10CX105YU484I6G - Cyclone 10 GX FPGA, 104K LE, 484-BGA | Intel
Артикул: 10CX105YU484I6G ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $485 | $485,00 |
| 10 | $460 | $4.600,00 |
| 100 | $420 | $42.000,00 |
| 250 | $395 | $98.750,00 |
| 500 | $372 | $186.000,00 |
10CX105YU484I6G Обзор
An FPGA is a programmable logic device whose architecture is built from an array of configurable logic blocks (CLBs), programmable routing, dedicated DSP and block-memory tiles, and high-speed serial transceivers, all wrapped by user I/O. FPGAs sit at the top of the digital-semiconductor hierarchy alongside microcontrollers and ASICs, but are distinguished by hardware-level parallelism and the ability to reconfigure logic after PCB assembly. The Cyclone 10 GX family is Intel's low-power, transceiver-equipped member of the Cyclone 10 series, balancing cost per logic element against bandwidth for video, industrial imaging, and machine-vision pipelines.
Key features of the 10CX105YU484I6G include 6 transceivers at up to 12.5 Gbps, 156 DSP blocks (18x18 multipliers), 4 PLLs, 1.4 Gbps LVDS support, and a hard memory controller for external DDR3 up to 1.866 Gbps. The device is available in industrial temperature grade (-40C to 100C) with Pb-free and RoHS-compliant packaging.
Typical applications include industrial machine vision, broadcast video processing, ProAV signal routing, motor control and industrial Ethernet bridging, and PCIe Gen2 endpoint designs that need a small-form-factor BGA with high I/O count. The 484-ball UBGA footprint is shared across several Cyclone 10 GX density points and package options, simplifying PCB layout reuse.
When designing with this device, ensure that PCB layout meets Intel's transceiver channel guidelines (controlled-impedance routing, AC-coupling capacitors, length matching) and that the Quartus Prime power-estimation flow is run before sign-off to size decoupling capacitors and voltage-rail current. The industrial-grade variant supports extended operation but still requires the same thermal envelope as commercial parts when dissipation exceeds the package's typical theta_JA.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes that are not found in the standalone Intel datasheet, helping engineers shorten the sourcing and qualification cycle for Cyclone 10 GX designs.
Аналоги без доработки для 10CX105YU484I6G — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с 10CX105YU484I6G (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Embedded Memory, Transceivers, DSP Blocks.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
10CX105YU484I5G
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$954.5455 / шт.
Открыть даташит →10CX105YU484E6G
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$65.8 / шт.
Открыть даташит →10CX105YU484E5G
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$275 / шт.
Открыть даташит →10CX085YU484I6G
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$155.6 / шт.
Открыть даташит →10CX085YU484I5G
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$85 / шт.
Открыть даташит →10CX085YU484E6G
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$282 / шт.
Открыть даташит →10CX085YU484E5G
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$82.4 / шт.
Открыть даташит →10CX105YU484I6G Максимальные параметры и электрические характеристики
| Family | Cyclone 10 GX |
| Logic Elements (LE) | 104,000 |
| Embedded Memory | 8,641,536 bits (864 Kb) |
| DSP Blocks | 156 (18x18 multipliers) |
| Transceivers | 6 |
| Transceiver Data Rate | Up to 12.5 Gbps |
| PLLs | 4 |
| User I/O Pins | 188 |
| LVDS Support | Up to 1.4 Gbps |
| External Memory Interface | DDR3 up to 1866 Mbps, 72-bit wide |
| Process Technology | 20 nm |
| Корпус | 484-ball UBGA (U484) |
| Рабочая температура | -40C to +100C (Industrial) |
| Тип монтажа | Surface Mount |
| Статус RoHS | Compliant |
Руководство по цоколевке 10CX105YU484I6G в корпусе 484-ball ubga (u484)
Цоколевка для 10CX105YU484I6G (корпус 484-ball ubga (u484)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для 10CX105YU484I6G.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
10CX105YU484I6G подходит для 6 применениеs: Industrial Machine Vision Systems, Broadcast Video Processing and ProAV Routing, PCIe Gen2 Endpoint Cards, Motor Control and Industrial Ethernet, Software-Defined Radio Front-End, Medical Imaging and Diagnostic Equipment.
