5CSEBA4U19I7 - Cyclone V SE SoC FPGA, 40K LE, Dual-A9, 484-UBGA | Intel / Altera
Артикул: 5CSEBA4U19I7 ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $35.38 | $35,38 |
| 10 | $32.5 | $325,00 |
| 100 | $29.75 | $2.975,00 |
| 500 | $27.1 | $13.550,00 |
| 1.000 | $24.95 | $24.950,00 |
5CSEBA4U19I7 Обзор
A System-on-Chip FPGA is a single silicon device that combines a general-purpose microprocessor subsystem (in this case the Hard Processor System, or HPS) with programmable logic on the same die, communicating through a high-bandwidth AXI/FPGA-to-HPS bridge. This architecture is widely used in embedded computing platforms that need deterministic hardware acceleration (in FPGA fabric) alongside a Linux/Android-capable application processor (in the HPS), replacing what would otherwise be a separate CPU + companion FPGA design.
Key specifications for the 5CSEBA4U19I7 include 40K logic elements, approximately 156 DSP blocks (18x18 multipliers), embedded memory in the form of M10K blocks, and the hard Cortex-A9 dual-core HPS with CoreSight debug, NEON SIMD, and a rich set of HPS peripherals (EMAC, USB, SD/MMC, NAND, SPI, I2C, UART). The U19 suffix denotes the 484-UBGA (19x19 mm, 1.0 mm pitch) package. Operating temperature is industrial (-40C to +100C), as indicated by the I7 speed/temperature grade.
The Cyclone V SE architecture uses a shared power network for HPS and FPGA with separate on-die voltage regulators, and supports the Altera SoC EDS toolchain (DS-5 / Arm Compiler / Yocto Linux). The 28 nm process node balances cost, density, and dynamic power for mid-volume embedded applications. Compared with discrete CPU + FPGA solutions, the SoC integration reduces board area, simplifies high-speed interconnect design, and lowers BOM cost.
Typical applications include industrial motor control, factory automation controllers, machine vision edge nodes, broadcast and pro-AV processing, medical patient monitoring, energy grid edge gateways, and automotive driver-assistance subsystems. The dual-A9 HPS is suitable for running real-time OS plus Linux, while FPGA fabric accelerates signal processing, motor control loops, or image processing pipelines.
When designing with this part, ensure the HPS boot configuration (BOOTSEL, NAND/NOR/SD) is selected correctly and that the shared HPS-to-FPGA AXI bridges are configured in Qsys/Platform Designer. The industrial temperature grade allows use in factory and outdoor cabinets without additional thermal headroom.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing an information-gain summary for embedded engineers selecting a Cyclone V SE SoC.
Аналоги без доработки для 5CSEBA4U19I7 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с 5CSEBA4U19I7 (тот же форм-фактор и посадочное место) — отличается по Package, Logic Elements, Operating Temperature, Process Technology, Embedded Memory.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
5CSEBA4U19I7N
✅ Прямая замена✓ В наличии
$72 / шт.
Открыть даташит →5CSEBA4U19C7N
✅ Прямая замена✓ В наличии
$36.92 / шт.
Открыть даташит →5CSEBA4U19C8N
✅ Прямая замена✓ В наличии
$54.75 / шт.
Открыть даташит →5CSEBA4U19C6N
✅ Прямая замена✓ В наличии
$74.5 / шт.
Открыть даташит →5CSEBA4U19A7N
✅ Прямая замена✓ В наличии
$99.9 / шт.
Открыть даташит →5CSEBA2U19I7N
✅ Прямая замена✓ В наличии
$445.65 / шт.
