5CSEBA2U19I7N - Cyclone V SE SoC FPGA, 25K LE, 800MHz | Intel
MPN: 5CSEBA2U19I7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $605.85 | $605.85 |
| 10 | $575.55 | $5,755.50 |
| 100 | $510.55 | $51,055.00 |
| 250 | $478.12 | $119,530.00 |
| 500 | $445.65 | $222,825.00 |
5CSEBA2U19I7N Overview
What is a Cyclone V SoC FPGA? A System-on-Chip FPGA combines a hard processor subsystem (HPS) with programmable logic on a single die. In the broader taxonomy: SoC FPGA -> field-programmable gate array (FPGA) -> programmable logic device (PLD) -> embedded processor platform. This integration eliminates the need for a separate MCU/MPU, reducing BOM cost, PCB area, and latency between processor and fabric while preserving full FPGA design flexibility for hardware accelerators and custom peripherals.
The 5CSEBA2U19I7N features 25K logic elements, embedded memory blocks, DSP multipliers, and 145 user I/O pins with LVDS support. The HPS subsystem integrates dual ARM Cortex-A9 cores, each with 32KB L1 cache, 512KB shared L2 cache, NEON media engine, and a complete peripheral set including USB 2.0 OTG, Gigabit Ethernet MAC, CAN, UART, SPI, I2C, and NAND/NOR flash controllers.
Architecturally, the device uses a 28nm TSMC low-power process. The HPS-to-FPGA interconnect consists of AXI bridges (3 master, 3 slave) plus FPGA-to-HPS SDRAM controller and DMA channels, enabling coherent high-bandwidth data movement between hard processor and soft logic. Power is supplied through independent rails for HPS, FPGA core, and I/O banks.
Typical applications include industrial motor control, factory automation gateways, machine vision front-end preprocessing, secure IoT edge nodes, and medical imaging pre-processing. The device is commonly paired with DDR3 memory, Gigabit Ethernet PHYs, and CMOS image sensors for vision pipelines.
When designing with this device, plan power sequencing between HPS and FPGA rails, and select the matching Quartus Prime toolchain for the device variant. HPS pin multiplexing must be reviewed against FPGA I/O bank assignments to avoid conflicts.
This page synthesizes distributor pricing, drop-in alternative listings, and practical design notes that complement - not duplicate - the manufacturer datasheet.
Drop-in alternatives for 5CSEBA2U19I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 5CSEBA2U19I7N (same form factor and footprint) — differing in Package, Logic Elements, DSP Blocks, Operating Temperature, Embedded Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA4U19I7N
✅ Drop-In✓ In Stock
$72 / Unit
View Datasheet →5CSEBA6U19I7N
✅ Drop-In✓ In Stock
$142.75 / Unit
View Datasheet →5CSEBA5U19C7N
✅ Drop-In✓ In Stock
$99.2 / Unit
View Datasheet →5CSEBA4U19C7N
✅ Drop-In✓ In Stock
$36.92 / Unit
View Datasheet →5CSEBA6U19A7N
✅ Drop-In✓ In Stock
$198.4 / Unit
View Datasheet →5CSEBA2U19I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 25K |
| HPS | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | 800 MHz |
| Embedded Memory | 1,400 Kbits |
| DSP Blocks (18x18 Multipliers) | 66 |
| User I/O Pins | 145 |
| LVDS Support | Up to 1.25 Gbps |
| Package | 484-UBGA (19x19 mm) |
| Process Technology | 28 nm TSMC low-power |
| Operating Temperature | -40C to +100C (Industrial) |
| Voltage - Input (Max) | 1.1 V core |
| Peripherals | USB 2.0 OTG, Gigabit Ethernet, CAN, UART, SPI, I2C, NAND/NOR flash controllers |
| HPS-FPGA Interconnect | AXI bridges (3 master / 3 slave), FPGA-to-HPS SDRAM, DMA |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
5CSEBA2U19I7N 484-ubga (19x19 mm) Pin Configuration Guide
Pin configuration for 5CSEBA2U19I7N (484-ubga (19x19 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA2U19I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
5CSEBA2U19I7N is suitable for 6 applications: Industrial Motor Control, Factory Automation Gateway, Machine Vision Front-End Preprocessing, Secure IoT Edge Node, Medical Imaging Pre-Processing, HMI Touch Panel Controller.
