10CX105YU484I6G - Cyclone 10 GX FPGA, 104K LE, 484-BGA | Intel
부품 번호: 10CX105YU484I6G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $460 | $4,600.00 |
| 100 | $420 | $42,000.00 |
| 250 | $395 | $98,750.00 |
| 500 | $372 | $186,000.00 |
10CX105YU484I6G 개요
An FPGA is a programmable logic device whose architecture is built from an array of configurable logic blocks (CLBs), programmable routing, dedicated DSP and block-memory tiles, and high-speed serial transceivers, all wrapped by user I/O. FPGAs sit at the top of the digital-semiconductor hierarchy alongside microcontrollers and ASICs, but are distinguished by hardware-level parallelism and the ability to reconfigure logic after PCB assembly. The Cyclone 10 GX family is Intel's low-power, transceiver-equipped member of the Cyclone 10 series, balancing cost per logic element against bandwidth for video, industrial imaging, and machine-vision pipelines.
Key features of the 10CX105YU484I6G include 6 transceivers at up to 12.5 Gbps, 156 DSP blocks (18x18 multipliers), 4 PLLs, 1.4 Gbps LVDS support, and a hard memory controller for external DDR3 up to 1.866 Gbps. The device is available in industrial temperature grade (-40C to 100C) with Pb-free and RoHS-compliant packaging.
Typical applications include industrial machine vision, broadcast video processing, ProAV signal routing, motor control and industrial Ethernet bridging, and PCIe Gen2 endpoint designs that need a small-form-factor BGA with high I/O count. The 484-ball UBGA footprint is shared across several Cyclone 10 GX density points and package options, simplifying PCB layout reuse.
When designing with this device, ensure that PCB layout meets Intel's transceiver channel guidelines (controlled-impedance routing, AC-coupling capacitors, length matching) and that the Quartus Prime power-estimation flow is run before sign-off to size decoupling capacitors and voltage-rail current. The industrial-grade variant supports extended operation but still requires the same thermal envelope as commercial parts when dissipation exceeds the package's typical theta_JA.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes that are not found in the standalone Intel datasheet, helping engineers shorten the sourcing and qualification cycle for Cyclone 10 GX designs.
드롭인 대체품: 10CX105YU484I6G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10CX105YU484I6G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Embedded Memory, Transceivers, DSP Blocks.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10CX105YU484I5G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$954.5455 / 개
데이터시트 보기 →10CX105YU484E6G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$65.8 / 개
데이터시트 보기 →10CX105YU484E5G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$275 / 개
데이터시트 보기 →10CX085YU484I6G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$155.6 / 개
데이터시트 보기 →10CX085YU484I5G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$85 / 개
데이터시트 보기 →10CX085YU484E6G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$282 / 개
데이터시트 보기 →10CX085YU484E5G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$82.4 / 개
데이터시트 보기 →10CX105YU484I6G 최대 정격 & 전기적 특성
| Family | Cyclone 10 GX |
| Logic Elements (LE) | 104,000 |
| Embedded Memory | 8,641,536 bits (864 Kb) |
| DSP Blocks | 156 (18x18 multipliers) |
| Transceivers | 6 |
| Transceiver Data Rate | Up to 12.5 Gbps |
| PLLs | 4 |
| User I/O Pins | 188 |
| LVDS Support | Up to 1.4 Gbps |
| External Memory Interface | DDR3 up to 1866 Mbps, 72-bit wide |
| Process Technology | 20 nm |
| 패키지 | 484-ball UBGA (U484) |
| 동작 온도 | -40C to +100C (Industrial) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
10CX105YU484I6G 484-ball ubga (u484) 핀 구성 가이드
10CX105YU484I6G(484-ball ubga (u484) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10CX105YU484I6G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10CX105YU484I6G 적합 용도: 6 애플리케이션s: Industrial Machine Vision Systems, Broadcast Video Processing and ProAV Routing, PCIe Gen2 Endpoint Cards, Motor Control and Industrial Ethernet, Software-Defined Radio Front-End, Medical Imaging and Diagnostic Equipment.
