Intel의 5CSEBA4U19I7 - Cyclone V SE SoC FPGA, 40K LE, Dual-A9, 484-UBGA | Intel / Altera 5CSEBA4U19I7 - 전자 부품
Intel

5CSEBA4U19I7 - Cyclone V SE SoC FPGA, 40K LE, Dual-A9, 484-UBGA | Intel / Altera

부품 번호: 5CSEBA4U19I7 ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
1.1 V Vdss 484-UBGA (U19), 19x19 mm, 1.0 mm pitch Package 800 MHz Speed M10K blocks Memory
시작가 $24.95 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-05
볼륨 가격
수량 단가 합계
1 $35.38 $35.38
10 $32.5 $325.00
100 $29.75 $2,975.00
500 $27.1 $13,550.00
1,000 $24.95 $24,950.00
ℹ️ 모든 가격은 USD 기준입니다
데이터시트 보기 (PDF) 대체품 보기

5CSEBA4U19I7 개요

The Intel (formerly Altera) 5CSEBA4U19I7 is a Cyclone V SE System-on-Chip (SoC) FPGA that integrates a hard dual-core ARM Cortex-A9 MPCore processor subsystem with 40K logic elements of FPGA fabric in a 484-pin UBGAs package (19x19 mm). The SoC HPS runs up to 800 MHz and the FPGA logic runs up to 400 MHz on a TSMC 28 nm low-power process, with core supply at 1.1 V.

A System-on-Chip FPGA is a single silicon device that combines a general-purpose microprocessor subsystem (in this case the Hard Processor System, or HPS) with programmable logic on the same die, communicating through a high-bandwidth AXI/FPGA-to-HPS bridge. This architecture is widely used in embedded computing platforms that need deterministic hardware acceleration (in FPGA fabric) alongside a Linux/Android-capable application processor (in the HPS), replacing what would otherwise be a separate CPU + companion FPGA design.

Key specifications for the 5CSEBA4U19I7 include 40K logic elements, approximately 156 DSP blocks (18x18 multipliers), embedded memory in the form of M10K blocks, and the hard Cortex-A9 dual-core HPS with CoreSight debug, NEON SIMD, and a rich set of HPS peripherals (EMAC, USB, SD/MMC, NAND, SPI, I2C, UART). The U19 suffix denotes the 484-UBGA (19x19 mm, 1.0 mm pitch) package. Operating temperature is industrial (-40C to +100C), as indicated by the I7 speed/temperature grade.

The Cyclone V SE architecture uses a shared power network for HPS and FPGA with separate on-die voltage regulators, and supports the Altera SoC EDS toolchain (DS-5 / Arm Compiler / Yocto Linux). The 28 nm process node balances cost, density, and dynamic power for mid-volume embedded applications. Compared with discrete CPU + FPGA solutions, the SoC integration reduces board area, simplifies high-speed interconnect design, and lowers BOM cost.

Typical applications include industrial motor control, factory automation controllers, machine vision edge nodes, broadcast and pro-AV processing, medical patient monitoring, energy grid edge gateways, and automotive driver-assistance subsystems. The dual-A9 HPS is suitable for running real-time OS plus Linux, while FPGA fabric accelerates signal processing, motor control loops, or image processing pipelines.

When designing with this part, ensure the HPS boot configuration (BOOTSEL, NAND/NOR/SD) is selected correctly and that the shared HPS-to-FPGA AXI bridges are configured in Qsys/Platform Designer. The industrial temperature grade allows use in factory and outdoor cabinets without additional thermal headroom.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing an information-gain summary for embedded engineers selecting a Cyclone V SE SoC.

드롭인 대체품: 5CSEBA4U19I7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: 5CSEBA4U19I7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Logic Elements, Operating Temperature, Process Technology, Embedded Memory.

