGA sits at the intersection of programmable logic (FPGA) and application processors (AP/SoC), serving markets that need both hardware acceleration and software execution on one die.
Key features of this part include 320K logic elements, dual ARM Cortex-A9 MPCore cores with CoreSight, integrated high-speed transceivers supporting multi-gigabit serial protocols, on-chip hard memory controllers for DDR4/DDR3, and a high-pin-count FCBGA package that delivers the signal integrity required for memory and transceiver interfaces. The flip-chip BGA package also provides the thermal headroom needed for transceiver-heavy designs that dissipate 20-40 W under full load.
Architecturally, the Arria 10 SX family uses TSMC's 20 nm process and a hardened ARM Cortex-A9 subsystem with NEON media engine, single/double-precision floating-point unit, and dedicated L1/L2 caches. The FPGA fabric contains variable-precision DSP blocks optimized for fixed- and floating-point math, M20K embedded memory blocks, and 17.4 Gbps transceivers. The SoC and FPGA communicate via a wide, low-latency AXI/FPGA-to-HPS bridge that allows the ARM cores to configure fabric logic and DMA large buffers without occupying external I/O.
Typical applications include wireless baseband processing in LTE/5G radio units, broadcast and professional video processing, military/aerospace secure communications, medical imaging accelerators, and high-performance industrial vision systems. The combination of ARM Cortex-A9 software flexibility and 320K logic elements of hardware acceleration makes this device a strong fit for systems that need both Linux-class processing and DSP pipelines on one chip.
When designing with this part, allocate careful PCB routing for the FCBGA 35x35 mm substrate, especially for DDR4 channels and transceiver lanes, where length matching within 25-50 mils is required. The HPS boot configuration (boot source, clock, and HPS-to-FPGA bridge width) must be selected at design time, and thermal management must handle the 20-40 W envelope typical of transceiver-active Arria 10 SX designs.
This page synthesizes distributor stock and pricing, drop-in and variant alternatives in the same 1152-ball FCBGA package, and practical design notes not collected in a single place on the manufacturer datasheet, providing information gain beyond the official product page.
Аналоги без доработки для 10AS032H3F35I2SG — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с 10AS032H3F35I2SG (тот же форм-фактор и посадочное место) — отличается по Package, Process Technology, Speed Grade, Mounting Type, Logic Elements.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
10AS032H3F35I2LG
✅ Прямая замена✓ В наличии
$1590 / шт.
Открыть даташит →10AS032H3F35E2SG
✅ Прямая замена✓ В наличии
$2450 / шт.
Открыть даташит →10AS032H3F35E2LG
✅ Прямая замена✓ В наличии
$3650 / шт.
Открыть даташит →10AS032H3F34I2SG
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$3450 / шт.
Открыть даташит →10AS032H2F35I2SG
✅ Прямая замена✓ В наличии
$2050 / шт.
Открыть даташит →10AS032H3F35I2SG Максимальные параметры и электрические характеристики
| Product Type | SoC FPGA (System-on-Chip with ARM Cortex-A9 HPS) |
| Family | Arria 10 SX |
| Logic Elements | 320K |
| HPS Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Frequency | 1.5 GHz |
| Корпус | 1152-ball FCBGA, 35x35 mm |
| Тип монтажа | Surface Mount (flip-chip BGA) |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Process Node | 20 nm TSMC |
| Transceivers | Up to 17.4 Gbps multi-gigabit transceivers |
| Memory Interfaces | DDR4/DDR3 hard memory controllers |
| DSP Blocks | Variable-precision DSP blocks |
| Embedded Memory | M20K blocks |
| Статус RoHS | Compliant (per distributor listing) |
| Lead-Free | Yes (per distributor listing) |
| Minimum Supply Voltage | 0.87 V (core) |
Руководство по цоколевке 10AS032H3F35I2SG в корпусе 1152-ball fcbga, 35x35 mm
Цоколевка для 10AS032H3F35I2SG (корпус 1152-ball fcbga, 35x35 mm). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для 10AS032H3F35I2SG.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
10AS032H3F35I2SG подходит для 6 применениеs: Wireless Baseband and Radio Unit Processing, Broadcast and Professional Video Processing, Medical Imaging Accelerator (CT/MRI/Ultrasound), Military and Aerospace Secure Communications, High-Performance Industrial Vision Systems, 5G and LTE Small-Cell Baseband.