Industrial Machine Vision Systems
The 10CX105YU484I6G fits industrial machine vision because its six 12.5 Gbps transceivers drive multi-lane CoaXPress or 10GigE Vision camera links, while the 156 DSP blocks accelerate Bayer demosaic, white-balance, and edge-detection kernels in real time. With 104K logic elements the device can host an image-processing pipeline plus a GigE Vision / CoaXPress protocol stack simultaneously. Its 8.64 Mbits of block RAM serves as line-buffer memory for sensors up to 4K resolution, and the 72-bit DDR3 controller at 1866 Mbps handles frame transfer to host memory without stalls. The industrial temperature range (-40C to +100C) and the 19x19 mm UBGA-484 footprint suit compact factory-floor cameras and frame grabbers.
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Broadcast Video Processing and ProAV Routing
Broadcast video processors benefit from the 10CX105YU484I6G's 12.5 Gbps transceivers, which natively support 12G-SDI (SMPTE ST 2082), 6G-SDI, and 3G-SDI standards with embedded audio and ancillary data. The 104K logic elements enable multi-input video switchers and quad-SDI input cards, while 156 DSP blocks accelerate color-space conversion and scaling. The 484-ball UBGA package with 188 user I/Os provides sufficient GPIO for HDMI/SDI bridge glue logic and front-panel control. DDR3 support at 1866 Mbps allows full-resolution 4K frame buffers, and the -6 speed grade maintains timing margins on critical video-clock paths.
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PCIe Gen2 Endpoint Cards
The 10CX105YU484I6G's hard PCIe Gen2 IP core, paired with its transceivers, allows direct PCIe x1/x2/x4 endpoint implementation without external bridge chips. Designers can build low-cost data-acquisition cards, software-defined radio front-ends, and storage controllers with this single FPGA. The 8.64 Mbits of block RAM acts as DMA buffer memory, while the DDR3 controller offloads bulk transfers to system memory. Industrial temperature and 104K logic elements support protocol stack plus application logic in a single device, eliminating the need for a companion MCU. The -6 speed grade closes timing on Gen2 at 5 Gbps.
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Motor Control and Industrial Ethernet
Industrial motor drives and EtherCAT / PROFINET slave controllers benefit from the 10CX105YU484I6G's combination of 188 user I/Os, hardware DSP blocks for Field-Oriented Control (FOC) algorithms, and 12.5 Gbps transceivers for industrial Ethernet uplinks. The 156 DSP blocks deliver the throughput needed for simultaneous current, speed, and position loops at 32 kHz PWM rates. Industrial temperature grade ensures reliable operation in enclosed drive cabinets, and the 484-ball UBGA package supports dense integration with power-stage gate drivers on the same PCB. The DDR3 controller handles large reference-table storage for sensorless control algorithms.
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Software-Defined Radio Front-End
Software-defined radio (SDR) platforms use the 10CX105YU484I6G's six 12.5 Gbps transceivers as direct interfaces to ADC/DAC chips, supporting sample rates up to several hundred megasamples per second on each channel. The 156 DSP blocks implement digital down-conversion (DDC), digital up-conversion (DUC), FIR filtering, and FFT-based channelization in real time. With 104K logic elements, designers can integrate complete modem stacks including LDPC or Turbo decoders. The DDR3 interface at 1866 Mbps buffers wideband capture data, and industrial temperature grade suits tactical and outdoor radio deployments.
