5CSEBA2U19I7N - Cyclone V SE SoC FPGA, 25K LE, 800MHz | Intel
MPN: 5CSEBA2U19I7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $605.85 | $605.85 |
| 10 | $575.56 | $5,755.60 |
| 100 | $530.12 | $53,012.00 |
| 500 | $484.68 | $242,340.00 |
| 1,000 | $454.39 | $454,390.00 |
Drop-in alternatives for 5CSEBA2U19I7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet β5CSEBA2U19I7N Maximum Ratings & Electrical Characteristics
| Series | Cyclone V SE |
| Device Type | System On Chip (SoC) FPGA |
| Hard Processor System (HPS) | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz |
| Logic Elements | 25,000 |
| Adaptive Logic Modules (ALMs) | 9,433 |
| Embedded Memory | 1,400 Kbits |
| DSP Blocks (18x18 Multipliers) | 66 |
| User I/O Pins | 145 |
| Transceivers | 6.144 Mbps |
| LVDS Channels | Up to 56 (1.25 Gbps) |
| PLL Count | 5 |
| Package | 484-pin UBGA (19x19 mm) |
| Operating Temperature | -40C to +100C (Industrial) |
| Process Technology | TSMC 28nm low-power |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
5CSEBA2U19I7N Pin Configuration
| Pin 1 | VCC_HPS β HPS core supply voltage |
| Pin 2 | GND β Ground |
| Pin 3 | IO_A1 β FPGA I/O bank A |
| Pin 4 | IO_A2 β FPGA I/O bank A |
| Pin 5 | VCCIO_A β I/O bank A voltage reference |
| Pin 6 | IO_B1 β FPGA I/O bank B |
| Pin 7 | IO_B2 β FPGA I/O bank B |
| Pin 8 | VCCIO_B β I/O bank B voltage reference |
| Pin 9 | GXB_TX0 β Transceiver channel 0 transmit |
| Pin 10 | GXB_RX0 β Transceiver channel 0 receive |
| Pin 11 | VCC β FPGA core supply voltage |
| Pin 12 | VCCINT_GXB β Transceiver analog supply |
| Pin 13 | GND β Ground |
| Pin 14 | CLK_0 β Primary clock input |
| Pin 15 | CLK_1 β Secondary clock input |
| Pin 16 | CONFIG_DONE β Configuration done output |
| Pin 17 | nCONFIG β Configuration control input |
| Pin 18 | nSTATUS β Configuration status output |
| Pin 19 | TMS β JTAG test mode select |
| Pin 20 | TCK β JTAG test clock |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA2U19I7N is suitable for 6 applications: Industrial Motor Control, Machine Vision Preprocessing, IoT Edge Gateway, Medical Imaging Pre-Processor, Automotive Infotainment, Software-Defined Radio (SDR).
Industrial Motor Control
The 5CSEBA2U19I7N is well-suited for industrial motor control systems where its dual ARM Cortex-A9 HPS at 800 MHz runs field-oriented control (FOC) algorithms under Linux or RTOS, while the FPGA fabric implements custom PWM modulators, encoder interfaces, and current sense sampling. The 25K logic elements and 66 DSP blocks (18x18 multipliers) support up to 4-axis servo control in a single chip. Industrial -40C to +100C temperature grade handles factory-floor thermal stress. The HPS integrates CAN and EtherCAT peripherals for fieldbus connectivity without external ASICs.
Recommended
Machine Vision Preprocessing
The 5CSEBA2U19I7N handles machine vision preprocessing pipelines by interfacing directly with MIPI CSI-2 or parallel image sensors via FPGA LVDS I/O. The HPS runs higher-level recognition algorithms while the FPGA fabric executes real-time image processing: filtering, thresholding, edge detection, and histogram-based segmentation. The 1,400 Kbits embedded memory and 66 DSP blocks enable full HD (1920x1080) processing at 30+ fps. Industrial temperature grade ensures reliable operation in factory automation cells with vibration and temperature variation.
Recommended
IoT Edge Gateway
The 5CSEBA2U19I7N serves as an IoT edge gateway processor, combining ARM Cortex-A9 Linux runtime for application-layer MQTT/HTTP/CoAP protocol stacks with FPGA-accelerated cryptography (AES, SHA) and protocol bridging. The HPS Gigabit Ethernet and USB 2.0 OTG provide standard connectivity, while the FPGA fabric interfaces to industrial sensors via RS-485, Modbus, or custom protocols. Power consumption stays under 5W typical, suitable for fanless industrial enclosures. Long-term Intel availability ensures multi-year deployment stability.