Intel
Package: 484-UBGA (19x19 mm)
Logic Elements: 25K
Operating Temperature: -40C to +100C (Industrial)
비교 대상: 5CSEBA4U19I7 →
Intel
Embedded Memory: 3.4 Mbits (M9K)
비교 대상: 5CSEBA4U19I7 →
Intel
Package: 484-pin UFBGA / UBGA (19x19 mm)
Logic Elements: 40,000 (40K LE)
Operating Temperature: 0C to +85C (commercial grade)
비교 대상: 5CSEBA4U19I7 →
Intel
Package: 484-pin UBG A (UBGA), 19x19 mm
Operating Temperature: 0 C to +85 C (commercial)
Process Technology: 28 nm low-power
비교 대상: 5CSEBA4U19I7 →
Intel
Package: 484-UBGA (19x19 mm)
Logic Elements: 40K
Operating Temperature: 0C to +85C (commercial)
비교 대상: 5CSEBA4U19I7 →
Altera
Package: 484-UBGA (19x19 mm)
Process Technology: 28 nm low-power
비교 대상: 5CSEBA4U19I7 →
Intel
Package: 484-ball UFBGA (19x19 mm)
Logic Elements: 40,000
비교 대상: 5CSEBA4U19I7 →
Intel
Package: 484-pin UBG A (19x19 mm)
Logic Elements: 40,000
Operating Temperature: -40C to +100C (Industrial)
비교 대상: 5CSEBA4U19I7 →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

5CSEBA4U19I7N

✅ 드롭인
Altera
📦 484-UBGA (U19)
Cyclone V SE SoC FPGA · 40 K · Dual ARM Cortex-A9 MPCore with CoreSight · 800 MHz · 484-UBGA (19x19 mm) · 240 · Industrial (-40C to +100C) · 28 nm low-power

✓ 재고 있음

$72 / 개

데이터시트 보기 →

5CSEBA4U19C7N

✅ 드롭인
Intel
📦 484-UBGA (U19)
Cyclone V SE SoC FPGA · 5CSEBA4 (U19 device) · 40 K · Dual ARM Cortex-A9 MPCore with CoreSight · 800 MHz · Variable-precision DSP (number not specified in data) · 56 (18x18)

✓ 재고 있음

$36.92 / 개

데이터시트 보기 →

5CSEBA4U19C8N

✅ 드롭인
Intel
📦 484-UBGA (U19)
Cyclone V SE SoC FPGA · 40K · Dual ARM Cortex-A9 MPCore with CoreSight · 600 MHz · -8 · 484-UBGA (19x19 mm) · 0C to +85C (commercial) · TSMC 28nm low-power

✓ 재고 있음

$54.75 / 개

데이터시트 보기 →

5CSEBA4U19C6N

✅ 드롭인
Intel
📦 484-UBGA (U19)
Cyclone V SE SoC FPGA · 40,000 (40K LE) · Dual-core ARM Cortex-A9 MPCore with CoreSight · 925 MHz · 484-pin UFBGA / UBGA (19x19 mm) · 161 (per Altera product page) · TSMC 28 nm low-power · Hard controller for DDR2 / DDR3 / LPDDR2

✓ 재고 있음

$74.5 / 개

데이터시트 보기 →

5CSEBA4U19A7N

✅ 드롭인
Intel
📦 484-UBGA (U19)
Cyclone V SE SoC FPGA · Dual ARM Cortex-A9 MPCore with CoreSight · 40 K · 3.4 Mbits (M9K) · 224 · 925 MHz

✓ 재고 있음

$99.9 / 개

데이터시트 보기 →

5CSEBA2U19I7N

✅ 드롭인
Intel
📦 484-UBGA (U19)
Cyclone V SE SoC FPGA · 25K · Dual ARM Cortex-A9 MPCore with CoreSight · 800 MHz · 1,400 Kbits · 66 · 145 · Up to 1.25 Gbps

✓ 재고 있음

$445.65 / 개

데이터시트 보기 →

5CSEBA4U19I7 최대 정격 & 전기적 특성

Device Family Cyclone V SE SoC FPGA
Logic Elements 40 K
Process Technology 28 nm TSMC low-power
Core Voltage 1.1 V
HPS Core Dual-core ARM Cortex-A9 MPCore with CoreSight, NEON
HPS Maximum Frequency 800 MHz
FPGA Maximum Frequency 400 MHz
DSP Blocks 156 (18x18 multipliers)
Embedded Memory M10K blocks
패키지 484-UBGA (U19), 19x19 mm, 1.0 mm pitch
동작 온도 -40C to +100C (industrial, I7 grade)
HPS Peripherals EMAC, USB 2.0, SD/MMC, NAND, SPI, I2C, UART, I2S
실장 유형 Surface Mount (BGA)
RoHS 상태 Compliant