Открыть даташит →5CSEBA4U19I7 Максимальные параметры и электрические характеристики
| Device Family | Cyclone V SE SoC FPGA |
| Logic Elements | 40 K |
| Process Technology | 28 nm TSMC low-power |
| Core Voltage | 1.1 V |
| HPS Core | Dual-core ARM Cortex-A9 MPCore with CoreSight, NEON |
| HPS Maximum Frequency | 800 MHz |
| FPGA Maximum Frequency | 400 MHz |
| DSP Blocks | 156 (18x18 multipliers) |
| Embedded Memory | M10K blocks |
| Корпус | 484-UBGA (U19), 19x19 mm, 1.0 mm pitch |
| Рабочая температура | -40C to +100C (industrial, I7 grade) |
| HPS Peripherals | EMAC, USB 2.0, SD/MMC, NAND, SPI, I2C, UART, I2S |
| Тип монтажа | Surface Mount (BGA) |
| Статус RoHS | Compliant |
Руководство по цоколевке 5CSEBA4U19I7 в корпусе 484-ubga (u19), 19x19 mm, 1.0 mm pitch
Цоколевка для 5CSEBA4U19I7 (корпус 484-ubga (u19), 19x19 mm, 1.0 mm pitch). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для 5CSEBA4U19I7.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
5CSEBA4U19I7 подходит для 6 применениеs: Industrial Motor Control, Machine Vision Edge Node, Factory Automation Controller, Broadcast Pro-AV Processing, Medical Patient Monitoring, Energy Grid Edge Gateway.
Industrial Motor Control
The 5CSEBA4U19I7's 40K logic elements and 156 DSP blocks make it well suited for multi-axis industrial motor control loops where field-oriented control (FOC) and space-vector PWM run in FPGA fabric for deterministic sub-microsecond latency, while the dual Cortex-A9 HPS runs a Linux/RTOS stack for network protocols, HMI, and safety supervision. Engineers typically use the HPS for EtherCAT/MODBUS, the FPGA for current/torque control at 50-100 kHz per axis, with HPS-to-FPGA AXI bridging motor status at 1 Gbps.
Рекомендуется
Machine Vision Edge Node
For machine vision at the edge, the 5CSEBA4U19I7 pairs an FPGA image-signal-processing pipeline (sensor interface, lens correction, color-space conversion, edge detection) running in the 40K-LE fabric with a Cortex-A9 HPS running OpenCV/TensorFlow Lite on Linux for inference and result handling. The HPS-to-FPGA AXI bridge carries processed pixel data at high throughput, and the 28 nm low-power process enables fanless operation in industrial edge boxes. Industrial temperature grade supports deployment in factory cabinets.
Рекомендуется
Factory Automation Controller
As a factory automation controller, the 5CSEBA4U19I7 uses the dual-A9 HPS for SCADA/Ethernet-IP/MODBUS-TCP communication and PLC ladder logic, while the FPGA fabric implements high-speed deterministic I/O scanning, encoder counters, and PWM outputs. The industrial temperature grade (-40C to +100C) supports deployment in factory cabinets without extra thermal headroom, and 40K logic elements handle up to 64 axes of high-speed servo control alongside the HPS-side application logic.
Рекомендуется
Broadcast Pro-AV Processing
In broadcast pro-AV applications, the 5CSEBA4U19I7 FPGA fabric handles SDI/HDMI video processing pipelines (color space, scaling, deinterlacing) with deterministic throughput, while the dual-A9 HPS runs embedded Linux for streaming protocols (NDI, SRT, RTSP), web UI, and remote control. The 40K-LE fabric supports up to two simultaneous 1080p60 video streams and on-screen display compositing, with the HPS providing Ethernet connectivity for IP-based broadcast infrastructure.
Рекомендуется
Medical Patient Monitoring
For medical patient monitoring devices, the 5CSEBA4U19I7 FPGA fabric processes multi-channel ECG/EEG/SpO2 analog front-end signals with deterministic DSP filtering, while the dual-A9 HPS runs secure embedded Linux for display UI, network connectivity, and alarm handling. The 28 nm low-power process allows battery-powered portable designs, and 40K logic elements support up to 8 channels of low-latency DSP at clinical sampling rates. Industrial temperature grade accommodates hospital and home-care environments.