Industrial Motor Control
The 5CSEBA2U19I7N fits industrial motor control because the dual ARM Cortex-A9 HPS at 800 MHz runs real-time control loops (FOC, sensorless algorithms) while the 25K FPGA fabric implements high-speed PWM, encoder interfaces, and field-oriented control signal processing. The 66 (18x18) DSP multipliers accelerate Park/Clarke transforms and observer math. The 145 user I/O pins support multiple encoder inputs, gate driver interfaces, and current sensing channels. The -40C to +100C industrial temperature rating handles factory-floor thermal stress without derating. Compared with a discrete MCU + FPGA design, this single-chip integration reduces BOM cost and eliminates HPS-to-FPGA communication latency, improving control loop bandwidth.
Recommended
Factory Automation Gateway
The 5CSEBA2U19I7N suits factory automation gateway applications because the dual ARM Cortex-A9 HPS runs protocol stacks (OPC-UA, MQTT, Modbus TCP, EtherNet/IP) on Linux, while the FPGA fabric accelerates industrial fieldbus interfaces (PROFIBUS, RS-485 timing-critical glue, custom sensor preprocessing). Integrated Gigabit Ethernet MAC, USB 2.0 OTG, and CAN peripherals eliminate external PHY costs. The 1,400 Kbits embedded memory buffers high-rate sensor streams. Industrial temperature range (-40C to +100C) supports cabinet-free deployment on the factory floor. Designers pair the SoC with DDR3 memory and industrial Ethernet PHYs for a complete IIoT gateway.
Recommended
Machine Vision Front-End Preprocessing
The 5CSEBA2U19I7N enables machine vision preprocessing because the FPGA fabric implements hardware-accelerated image pipelines (filtering, color conversion, edge detection, histogram equalization) while the dual ARM Cortex-A9 runs higher-level computer vision algorithms. The 66 DSP blocks deliver parallel multiply-accumulate throughput needed for real-time Bayer demosaicing. MIPI CSI-2 or LVDS interfaces connect to image sensors through FPGA I/O banks. The 145 user I/O pins support multiple sensor lanes. AXI bridges between HPS and fabric provide low-latency DMA for processed frame transfer. Industrial temperature grade allows deployment in vision-guided robotics.
Recommended
Secure IoT Edge Node
The 5CSEBA2U19I7N is well-suited for secure IoT edge nodes because the dual ARM Cortex-A9 runs TLS/DTLS, secure boot, and edge analytics while the FPGA fabric implements hardware crypto accelerators (AES, SHA, RSA) for energy-efficient security primitives. Integrated Gigabit Ethernet MAC and USB 2.0 OTG provide connectivity. The 25K LE fabric can host custom sensor aggregators and time-sensitive networking (TSN) glue logic. Industrial -40C to +100C operation supports outdoor and harsh-environment edge deployment. Designers add a TPM companion and secure-boot firmware to complete a hardware root-of-trust design.
Recommended
Medical Imaging Pre-Processing
The 5CSEBA2U19I7N supports medical imaging pre-processing applications because the FPGA fabric implements pipeline functions (noise reduction, decimation, intensity normalization) on ultrasound or endoscopic sensor data streams while the dual ARM Cortex-A9 handles device-side UI, DICOM packaging, and network protocol. The 1,400 Kbits embedded memory buffers line-scan image data. Industrial temperature range allows use in clinical equipment housings. USB 2.0 OTG supports connection to host PCs and peripherals. Designers pair the device with high-speed ADCs and LVDS sensor front-ends to assemble complete imaging subsystems.