Industrial Machine Vision Systems
The 10CX105YU484I6G fits industrial machine vision because its six 12.5 Gbps transceivers drive multi-lane CoaXPress or 10GigE Vision camera links, while the 156 DSP blocks accelerate Bayer demosaic, white-balance, and edge-detection kernels in real time. With 104K logic elements the device can host an image-processing pipeline plus a GigE Vision / CoaXPress protocol stack simultaneously. Its 8.64 Mbits of block RAM serves as line-buffer memory for sensors up to 4K resolution, and the 72-bit DDR3 controller at 1866 Mbps handles frame transfer to host memory without stalls. The industrial temperature range (-40C to +100C) and the 19x19 mm UBGA-484 footprint suit compact factory-floor cameras and frame grabbers.
Рекомендуется
Broadcast Video Processing and ProAV Routing
Broadcast video processors benefit from the 10CX105YU484I6G's 12.5 Gbps transceivers, which natively support 12G-SDI (SMPTE ST 2082), 6G-SDI, and 3G-SDI standards with embedded audio and ancillary data. The 104K logic elements enable multi-input video switchers and quad-SDI input cards, while 156 DSP blocks accelerate color-space conversion and scaling. The 484-ball UBGA package with 188 user I/Os provides sufficient GPIO for HDMI/SDI bridge glue logic and front-panel control. DDR3 support at 1866 Mbps allows full-resolution 4K frame buffers, and the -6 speed grade maintains timing margins on critical video-clock paths.
Рекомендуется
PCIe Gen2 Endpoint Cards
The 10CX105YU484I6G's hard PCIe Gen2 IP core, paired with its transceivers, allows direct PCIe x1/x2/x4 endpoint implementation without external bridge chips. Designers can build low-cost data-acquisition cards, software-defined radio front-ends, and storage controllers with this single FPGA. The 8.64 Mbits of block RAM acts as DMA buffer memory, while the DDR3 controller offloads bulk transfers to system memory. Industrial temperature and 104K logic elements support protocol stack plus application logic in a single device, eliminating the need for a companion MCU. The -6 speed grade closes timing on Gen2 at 5 Gbps.
Рекомендуется
Motor Control and Industrial Ethernet
Industrial motor drives and EtherCAT / PROFINET slave controllers benefit from the 10CX105YU484I6G's combination of 188 user I/Os, hardware DSP blocks for Field-Oriented Control (FOC) algorithms, and 12.5 Gbps transceivers for industrial Ethernet uplinks. The 156 DSP blocks deliver the throughput needed for simultaneous current, speed, and position loops at 32 kHz PWM rates. Industrial temperature grade ensures reliable operation in enclosed drive cabinets, and the 484-ball UBGA package supports dense integration with power-stage gate drivers on the same PCB. The DDR3 controller handles large reference-table storage for sensorless control algorithms.
Рекомендуется
Software-Defined Radio Front-End
Software-defined radio (SDR) platforms use the 10CX105YU484I6G's six 12.5 Gbps transceivers as direct interfaces to ADC/DAC chips, supporting sample rates up to several hundred megasamples per second on each channel. The 156 DSP blocks implement digital down-conversion (DDC), digital up-conversion (DUC), FIR filtering, and FFT-based channelization in real time. With 104K logic elements, designers can integrate complete modem stacks including LDPC or Turbo decoders. The DDR3 interface at 1866 Mbps buffers wideband capture data, and industrial temperature grade suits tactical and outdoor radio deployments.