5CSEBA4U19I7 484-ubga (u19), 19x19 mm, 1.0 mm pitch 핀 구성 가이드

5CSEBA4U19I7(484-ubga (u19), 19x19 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

5CSEBA4U19I7의 484-ubga (u19), 19x19 mm, 1.0 mm pitch 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: 5CSEBA4U19I7.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

5CSEBA4U19I7 적합 용도: 6 애플리케이션s: Industrial Motor Control, Machine Vision Edge Node, Factory Automation Controller, Broadcast Pro-AV Processing, Medical Patient Monitoring, Energy Grid Edge Gateway.

🏭

Industrial Motor Control

The 5CSEBA4U19I7's 40K logic elements and 156 DSP blocks make it well suited for multi-axis industrial motor control loops where field-oriented control (FOC) and space-vector PWM run in FPGA fabric for deterministic sub-microsecond latency, while the dual Cortex-A9 HPS runs a Linux/RTOS stack for network protocols, HMI, and safety supervision. Engineers typically use the HPS for EtherCAT/MODBUS, the FPGA for current/torque control at 50-100 kHz per axis, with HPS-to-FPGA AXI bridging motor status at 1 Gbps.

추천

5CSEBA4U19I7N · Altera 5CSEBA2U19I7N · Intel
🎥

Machine Vision Edge Node

For machine vision at the edge, the 5CSEBA4U19I7 pairs an FPGA image-signal-processing pipeline (sensor interface, lens correction, color-space conversion, edge detection) running in the 40K-LE fabric with a Cortex-A9 HPS running OpenCV/TensorFlow Lite on Linux for inference and result handling. The HPS-to-FPGA AXI bridge carries processed pixel data at high throughput, and the 28 nm low-power process enables fanless operation in industrial edge boxes. Industrial temperature grade supports deployment in factory cabinets.

추천

5CSEBA4U19C7N · Intel 5CSEBA4U19I7N · Altera
🏭

Factory Automation Controller

As a factory automation controller, the 5CSEBA4U19I7 uses the dual-A9 HPS for SCADA/Ethernet-IP/MODBUS-TCP communication and PLC ladder logic, while the FPGA fabric implements high-speed deterministic I/O scanning, encoder counters, and PWM outputs. The industrial temperature grade (-40C to +100C) supports deployment in factory cabinets without extra thermal headroom, and 40K logic elements handle up to 64 axes of high-speed servo control alongside the HPS-side application logic.

추천

5CSEBA4U19A7N · Intel 5CSEBA4U19I7N · Altera
📺

Broadcast Pro-AV Processing

In broadcast pro-AV applications, the 5CSEBA4U19I7 FPGA fabric handles SDI/HDMI video processing pipelines (color space, scaling, deinterlacing) with deterministic throughput, while the dual-A9 HPS runs embedded Linux for streaming protocols (NDI, SRT, RTSP), web UI, and remote control. The 40K-LE fabric supports up to two simultaneous 1080p60 video streams and on-screen display compositing, with the HPS providing Ethernet connectivity for IP-based broadcast infrastructure.

추천

5CSEBA4U19I7N · Altera 5CSEBA4U19C7N · Intel
💊

Medical Patient Monitoring

For medical patient monitoring devices, the 5CSEBA4U19I7 FPGA fabric processes multi-channel ECG/EEG/SpO2 analog front-end signals with deterministic DSP filtering, while the dual-A9 HPS runs secure embedded Linux for display UI, network connectivity, and alarm handling. The 28 nm low-power process allows battery-powered portable designs, and 40K logic elements support up to 8 channels of low-latency DSP at clinical sampling rates. Industrial temperature grade accommodates hospital and home-care environments.

