5CSEBA4U19I7 - Cyclone V SE SoC FPGA, 40K LE, Dual-A9, 484-UBGA | Intel / Altera
MPN: 5CSEBA4U19I7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $35.38 | $35.38 |
| 10 | $32.5 | $325.00 |
| 100 | $29.75 | $2,975.00 |
| 500 | $27.1 | $13,550.00 |
| 1,000 | $24.95 | $24,950.00 |
5CSEBA4U19I7 Overview
A System-on-Chip FPGA is a single silicon device that combines a general-purpose microprocessor subsystem (in this case the Hard Processor System, or HPS) with programmable logic on the same die, communicating through a high-bandwidth AXI/FPGA-to-HPS bridge. This architecture is widely used in embedded computing platforms that need deterministic hardware acceleration (in FPGA fabric) alongside a Linux/Android-capable application processor (in the HPS), replacing what would otherwise be a separate CPU + companion FPGA design.
Key specifications for the 5CSEBA4U19I7 include 40K logic elements, approximately 156 DSP blocks (18x18 multipliers), embedded memory in the form of M10K blocks, and the hard Cortex-A9 dual-core HPS with CoreSight debug, NEON SIMD, and a rich set of HPS peripherals (EMAC, USB, SD/MMC, NAND, SPI, I2C, UART). The U19 suffix denotes the 484-UBGA (19x19 mm, 1.0 mm pitch) package. Operating temperature is industrial (-40C to +100C), as indicated by the I7 speed/temperature grade.
The Cyclone V SE architecture uses a shared power network for HPS and FPGA with separate on-die voltage regulators, and supports the Altera SoC EDS toolchain (DS-5 / Arm Compiler / Yocto Linux). The 28 nm process node balances cost, density, and dynamic power for mid-volume embedded applications. Compared with discrete CPU + FPGA solutions, the SoC integration reduces board area, simplifies high-speed interconnect design, and lowers BOM cost.
Typical applications include industrial motor control, factory automation controllers, machine vision edge nodes, broadcast and pro-AV processing, medical patient monitoring, energy grid edge gateways, and automotive driver-assistance subsystems. The dual-A9 HPS is suitable for running real-time OS plus Linux, while FPGA fabric accelerates signal processing, motor control loops, or image processing pipelines.
When designing with this part, ensure the HPS boot configuration (BOOTSEL, NAND/NOR/SD) is selected correctly and that the shared HPS-to-FPGA AXI bridges are configured in Qsys/Platform Designer. The industrial temperature grade allows use in factory and outdoor cabinets without additional thermal headroom.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing an information-gain summary for embedded engineers selecting a Cyclone V SE SoC.
Drop-in alternatives for 5CSEBA4U19I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 5CSEBA4U19I7 (same form factor and footprint) — differing in Package, Logic Elements, Operating Temperature, Process Technology, Embedded Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA4U19I7N
✅ Drop-In✓ In Stock
$72 / Unit
View Datasheet →5CSEBA4U19C7N
✅ Drop-In✓ In Stock
$36.92 / Unit
View Datasheet →5CSEBA4U19C8N
✅ Drop-In✓ In Stock
$54.75 / Unit
View Datasheet →5CSEBA4U19C6N
✅ Drop-In✓ In Stock
$74.5 / Unit
View Datasheet →5CSEBA4U19A7N
✅ Drop-In✓ In Stock
$99.9 / Unit
View Datasheet →5CSEBA2U19I7N
✅ Drop-In✓ In Stock
$445.65 / Unit
View Datasheet →5CSEBA4U19I7 Maximum Ratings & Electrical Characteristics
| Device Family | Cyclone V SE SoC FPGA |
| Logic Elements | 40 K |
| Process Technology | 28 nm TSMC low-power |
| Core Voltage | 1.1 V |
| HPS Core | Dual-core ARM Cortex-A9 MPCore with CoreSight, NEON |
| HPS Maximum Frequency | 800 MHz |
| FPGA Maximum Frequency | 400 MHz |
| DSP Blocks | 156 (18x18 multipliers) |
| Embedded Memory | M10K blocks |
| Package | 484-UBGA (U19), 19x19 mm, 1.0 mm pitch |
| Operating Temperature | -40C to +100C (industrial, I7 grade) |
| HPS Peripherals | EMAC, USB 2.0, SD/MMC, NAND, SPI, I2C, UART, I2S |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
5CSEBA4U19I7 484-ubga (u19), 19x19 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for 5CSEBA4U19I7 (484-ubga (u19), 19x19 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA4U19I7.
Refer to the datasheet for full pin configuration.
Typical Applications
5CSEBA4U19I7 is suitable for 6 applications: Industrial Motor Control, Machine Vision Edge Node, Factory Automation Controller, Broadcast Pro-AV Processing, Medical Patient Monitoring, Energy Grid Edge Gateway.
Industrial Motor Control
The 5CSEBA4U19I7's 40K logic elements and 156 DSP blocks make it well suited for multi-axis industrial motor control loops where field-oriented control (FOC) and space-vector PWM run in FPGA fabric for deterministic sub-microsecond latency, while the dual Cortex-A9 HPS runs a Linux/RTOS stack for network protocols, HMI, and safety supervision. Engineers typically use the HPS for EtherCAT/MODBUS, the FPGA for current/torque control at 50-100 kHz per axis, with HPS-to-FPGA AXI bridging motor status at 1 Gbps.
Recommended
Machine Vision Edge Node
For machine vision at the edge, the 5CSEBA4U19I7 pairs an FPGA image-signal-processing pipeline (sensor interface, lens correction, color-space conversion, edge detection) running in the 40K-LE fabric with a Cortex-A9 HPS running OpenCV/TensorFlow Lite on Linux for inference and result handling. The HPS-to-FPGA AXI bridge carries processed pixel data at high throughput, and the 28 nm low-power process enables fanless operation in industrial edge boxes. Industrial temperature grade supports deployment in factory cabinets.