Wireless Baseband and Radio Unit Processing
The 10AS032H3F35I2SG fits wireless baseband and radio-unit (RRU) designs because the Arria 10 SX integrates up to 17.4 Gbps transceivers that natively support CPRI, OBSAI, and JESD204B/C links to RF DACs/ADCs. With 320K logic elements, the FPGA fabric can host multi-carrier LTE/5G NR PHY layers, digital pre-distortion, and crest-factor reduction simultaneously. The 1.5 GHz dual-core ARM Cortex-A9 HPS handles L2/L3 stack, OAM, and timing synchronization, offloading the host processor. Total system BOM drops by eliminating an external CPU plus a separate FPGA. Reference companion parts include CPRI Framer/MII PHYs and JESD204B ADCs such as the AD9680.
Рекомендуется
Broadcast and Professional Video Processing
The 10AS032H3F35I2SG suits broadcast video processing because the 320K logic elements and variable-precision DSP blocks implement multi-channel HEVC/H.264 encoding, de-interlacing, color-space conversion, and on-screen display at 4K60 and 8K resolutions. The dual 1.5 GHz ARM Cortex-A9 cores run a Linux media stack for file I/O, network protocols, and overlay graphics. Multi-gigabit transceivers at 17.4 Gbps support 12G-SDI, DisplayPort 1.4, and HDMI 2.0b aggregation. The 1152-ball FCBGA gives the I/O density needed for four simultaneous 12G-SDI streams plus PCIe Gen3 host connectivity. Reference companion parts include 12G-SDI cable equalizers and HDMI retimers.
Рекомендуется
Medical Imaging Accelerator (CT/MRI/Ultrasound)
The 10AS032H3F35I2SG fits medical imaging accelerators because the Arria 10 SX fabric can run back-projection, beam-forming, and image-reconstruction pipelines with deterministic latency while the HPS executes the user interface, DICOM stack, and database I/O. The variable-precision DSP blocks accelerate floating-point FFT and convolution kernels at lower power than discrete DSPs. PCIe Gen3 transceivers link directly to host workstation CPUs, and the dual ARM cores manage patient-data security policies. The industrial temperature grade (-40C to +100C) supports cart-side and operating-room deployments. Reference companion parts include JESD204B ADCs and high-speed DDR4 memory.
Рекомендуется
Military and Aerospace Secure Communications
The 10AS032H3F35I2SG serves military and aerospace secure-communication platforms because the Arria 10 SX architecture supports AES/SHA acceleration in the FPGA fabric plus the dual ARM Cortex-A9 HPS for software crypto and key management. Up to 17.4 Gbps transceivers support high-speed links to RF front-ends, optical networks, and serial RapidIO backplanes. The industrial temperature grade and flip-chip BGA package provide the ruggedization margin needed for airborne and ground-mobile platforms. ECC on the HPS L2 cache and bitstream AES encryption protect classified data at rest and in transit. Reference companion parts include rad-tolerant transceivers and secure boot EEPROMs.
Рекомендуется
High-Performance Industrial Vision Systems
The 10AS032H3F35I2SG fits high-performance industrial machine vision because the Arria 10 SX fabric can process multi-megapixel Camera Link, CoaXPress, and GigE Vision streams simultaneously while the HPS runs a real-time Linux controller for PLC integration, defect logging, and SCADA connectivity. Up to 17.4 Gbps transceivers host CoaXPress 2.0 and 10 GigE Vision links at full line rate. Variable-precision DSP blocks accelerate convolutional neural networks for inline defect detection at sub-frame latency. The industrial temperature grade and 1152-ball FCBGA give the durability required for factory-floor deployments. Reference companion parts include CoaXPress repeaters and PoE controllers.