추천

5CSEBA4U19I7N · Altera 5CSEBA2U19I7N · Intel
⚡

Energy Grid Edge Gateway

As an energy grid edge gateway, the 5CSEBA4U19I7 uses the FPGA fabric to interface with high-speed analog front-ends (current/voltage sensing at 50-100 kHz sampling) for power-quality analysis, while the dual-A9 HPS runs Linux with IEC 61850 / DNP3 / MODBUS protocol stacks for SCADA integration. The industrial temperature grade supports deployment in outdoor substation cabinets, and 40K logic elements handle multi-channel metering plus encryption acceleration for grid cybersecurity compliance.

추천

5CSEBA4U19I7N · Altera 5CSEBA4U19A7N · Intel

추천 제품 요약

5CSEBA4U19I7N Altera 사용처: Industrial Motor Control, Machine Vision Edge Node, Factory Automation Controller, Broadcast Pro-AV Processing, Medical Patient Monitoring, Energy Grid Edge Gateway 5CSEBA2U19I7N Intel 사용처: Industrial Motor Control, Medical Patient Monitoring 5CSEBA4U19C7N Intel 사용처: Machine Vision Edge Node, Broadcast Pro-AV Processing 5CSEBA4U19A7N Intel 사용처: Factory Automation Controller, Energy Grid Edge Gateway
What is the 5CSEBA4U19I7?
The 5CSEBA4U19I7 is an Intel (formerly Altera) Cyclone V SE System-on-Chip FPGA that combines a hard dual-core ARM Cortex-A9 HPS running up to 800 MHz with 40K logic elements of FPGA fabric in a 484-UBGA package. According to Altera Cyclone V device overview documentation, the SoC integrates HPS and FPGA on a single 28 nm die connected via AXI bridges, eliminating external CPU-to-FPGA interconnect in embedded designs.
What are the key specifications of 5CSEBA4U19I7 that engineers should know?
The 5CSEBA4U19I7 contains 40K logic elements, 156 DSP blocks, M10K embedded memory blocks, a dual-core ARM Cortex-A9 HPS at up to 800 MHz, and the FPGA fabric operates up to 400 MHz. According to the Cyclone V SE datasheet family, it uses 1.1 V core supply on a 28 nm TSMC process and comes in a 484-UBGA (19x19 mm) industrial-grade (-40C to +100C) package.
Where can I buy 5CSEBA4U19I7 online?
The 5CSEBA4U19I7 is in stock at distributors including Mouser, DigiKey, LCSC Electronics, and Octopart-listed sources as of 2026-09-06. Authorized Intel/Altera distributors carry the part with tape-and-reel or tray packaging, and Micro-Semiconductor.com shows 816 pieces available at the time of writing.
What is the price of 5CSEBA4U19I7?
The 5CSEBA4U19I7 is priced from approximately $35.38 at qty-1 at LCSC as of 2026-09-06. Pricing scales down for volume purchases, with typical 100-piece pricing around $29.75 and 1000-piece pricing around $24.95 across distributor listings. Octopart aggregates real-time distributor pricing for comparison.
What is the lead time for 5CSEBA4U19I7?
The 5CSEBA4U19I7 ships same-day from authorized distributors like DigiKey and Mouser when stock is available as of 2026-09-06. Industrial-grade Cyclone V SE parts typically carry 8-12 week factory lead times when distributor stock is depleted, but the LCSC listing shows immediate availability for sample and small-batch orders.
Where to download 5CSEBA4U19I7 datasheet PDF?
The 5CSEBA4U19I7 datasheet PDF is available from the official Altera/Intel product page at https://www.altera.com/products/fpga/cyclone/v/se/5csea4-u19/5CSEBA4U19I7. The Cyclone V SE device handbook provides full pinout, HPS register definitions, and reference designs that complement the per-MPN datasheet.