Рекомендуется
Medical Imaging and Diagnostic Equipment
Medical ultrasound and endoscopy systems leverage the 10CX105YU484I6G's parallel processing capabilities for beamforming, image reconstruction, and real-time filtering. The 156 DSP blocks handle ultrasound beamforming computations across 64-128 channels at pulse-repetition frequencies required for clinical imaging, while 104K logic elements implement the system control and image-processing pipeline. The DDR3 controller at 1866 Mbps manages large ultrasound frame buffers without external memory contention. The industrial temperature range and 484-ball UBGA package suit compact portable diagnostic carts where board space and reliability are critical. Compliance pathways for medical equipment are simplified by the device's RoHS-compliant, Pb-free packaging.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для 10CX105YU484I6G — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | 10CX105YU484I5G | 10CX105YU484E6G | 10CX085YU484I6G | 10CX085YU484I5G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball UBGA (U484) | 484-ball UBGA (U484) - same | 484-ball UBGA (U484) - same | 484-ball UBGA (U484) - same | 484-ball UBGA (U484) - same |
| Logic Elements | 104,000 | 104,000 | 104,000 | 85,000 (-18%) | 85,000 (-18%) |
| Speed Grade | -6 | -5 (slower) | -6 (same) | -6 (same) | -5 (slower) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) - same | Extended (-40C to +125C) - wider | Industrial - same | Industrial - same |
| Transceivers | 6 (up to 12.5 Gbps) | 6 (up to 12.5 Gbps) - same | 6 (up to 12.5 Gbps) - same | 6 (up to 12.5 Gbps) - same | 6 (up to 12.5 Gbps) - same |
| Process Technology | 20 nm | 20 nm - same | 20 nm - same | 20 nm - same | 20 nm - same |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes |
Ключевые отличия
- Highest-speed grade available in the Cyclone 10 GX 484-ball family (против 10CX105YU484I5G)
- Highest density 484-ball Cyclone 10 GX variant (против 10CX085YU484I6G)
- Industrial temperature coverage while preserving full speed grade (против 10CX105YU484E6G)
Заметки по проектированию
The 10CX105YU484I6G requires multiple supply rails (VCC, VCCPT, VCCIO, VCCA, VCCR, VCCT, VCCBAT) per the Cyclone 10 GX device datasheet. Estimated: when all six transceivers run at 12.5 Gbps and DSP blocks are at 80% utilization, total device power can reach 8-12 W. Use the Intel Quartus Prime Early Power Estimator before PCB layout to size the regulator current budget, and place a 4.7uF + 0.1uF ceramic bypass network on each VCC pin pair with vias directly under the package BGA balls to minimize inductance.
For 12.5 Gbps transceiver channels, follow Intel's channel-bonding guidelines: use 85 ohm differential controlled-impedance routing, place AC-coupling capacitors (100 nF) within 200 mil of the transmitter ball, and maintain length matching within 5 mil across the differential pair. Ground-reference stitching vias should be placed every lambda/10 along the route. For DDR3 interfaces at 1866 Mbps, follow the read/write DQ length-matching rules in the Cyclone 10 GX external memory interface handbook.
Do not confuse the I (industrial) and E (extended) temperature suffixes - the industrial grade is -40C to +100C while the extended grade is -40C to +125C. Also, the U484 UBGA package uses 0.8 mm ball pitch and requires PCB manufacturing with 4-mil line/space capability; verify that your PCB fabricator supports this before finalizing the layout. Finally, ensure MSL3 moisture-handling procedures are followed for the UBGA package, as it is moisture-sensitive.
The U484 UBGA package has a typical theta_JA of approximately 12 C/W with sufficient PCB copper area and airflow. Estimated: at 8 W dissipation and 25C ambient with 100 LFM airflow, junction temperature reaches about 121C, which exceeds the industrial grade maximum. To stay below 100C at 8 W, reduce ambient temperature or add a heatsink. The thermal pad of the U484 package is not exposed - heat must be removed through PCB copper and vias to internal ground planes.
Информация о соответствии
RoHS and REACH compliant per Intel product page. Pb-free and halogen-free packaging. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC, though industrial temperature grade supports many industrial and transportation applications.