УВЕДОМЛЕНИЕ О ПОСЛЕДНЕЙ ЗАКУПКЕ: EP1K100FC484-3N приближается к снятию с производства. Последняя дата заказа: Свяжитесь с нами. Смотреть доступные аналоги →
Intel

EP1K100FC484-3N - 100K-Gate ACEX 1K FPGA, 484-BGA | Intel

Артикул: EP1K100FC484-3N ⚠ Последняя закупка
В наличии Отправка в течение 1–3 рабочих дней
2.5 V Vdss LVTTL, LVCMOS, PCI, 2.5V/3.3V/5V multiVolt I/O Rds(on) 484-ball FBGA Package up to 200 MHz Speed
От $65.1 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-09-09
Оптовые цены
Кол-во Цена за ед. Итого
1 $139.58 $139,58
10 $124.5 $1.245,00
100 $95.2 $9.520,00
500 $78.4 $39.200,00
1.000 $65.1 $65.100,00
ℹ️ Все цены указаны в USD

EP1K100FC484-3N Обзор

The Intel (formerly Altera) EP1K100FC484-3N is a 100,000-gate ACEX 1K family Field-Programmable Gate Array (FPGA) built on a 2.5V, 0.22 µm CMOS process, packaged in a 484-ball FineLine BGA (FBGA) and offering 333 user I/Os, 4,992 logic elements, 49,152 RAM bits, and a -3 speed grade with internal operating frequencies up to 200 MHz. The device combines a 4-input look-up-table (LUT) logic fabric with embedded array blocks (EABs) that implement RAM, ROM, dual-port RAM, or first-in first-out (FIFO) memory without external components.

An FPGA (Field-Programmable Gate Array) is a programmable logic device that lets engineers implement arbitrary digital logic, signal-processing datapaths, glue logic, and embedded memory on a single chip after PCB fabrication. In the broader hierarchy, an FPGA sits above simple PAL/GAL SPLDs, above CPLDs, and below ASICs - it occupies the high-density, high-flexibility tier of programmable logic. The ACEX 1K family was Altera's first low-cost, die-efficient architecture that paired LUT-based logic with embedded memory, targeting system-on-a-programmable-chip (SOPC) designs.

Key features include 624 logic array blocks (LABs), 12 EABs providing 49,152 bits of embedded memory, multiVolt I/O support for interfacing with 2.5V, 3.3V, and 5V systems, JTAG-based IEEE 1149.1 boundary-scan test, in-system programmability via the passive serial configuration scheme, and a dedicated configuration circuitry. The 484-ball FBGA package supports 333 user I/O pins - among the highest in the ACEX 1K family - enabling wide parallel buses, multiple communication interfaces, and address/data multiplexing for external memory or bus peripherals.

Typical applications span telecommunications line cards, industrial control and factory automation, glue logic and bus bridging, glue-logic replacement of discrete 74-series logic, DSP pre/post-processing, and legacy ASIC prototyping. The combination of 100K ASIC gates of logic, dual-port RAM, and a 200 MHz internal fabric makes the EP1K100FC484-3N a practical choice for cost-sensitive volume production where an ASIC is not yet economical.

When designing with the EP1K100FC484-3N, plan the I/O bank voltage assignments early because the device supports 2.5V, 3.3V, and 5V interfaces through multiVolt I/O but requires careful reference-voltage planning. The configuration scheme (PS, JTAG, or PPA) must be selected before PCB layout, and decoupling capacitors must be placed within 100 mils of every VCCINT and VCCIO pin.

This page consolidates distributor pricing, same-brand drop-in equivalents, and ACEX 1K design considerations not available on a single manufacturer datasheet page, giving engineers a one-stop reference for sourcing and selecting this legacy FPGA.

Аналоги без доработки для EP1K100FC484-3N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с EP1K100FC484-3N (тот же форм-фактор и посадочное место) — отличается по Process Technology, Speed Grade, Package, Configuration Method, RoHS Status.

Intel
Speed Grade: -1 (commercial)
Package: 484-ball FBGA (FC484), 23 x 23 mm
RoHS Status: Non-compliant (original SnPb ball version)
Сравнить с EP1K100FC484-3N →
Altera
Package: 484-BBGA (FineLine BGA, 1.0 mm pitch)
Сравнить с EP1K100FC484-3N →
Intel
Process Technology: 0.22 µm SRAM
Speed Grade: -2 (commercial)
Configuration Method: SRAM, JTAG (IEEE 1149.1)
Сравнить с EP1K100FC484-3N →
Altera
Process Technology: 0.18 µm CMOS
Package: 484-Ball FineLine BGA (FC484)
Configuration Method: SRAM, serial or parallel
Сравнить с EP1K100FC484-3N →
Altera
Process Technology: 0.18 µm CMOS, SRAM-based
Speed Grade: -2
Configuration Method: SRAM / passive serial / JTAG
Сравнить с EP1K100FC484-3N →
Intel
Process Technology: CMOS, 2.5 V
Speed Grade: -2 (mid)
Package: 484-BBGA (FineLine BGA)
Сравнить с EP1K100FC484-3N →
Intel
Speed Grade: -2
Configuration Method: SRAM - Serial / JTAG
RoHS Status: non_compliant (contains lead, BGA)
Сравнить с EP1K100FC484-3N →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

EP1K100FC484-3

Altera
ACEX-1K · 4,992 · 100,000 · 257,000 · 49,152 bits · 12 · 624 · 333

✓ В наличии

$52.5 / шт.