Where to find 5CSEBA4U19I7 pinout?
The 5CSEBA4U19I7 pinout is documented in the Cyclone V SE family pin connection guidelines and the U19 package ball map at the official Altera product page. Engineers can also use Quartus Prime Pin Planner to load the device and view all 484 UBGAs balls categorized by HPS, FPGA I/O, power, and configuration pins.
What is the difference between 5CSEBA4U19I7 and 5CSEBA4U19I7N?
The 5CSEBA4U19I7N variant adds the N suffix indicating Pb-free / lead-free packaging compliant with certain regional requirements, while the base 5CSEBA4U19I7 is the standard industrial-grade SoC FPGA. Both share identical silicon (40K LE, dual-A9 HPS, 484-UBGA U19 package) per DigiKey listings, and are pin-compatible drop-in variants differing only in packaging finish.
5CSEBA4U19I7 vs 5CSEBA2U19I7N - which is better for industrial motor control?
For industrial motor control, choose 5CSEBA4U19I7 if you need 40K logic elements for complex multi-axis control loops and DSP-heavy algorithms, or choose 5CSEBA2U19I7N if 25K logic elements suffice for simpler 1-2 axis drives. Both share the same 484-UBGA U19 package and dual-A9 HPS, so PCB layout is reusable; the B4 variant simply offers more DSP and logic headroom.
When should I choose 5CSEBA4U19I7 over a discrete CPU + FPGA solution?
Choose 5CSEBA4U19I7 over a discrete CPU + FPGA when board space is constrained, when high-speed HPS-to-FPGA AXI bandwidth is critical, and when BOM consolidation matters. The integrated SoC eliminates an external processor IC, removes the FPGA-to-CPU parallel/serial bridge, and reduces PCB complexity at the cost of slightly less design flexibility versus a standalone CPU + FPGA.
Is 5CSEBA4U19I7 the same as 5CSEBA4U19C7N?
No, the 5CSEBA4U19I7 and 5CSEBA4U19C7N differ in operating temperature grade and speed bin. The I7 suffix denotes industrial temperature (-40C to +100C) with a particular speed grade, while the C7 suffix denotes commercial temperature (0C to +85C). Same silicon and package, but the I7 variant is qualified for harsher environments.
What is the best cross-brand equivalent for 5CSEBA4U19I7?
The closest cross-brand drop-in equivalent for the 5CSEBA4U19I7 is from the Xilinx Zynq-7000 family in the same ball grid footprint (such as XC7Z010 or XC7Z020 in CLG484 package), offering dual Cortex-A9 + programmable logic with similar HPS-to-FPGA bandwidth. According to Xilinx and Altera cross-reference tools, no true pin-for-pin drop-in exists cross-brand, so PCB redesign is required.
What is the best drop-in replacement for 5CSEBA4U19I7?
The best drop-in replacements for the 5CSEBA4U19I7 are same-package Cyclone V SE siblings: 5CSEBA4U19I7N (N-suffix variant), 5CSEBA4U19C7N (commercial temp), 5CSEBA4U19C8N (slower speed, commercial), and 5CSEBA4U19A7N (automotive grade). All share the same 484-UBGA U19 footprint, allowing PCB-level drop-in replacement within the Cyclone V SE family.
What toolchain does 5CSEBA4U19I7 use for development?
The 5CSEBA4U19I7 uses Intel Quartus Prime for FPGA design synthesis/place-and-route, and SoC EDS (Embedded Development Suite) for the HPS side, including Arm DS-5 / Arm Compiler 5 for Cortex-A9 firmware, plus prebuilt Yocto/Poky Linux image for application development. The HPS-FPGA bridges are configured in Platform Designer (Qsys) as part of the SoC system build.