Recommended
Medical Imaging Pre-Processor
The 5CSEBA2U19I7N supports medical imaging pre-processing applications such as ultrasound beamforming or endoscopy image capture. The FPGA fabric performs real-time filtering, speckle reduction, and color space conversion while the HPS handles DICOM metadata embedding and network transmission. The industrial temperature grade and 28nm low-power process meet medical device reliability requirements. Hardware design tools (Quartus Prime Qsys) accelerate medical IEC 62304 compliance documentation through traceability of FPGA IP blocks.
Recommended
Automotive Infotainment
The 5CSEBA2U19I7N integrates H.264 video decode, surround-view stitching, and cluster graphics rendering in the FPGA fabric while the HPS runs automotive-grade Linux with Qt for HMI. The dual ARM Cortex-A9 handles audio processing, Bluetooth hands-free, and CAN/LIN vehicle network bridging. Industrial temperature grade supports in-cabin thermal conditions. Designers pair this part with automotive-grade power management ICs and use the HPS hardware crypto engine for secure boot verification.
Recommended
Software-Defined Radio (SDR)
The 5CSEBA2U19I7N runs software-defined radio baseband processing with the FPGA fabric implementing DDC/DUC, channelization filters, and modulation/demodulation while the HPS executes Linux-based GNU Radio flow graphs. The integrated 6.144 Mbps transceivers interface directly to RF front-ends. 66 DSP blocks support wideband OFDM and LTE baseband at moderate bandwidths. Industrial temperature grade suits tactical and public-safety radio deployments. Pair with external ADC/DAC such as AD9680 for high-speed RF sampling.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA2U19I7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA2U19C8SN | 5CSEBA2U19C8N | 5CSEBA4U19C8SN | 5CSEBA2U19C7N | 5CSEBA2U19I7 |
|---|---|---|---|---|---|---|
| Package | 484-pin UBGA (19x19) | 484-pin UBGA (19x19) | 484-pin UBGA (19x19) | 484-pin UBGA (19x19) | 484-pin UBGA (19x19) | 484-pin UBGA (19x19) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 25K | 25K | 25K | 40K | 25K | 25K |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C |
| Speed Grade | 7 | 8 | 8 | 8 | 7 | 7 |
| HPS | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | ||
| User I/O Pins | 145 | 145 | 145 | |||
| Price (Qty 1, USD) | 605.85 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Industrial temperature grade with full HPS performance (vs 5CSEBA2U19C8SN)
- Pin-compatible upgrade path within same package (vs 5CSEBA4U19C8SN)
- Integrated hard processor eliminates external MCU (vs 5CEFA4U19I7)
Design Notes
The 5CSEBA2U19I7N requires multiple independent power rails: VCCINT (1.1V core), VCCPD, VCCIO (1.2V-3.3V I/O banks), VCC_HPS, VCC_HPS_IO, VCCPLL, and VCCBAT for battery-backed SRAM. Power sequencing must follow the order specified in the Cyclone V device handbook: VCCINT before VCCPD, VCCIO before VCCPD, and HPS supplies with proper ramp rates. Estimated: typical core power is approximately 1.5W at 800 MHz with moderate logic utilization.
The 484-pin UBGA package requires microvia (laser-drilled) PCB technology and 0.8mm ball pitch. Use 4-6 layer stackup with continuous GND plane beneath the BGA and 1oz copper for thermal spreading. Decoupling capacitors (100nF) must be placed within 2mm of each power pin pair. Estimated: total decoupling capacitance budget is approximately 60-80 capacitors distributed around the BGA perimeter and beneath the package.
DDR3 memory traces from the HPS must be length-matched within the tolerance specified in the external memory interface handbook. Use fly-by topology for DDR3 with VTT termination at the far end. Transceiver channels (GXB) require impedance-controlled differential routing (100 ohm differential) with reference planes and length matching within 5 mils. Clock inputs should use differential signaling (LVDS) for jitter performance.
Do not attempt to boot the HPS without a valid bootloader image in flash - this can lock the device into a recovery state requiring JTAG intervention. Always enable the watchdog timer in production designs. Avoid mixing voltage levels across I/O banks without proper level translation. The HPS boot pins (BSEL) must be set correctly for the selected flash type (NOR/NAND/SD). Estimated: typical Quartus Prime compile time for this device is 30-60 minutes at full utilization.
Compliance Information
RoHS and REACH compliant per distributor product pages. Not AEC-Q100 qualified - consider 5CGTFD9A5U19A7N for automotive applications. Halogen-free and lead-free per Intel Cyclone V family datasheet.