Рекомендуется
Energy Grid Edge Gateway
As an energy grid edge gateway, the 5CSEBA4U19I7 uses the FPGA fabric to interface with high-speed analog front-ends (current/voltage sensing at 50-100 kHz sampling) for power-quality analysis, while the dual-A9 HPS runs Linux with IEC 61850 / DNP3 / MODBUS protocol stacks for SCADA integration. The industrial temperature grade supports deployment in outdoor substation cabinets, and 40K logic elements handle multi-channel metering plus encryption acceleration for grid cybersecurity compliance.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для 5CSEBA4U19I7 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | 5CSEBA4U19I7N | 5CSEBA4U19C7N | 5CSEBA4U19C8N | 5CSEBA4U19C6N | 5CSEBA4U19A7N | 5CSEBA2U19I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-UBGA (U19) | 484-UBGA (U19) - same | 484-UBGA (U19) - same | 484-UBGA (U19) - same | 484-UBGA (U19) - same | 484-UBGA (U19) - same | 484-UBGA (U19) - same |
| Logic Elements | 40K | 40K | 40K | 40K | 40K | 40K | 25K (-37.5%) |
| HPS Core | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive (AEC-Q100) | Industrial (-40C to +100C) |
| Speed Grade | I7 | I7 | C7 | C8 (slower) | C6 (slowest) | A7 | I7 |
| Process Technology | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
Ключевые отличия
- Industrial temperature grade in identical 484-UBGA package (против 5CSEBA4U19C7N)
- Highest speed grade in this density tier (против 5CSEBA4U19C8N)
- Higher logic density than B2 variant for complex designs (против 5CSEBA2U19I7N)
Заметки по проектированию
Estimated: at 800 MHz HPS + 400 MHz FPGA with typical SoC utilization (~70% logic + active DSP), total on-die power dissipation is approximately 3-4 W. The 484-UBGA package has theta_JA around 18 C/W with standard 4-layer JEDEC PCB; junction temperature rise is therefore 54-72 C above ambient. For industrial -40C to +100C operation, sufficient copper thermal vias under the center ball grid are required. Always verify with actual thermal simulation against your specific design utilization.
The 484-UBGA at 1.0 mm pitch requires 4-layer PCB minimum with microvia stack-up (any-layer HDI preferred). Place decoupling capacitors (100 nF X7R + 4.7 uF bulk) within 3 mm of every power ball pair. The HPS and FPGA core supplies must be generated by separate LDOs with adequate sequencing - consult the Cyclone V SE Hardware Design Checklist for power-rail sequence requirements (1.1V core before 1.8V/2.5V/3.3V I/O). Maintain at least 4 vias per ground ball for thermal and electrical integrity.
Common pitfalls with the 5CSEBA4U19I7 include: (1) configuring the BOOTSEL pins for the wrong boot source and bricking the HPS, (2) forgetting to set MSEL[3:0] correctly for the desired configuration scheme (AS/PS/Fast passive), (3) using only single-core HPS mode when dual-core Linux SMP is needed, (4) under-sizing the HPS-to-FPGA AXI bridge width for high-throughput data movement, and (5) not enabling ECC on M10K memory blocks for safety-critical applications. Always generate pin assignments via Quartus Prime Pin Planner rather than hand-editing to avoid bank-VCCIO mismatches.
For BGA breakout routing on the 484-UBGA, escape one ball per signal between vias using 4-mil traces on the top microvia layer. Fanout the inner balls via dog-bone fanout to maintain routability on 4-layer stack-ups. Match length for DDR3 HPS memory interfaces within +/- 25 mil and follow the Cyclone V SE external memory interface guidelines. Keep HPS EMAC traces short and impedance-controlled to the RJ45 magnetics to avoid CRC errors on Gigabit Ethernet.
Информация о соответствии
RoHS compliant per Altera/Intel product page. Industrial temperature grade I7. For AEC-Q100 automotive qualification, choose 5CSEBA4U19A7N variant. Halogen-free status not explicitly stated in verified data.