Recommended
HMI Touch Panel Controller
The 5CSEBA2U19I7N fits HMI touch panel controllers because the dual ARM Cortex-A9 HPS runs GUI frameworks (Qt, LVGL) while the FPGA fabric handles touch sensing, display timing generation, and backlight control. The 145 user I/O pins support parallel RGB or LVDS display output and capacitive touch interface glue. Integrated CAN and Ethernet enable industrial HMI networking. Industrial temperature range supports use in industrial operator panels. Designers pair the SoC with external DDR3 and TFT/LCD panels to build cost-effective HMIs that would otherwise require separate MCU + LCD controller.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA2U19I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA4U19I7N | 5CSEBA6U19I7N | 5CSEBA5U19C7N | 5CSEBA4U19C7N | 5CSEBA6U19A7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-UBGA (U19, 19x19 mm) | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same |
| Logic Elements | 25K | 40K (+60%) | 110K (+340%) | 85K (+240%) | 40K (+60%) | 110K (+340%) |
| HPS Clock | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 700 MHz (-12%) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive |
| Process Technology | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm |
Key Differentiators
- Smallest Cyclone V SE SoC variant - lowest cost entry point (vs 5CSEBA6U19I7N)
- Industrial temperature grade with full HPS throughput (vs 5CSEBA5U19C7N)
- HPS clocked at full 800 MHz speed grade (vs 5CSEBA6U19A7N)
Design Notes
The 5CSEBA2U19I7N requires multiple independent power rails: HPS core (typically 0.9-1.1V), FPGA core (1.1V), HPS I/O (1.5V/1.8V/2.5V/3.3V), FPGA I/O banks (1.2V/1.5V/1.8V/2.5V/3.3V), and transceiver supplies if used. Power sequencing must follow Intel's Cyclone V Power Management User Guide - HPS and FPGA rails must come up in the correct order to avoid latch-up. Estimated core current at 800 MHz HPS + 25K LE utilization is 1.5-2.5A; design the VRMs with at least 30% margin.
The 484-UBGA package (U19, 19x19 mm) uses a 1.0 mm ball pitch requiring microvia or via-in-pad PCB technology for reliable breakout routing. Fanout via placement follows JEDEC Type-1 or Type-2 land pattern recommendations. Use 4 to 6 PCB layers minimum with continuous GND planes for signal integrity and thermal dissipation. Decoupling: place 0.1uF X7R plus 10uF X5R capacitors within 5mm of every supply pin cluster. A thermal pad/ball pattern on the package underside should be soldered to a thermal via array in the PCB inner layers for heatsinking.
Common pitfalls with the 5CSEBA2U19I7N: (1) Selecting the wrong Quartus Prime device variant - the 5CSEBA2 prefix must match exactly in the project settings or bitstream generation fails; (2) HPS pin multiplexing conflicts with FPGA I/O bank assignments - review the HPS pinmux configuration spreadsheet before pin assignment; (3) Confusing temperature grades - I7 is industrial (-40C to +100C) while C7 is commercial (0C to +85C); using a commercial-grade part in industrial deployment causes field failures. Always download the latest device errata sheet before tape-out.
High-speed interfaces through the FPGA fabric (LVDS at up to 1.25 Gbps, DDR3 memory at 400+ MHz) require controlled-impedance routing. Maintain 50 ohm single-ended and 100 ohm differential impedance on these nets. Keep matched-length traces within 50 mil for DDR3 byte groups and within 25 mil for LVDS pairs. Use length-matched serpentine routing and avoid stubs. Series termination resistors may be required on LVDS output drivers per IBIS simulation. Reference Intel's Cyclone V PCB Design Guidelines for full guidance.
Compliance Information
RoHS and REACH compliant per Cyclone V product family documentation. Not AEC-Q100 qualified - for automotive use, select 5CSEBA6U19A7N (automotive grade). Lead-free (Pb-free) assembly supported.