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Medical Imaging and Diagnostic Equipment
Medical ultrasound and endoscopy systems leverage the 10CX105YU484I6G's parallel processing capabilities for beamforming, image reconstruction, and real-time filtering. The 156 DSP blocks handle ultrasound beamforming computations across 64-128 channels at pulse-repetition frequencies required for clinical imaging, while 104K logic elements implement the system control and image-processing pipeline. The DDR3 controller at 1866 Mbps manages large ultrasound frame buffers without external memory contention. The industrial temperature range and 484-ball UBGA package suit compact portable diagnostic carts where board space and reliability are critical. Compliance pathways for medical equipment are simplified by the device's RoHS-compliant, Pb-free packaging.
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추천 제품 요약
엔지니어링 참조 데이터: 10CX105YU484I6G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10CX105YU484I5G | 10CX105YU484E6G | 10CX085YU484I6G | 10CX085YU484I5G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball UBGA (U484) | 484-ball UBGA (U484) - same | 484-ball UBGA (U484) - same | 484-ball UBGA (U484) - same | 484-ball UBGA (U484) - same |
| Logic Elements | 104,000 | 104,000 | 104,000 | 85,000 (-18%) | 85,000 (-18%) |
| Speed Grade | -6 | -5 (slower) | -6 (same) | -6 (same) | -5 (slower) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) - same | Extended (-40C to +125C) - wider | Industrial - same | Industrial - same |
| Transceivers | 6 (up to 12.5 Gbps) | 6 (up to 12.5 Gbps) - same | 6 (up to 12.5 Gbps) - same | 6 (up to 12.5 Gbps) - same | 6 (up to 12.5 Gbps) - same |
| Process Technology | 20 nm | 20 nm - same | 20 nm - same | 20 nm - same | 20 nm - same |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Highest-speed grade available in the Cyclone 10 GX 484-ball family (vs 10CX105YU484I5G)
- Highest density 484-ball Cyclone 10 GX variant (vs 10CX085YU484I6G)
- Industrial temperature coverage while preserving full speed grade (vs 10CX105YU484E6G)
설계 노트
The 10CX105YU484I6G requires multiple supply rails (VCC, VCCPT, VCCIO, VCCA, VCCR, VCCT, VCCBAT) per the Cyclone 10 GX device datasheet. Estimated: when all six transceivers run at 12.5 Gbps and DSP blocks are at 80% utilization, total device power can reach 8-12 W. Use the Intel Quartus Prime Early Power Estimator before PCB layout to size the regulator current budget, and place a 4.7uF + 0.1uF ceramic bypass network on each VCC pin pair with vias directly under the package BGA balls to minimize inductance.
For 12.5 Gbps transceiver channels, follow Intel's channel-bonding guidelines: use 85 ohm differential controlled-impedance routing, place AC-coupling capacitors (100 nF) within 200 mil of the transmitter ball, and maintain length matching within 5 mil across the differential pair. Ground-reference stitching vias should be placed every lambda/10 along the route. For DDR3 interfaces at 1866 Mbps, follow the read/write DQ length-matching rules in the Cyclone 10 GX external memory interface handbook.
Do not confuse the I (industrial) and E (extended) temperature suffixes - the industrial grade is -40C to +100C while the extended grade is -40C to +125C. Also, the U484 UBGA package uses 0.8 mm ball pitch and requires PCB manufacturing with 4-mil line/space capability; verify that your PCB fabricator supports this before finalizing the layout. Finally, ensure MSL3 moisture-handling procedures are followed for the UBGA package, as it is moisture-sensitive.
The U484 UBGA package has a typical theta_JA of approximately 12 C/W with sufficient PCB copper area and airflow. Estimated: at 8 W dissipation and 25C ambient with 100 LFM airflow, junction temperature reaches about 121C, which exceeds the industrial grade maximum. To stay below 100C at 8 W, reduce ambient temperature or add a heatsink. The thermal pad of the U484 package is not exposed - heat must be removed through PCB copper and vias to internal ground planes.
규정 준수 정보
RoHS and REACH compliant per Intel product page. Pb-free and halogen-free packaging. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC, though industrial temperature grade supports many industrial and transportation applications.