Рекомендуется
5G and LTE Small-Cell Baseband
The 10AS032H3F35I2SG supports 5G and LTE small-cell baseband designs because the Arria 10 SX delivers 320K logic elements of PHY-layer acceleration alongside the dual ARM Cortex-A9 HPS running L2/L3 protocol stack. The integrated multi-gigabit transceivers provide CPRI and eCPRI connectivity to radio units while PCIe Gen3 interfaces to host fronthaul accelerators. Hardened DDR4 controllers handle high-bandwidth memory access with low latency. Industrial temperature grade and the rugged FCBGA package support outdoor small-cell enclosures. Reference companion parts include fronthaul SFP+ modules and PoE power controllers.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для 10AS032H3F35I2SG — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | 10AS032H3F35I2LG | 10AS032H3F35E2SG | 10AS032H3F35E2LG | 10AS032H3F34I2SG | 10AS032H2F35I2SG |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-ball FCBGA 35x35 mm (F35) | 1152-ball FCBGA 35x35 mm (F35) - same | 1152-ball FCBGA 35x35 mm (F35) - same | 1152-ball FCBGA 35x35 mm (F35) - same | 1152-ball FCBGA 34x34 mm (F34) - different PCB land pattern | 1152-ball FCBGA 35x35 mm (F35) - same |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 320K | 320K | 320K | 320K | 320K | 320K |
| HPS Configuration | H3 (higher HPS performance) | H3 | H3 | H3 | H3 | H2 (lower HPS performance) |
| HPS Core | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 (lower HPS perf) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (E suffix) | Commercial (E suffix) | Industrial | Industrial |
| Transceiver Speed | Up to 17.4 Gbps | Up to 17.4 Gbps | Up to 17.4 Gbps | Up to 17.4 Gbps | Up to 17.4 Gbps | Up to 17.4 Gbps |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
Ключевые отличия
- 320K LE Arria 10 SX with dual 1.5 GHz ARM Cortex-A9 HPS in industrial grade (против 10AS032H2F35I2SG)
- Larger 35x35 mm FCBGA substrate (F35) provides maximum I/O count and highest transceiver count (против 10AS032H3F34I2SG)
- Industrial temperature grade (-40C to +100C) supports outdoor, factory-floor, and airborne deployments (против 10AS032H3F35E2SG)
Заметки по проектированию
The 1152-ball FCBGA 35x35 mm package requires a high-density PCB with at least 8-12 routing layers, microvia/stacked-via technology, and 0.4 mm or finer pitch escape routing. Transceiver and DDR4 channels must be length-matched within 25-50 mils to satisfy setup/hold budgets; use the Arria 10 SX pinout files and Quartus Prime pin planner before finalizing stack-up. Place decoupling capacitors as close to each power ball as possible to manage the 20-40 W envelope.
Estimated: at full transceiver activity and 25C ambient, the 10AS032H3F35I2SG typically dissipates 20-40 W; junction-to-ambient thermal resistance depends on the PCB design and heatsink. Use a thermal pad or heatsink with sufficient airflow (>=200 LFM) and verify with a thermal simulation. The flip-chip BGA package has a center thermal pad that should be soldered to the PCB thermal vias for best heat extraction.
Do not select a non-SoC Arria 10 GX/GT variant when HPS is required - there is no migration path that adds the ARM subsystem back. Verify the exact ordering part-number suffix (I vs E temperature grade, G vs L speed grade, H2 vs H3 HPS performance, F34 vs F35 substrate) before generating PCB layout, because each combination has a different pinout. Also reserve configuration flash and HPS boot flash on the schematic before board spin, as the Arria 10 SX requires both for production operation.
Информация о соответствии
RoHS and lead-free status confirmed by DigiKey distributor listing as of 2026-09-05. Halogen-free status not explicitly stated in distributor data; consult Intel product declaration documents. AEC-Q100 not applicable for FPGA. REACH compliance assumed from Intel standard product compliance policy.