Recommended
Factory Automation Controller
As a factory automation controller, the 5CSEBA4U19I7 uses the dual-A9 HPS for SCADA/Ethernet-IP/MODBUS-TCP communication and PLC ladder logic, while the FPGA fabric implements high-speed deterministic I/O scanning, encoder counters, and PWM outputs. The industrial temperature grade (-40C to +100C) supports deployment in factory cabinets without extra thermal headroom, and 40K logic elements handle up to 64 axes of high-speed servo control alongside the HPS-side application logic.
Recommended
Broadcast Pro-AV Processing
In broadcast pro-AV applications, the 5CSEBA4U19I7 FPGA fabric handles SDI/HDMI video processing pipelines (color space, scaling, deinterlacing) with deterministic throughput, while the dual-A9 HPS runs embedded Linux for streaming protocols (NDI, SRT, RTSP), web UI, and remote control. The 40K-LE fabric supports up to two simultaneous 1080p60 video streams and on-screen display compositing, with the HPS providing Ethernet connectivity for IP-based broadcast infrastructure.
Recommended
Medical Patient Monitoring
For medical patient monitoring devices, the 5CSEBA4U19I7 FPGA fabric processes multi-channel ECG/EEG/SpO2 analog front-end signals with deterministic DSP filtering, while the dual-A9 HPS runs secure embedded Linux for display UI, network connectivity, and alarm handling. The 28 nm low-power process allows battery-powered portable designs, and 40K logic elements support up to 8 channels of low-latency DSP at clinical sampling rates. Industrial temperature grade accommodates hospital and home-care environments.
Recommended
Energy Grid Edge Gateway
As an energy grid edge gateway, the 5CSEBA4U19I7 uses the FPGA fabric to interface with high-speed analog front-ends (current/voltage sensing at 50-100 kHz sampling) for power-quality analysis, while the dual-A9 HPS runs Linux with IEC 61850 / DNP3 / MODBUS protocol stacks for SCADA integration. The industrial temperature grade supports deployment in outdoor substation cabinets, and 40K logic elements handle multi-channel metering plus encryption acceleration for grid cybersecurity compliance.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA4U19I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA4U19I7N | 5CSEBA4U19C7N | 5CSEBA4U19C8N | 5CSEBA4U19C6N | 5CSEBA4U19A7N | 5CSEBA2U19I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-UBGA (U19) | 484-UBGA (U19) - same | 484-UBGA (U19) - same | 484-UBGA (U19) - same | 484-UBGA (U19) - same | 484-UBGA (U19) - same | 484-UBGA (U19) - same |
| Logic Elements | 40K | 40K | 40K | 40K | 40K | 40K | 25K (-37.5%) |
| HPS Core | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive (AEC-Q100) | Industrial (-40C to +100C) |
| Speed Grade | I7 | I7 | C7 | C8 (slower) | C6 (slowest) | A7 | I7 |
| Process Technology | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
Key Differentiators
- Industrial temperature grade in identical 484-UBGA package (vs 5CSEBA4U19C7N)
- Highest speed grade in this density tier (vs 5CSEBA4U19C8N)
- Higher logic density than B2 variant for complex designs (vs 5CSEBA2U19I7N)
Design Notes
Estimated: at 800 MHz HPS + 400 MHz FPGA with typical SoC utilization (~70% logic + active DSP), total on-die power dissipation is approximately 3-4 W. The 484-UBGA package has theta_JA around 18 C/W with standard 4-layer JEDEC PCB; junction temperature rise is therefore 54-72 C above ambient. For industrial -40C to +100C operation, sufficient copper thermal vias under the center ball grid are required. Always verify with actual thermal simulation against your specific design utilization.
The 484-UBGA at 1.0 mm pitch requires 4-layer PCB minimum with microvia stack-up (any-layer HDI preferred). Place decoupling capacitors (100 nF X7R + 4.7 uF bulk) within 3 mm of every power ball pair. The HPS and FPGA core supplies must be generated by separate LDOs with adequate sequencing - consult the Cyclone V SE Hardware Design Checklist for power-rail sequence requirements (1.1V core before 1.8V/2.5V/3.3V I/O). Maintain at least 4 vias per ground ball for thermal and electrical integrity.
Common pitfalls with the 5CSEBA4U19I7 include: (1) configuring the BOOTSEL pins for the wrong boot source and bricking the HPS, (2) forgetting to set MSEL[3:0] correctly for the desired configuration scheme (AS/PS/Fast passive), (3) using only single-core HPS mode when dual-core Linux SMP is needed, (4) under-sizing the HPS-to-FPGA AXI bridge width for high-throughput data movement, and (5) not enabling ECC on M10K memory blocks for safety-critical applications. Always generate pin assignments via Quartus Prime Pin Planner rather than hand-editing to avoid bank-VCCIO mismatches.
For BGA breakout routing on the 484-UBGA, escape one ball per signal between vias using 4-mil traces on the top microvia layer. Fanout the inner balls via dog-bone fanout to maintain routability on 4-layer stack-ups. Match length for DDR3 HPS memory interfaces within +/- 25 mil and follow the Cyclone V SE external memory interface guidelines. Keep HPS EMAC traces short and impedance-controlled to the RJ45 magnetics to avoid CRC errors on Gigabit Ethernet.
Compliance Information
RoHS compliant per Altera/Intel product page. Industrial temperature grade I7. For AEC-Q100 automotive qualification, choose 5CSEBA4U19A7N variant. Halogen-free status not explicitly stated in verified data.