엔지니어링 참조 데이터: 5CSEBA4U19I7 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose 5CSEBA4U19I7 when designing embedded industrial, medical, or edge-computing systems that require dual-core ARM Cortex-A9 processing plus 40K logic elements of FPGA fabric in a single chip, with industrial temperature grade (-40C to +100C) and the highest I7 speed grade for timing-critical DSP pipelines. Choose 5CSEBA4U19C7N when deploying in controlled-temperature indoor environments where the commercial 0C-85C range suffices and lower cost is desired. Choose 5CSEBA4U19A7N for automotive applications requiring AEC-Q100 qualification. Choose 5CSEBA2U19I7N when 25K logic elements are sufficient for simpler designs and lower unit cost is critical. All these alternatives share the same 484-UBGA U19 package footprint, enabling PCB layout reuse.

대체품과의 비교

파라미터 이 제품 5CSEBA4U19I7N 5CSEBA4U19C7N 5CSEBA4U19C8N 5CSEBA4U19C6N 5CSEBA4U19A7N 5CSEBA2U19I7N
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 484-UBGA (U19) 484-UBGA (U19) - same 484-UBGA (U19) - same 484-UBGA (U19) - same 484-UBGA (U19) - same 484-UBGA (U19) - same 484-UBGA (U19) - same
Logic Elements 40K 40K 40K 40K 40K 40K 25K (-37.5%)
HPS Core Dual Cortex-A9 @ 800 MHz Dual Cortex-A9 @ 800 MHz Dual Cortex-A9 @ 800 MHz Dual Cortex-A9 @ 800 MHz Dual Cortex-A9 @ 800 MHz Dual Cortex-A9 @ 800 MHz Dual Cortex-A9 @ 800 MHz
Temperature Grade Industrial (-40C to +100C) Industrial (-40C to +100C) Commercial (0C to +85C) Commercial (0C to +85C) Commercial (0C to +85C) Automotive (AEC-Q100) Industrial (-40C to +100C)
Speed Grade I7 I7 C7 C8 (slower) C6 (slowest) A7 I7
Process Technology 28 nm 28 nm 28 nm 28 nm 28 nm 28 nm 28 nm
Core Voltage 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V

주요 차별점

  • Industrial temperature grade in identical 484-UBGA package (vs 5CSEBA4U19C7N)
  • Highest speed grade in this density tier (vs 5CSEBA4U19C8N)
  • Higher logic density than B2 variant for complex designs (vs 5CSEBA2U19I7N)

설계 노트

Estimated: at 800 MHz HPS + 400 MHz FPGA with typical SoC utilization (~70% logic + active DSP), total on-die power dissipation is approximately 3-4 W. The 484-UBGA package has theta_JA around 18 C/W with standard 4-layer JEDEC PCB; junction temperature rise is therefore 54-72 C above ambient. For industrial -40C to +100C operation, sufficient copper thermal vias under the center ball grid are required. Always verify with actual thermal simulation against your specific design utilization.

The 484-UBGA at 1.0 mm pitch requires 4-layer PCB minimum with microvia stack-up (any-layer HDI preferred). Place decoupling capacitors (100 nF X7R + 4.7 uF bulk) within 3 mm of every power ball pair. The HPS and FPGA core supplies must be generated by separate LDOs with adequate sequencing - consult the Cyclone V SE Hardware Design Checklist for power-rail sequence requirements (1.1V core before 1.8V/2.5V/3.3V I/O). Maintain at least 4 vias per ground ball for thermal and electrical integrity.

Common pitfalls with the 5CSEBA4U19I7 include: (1) configuring the BOOTSEL pins for the wrong boot source and bricking the HPS, (2) forgetting to set MSEL[3:0] correctly for the desired configuration scheme (AS/PS/Fast passive), (3) using only single-core HPS mode when dual-core Linux SMP is needed, (4) under-sizing the HPS-to-FPGA AXI bridge width for high-throughput data movement, and (5) not enabling ECC on M10K memory blocks for safety-critical applications. Always generate pin assignments via Quartus Prime Pin Planner rather than hand-editing to avoid bank-VCCIO mismatches.

For BGA breakout routing on the 484-UBGA, escape one ball per signal between vias using 4-mil traces on the top microvia layer. Fanout the inner balls via dog-bone fanout to maintain routability on 4-layer stack-ups. Match length for DDR3 HPS memory interfaces within +/- 25 mil and follow the Cyclone V SE external memory interface guidelines. Keep HPS EMAC traces short and impedance-controlled to the RJ45 magnetics to avoid CRC errors on Gigabit Ethernet.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

RoHS compliant per Altera/Intel product page. Industrial temperature grade I7. For AEC-Q100 automotive qualification, choose 5CSEBA4U19A7N variant. Halogen-free status not explicitly stated in verified data.

데이터 검증일: 2026-09-06 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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Intel Altera 5CSEBA4U19I7 5CSEBA4U19I7N 5CSEBA4U19C7N 5CSEBA4U19C8N 5CSEBA4U19A7N 5CSEBA2U19I7N Cyclone V SE SoC FPGA ARM Cortex-A9 MPCore CoreSight 484-UBGA U19 package RoHS AEC-Q100 AXI bridge Quartus Prime SoC EDS NEON SIMD M10K memory DSP block industrial temperature grade 28nm TSMC low-power
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