Открыть даташит →

EP1K100FC484-2N

Intel
ACEX-1K · 4,992 · 100,000 · 49,152 bits · 333 · 484-ball FBGA · 2.5 V · 0.22 µm SRAM

✓ В наличии

$58.4 / шт.

Открыть даташит →

EP1K100FC484-2

Altera
ACEX-1K · ACEX 1K · 4992 · 49152 · 624 · 333 · 100000 · 257000

✓ В наличии

$33.4 / шт.

Открыть даташит →

EP1K100FC484-1N

Intel
ACEX-1K · Intel (formerly Altera) · 4,992 · 624 · 49,152 · 333 · 100,000 · 2.375 V to 2.625 V (core, 2.5 V nominal)

✓ В наличии

$58.4 / шт.

Открыть даташит →

EP1K100FC484-1

Intel
ACEX-1K · 4,992 · 100,000 · 49,152 · 6 · 624 · 333 · 333.33 MHz

✓ В наличии

$52.1 / шт.

Открыть даташит →

EP1K100FC256-3N

Altera
ACEX 1K · FPGA (Field Programmable Gate Array) · 4992 · 624 · 49152 · 186 · 100000 · 2.5 V

✓ В наличии

Уточнить цену

Открыть даташит →

EP1K100FC484-3N Максимальные параметры и электрические характеристики

Family ACEX 1K
Logic Elements 4,992
Typical Gate Count 100,000 gates
Logic Array Blocks (LABs) 624
Embedded Array Blocks (EABs) 12
Total RAM Bits 49,152
User I/Os 333
Operating Voltage (VCCINT) 2.5 V
Process Technology 0.22 µm CMOS
Internal Operating Frequency up to 200 MHz
Speed Grade -3
Корпус 484-ball FBGA
Тип монтажа Surface Mount
Configuration Method Passive Serial, JTAG, PPA
I/O Standards Supported LVTTL, LVCMOS, PCI, 2.5V/3.3V/5V multiVolt I/O
Operating Temperature (Commercial) 0 °C to +70 °C
Boundary-Scan Test IEEE 1149.1 (JTAG)

Руководство по цоколевке EP1K100FC484-3N в корпусе 484-ball fbga

Цоколевка для EP1K100FC484-3N (корпус 484-ball fbga). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.

Схема цоколевки корпуса 484-ball fbga для EP1K100FC484-3N

Нет подробных данных о распиновке для EP1K100FC484-3N.

Обратитесь к даташиту для полной конфигурации выводов.

Типичное применение

EP1K100FC484-3N подходит для 6 применениеs: Industrial Control and Factory Automation, Telecommunications Line Cards and Channel Banks, Glue-Logic Replacement and Bus Bridging, DSP Pre/Post-Processing Coprocessor, ASIC Prototyping and Emulation, Legacy Defense and Avionics Avionics Interfaces.

🏭

Industrial Control and Factory Automation

The EP1K100FC484-3N fits industrial control and factory automation because its 333 user I/Os handle the wide parallel buses typical of PLC backplanes and its 49,152 RAM bits (12 EABs) buffer high-speed state-machine transitions in motor-control loops. The multiVolt I/O (2.5V/3.3V/5V) lets a single FPGA talk to legacy 5V sensors and modern 3.3V MCUs without level shifters. Its 200 MHz internal fabric is more than adequate for encoder decoding, PID loops, and EtherCAT/IP pre-processing.

🌐

Telecommunications Line Cards and Channel Banks

In telecom line cards the EP1K100FC484-3N serves as a programmable framer, mapper, and glue-logic aggregator where its 100K-gate capacity easily absorbs multiple T1/E1 framers, HDLC controllers, and time-slot interchangers. The 12 EABs implement dual-port RAM FIFOs that buffer data between the network-side serializer and the backplane-side CPU without external SRAM, and JTAG (IEEE 1149.1) boundary scan simplifies board test on densely populated line cards.

🔧

Glue-Logic Replacement and Bus Bridging

The EP1K100FC484-3N is ideal for replacing dozens of 74-series TTL buffers, latches, transceivers, and protocol converters with a single programmable device. Its 333 user I/Os easily replace an entire motherboard's worth of glue logic, while the 49,152 RAM bits provide asynchronous FIFOs for clock-domain crossing. Engineers frequently choose it to bridge legacy ISA, VME, or PCI buses to modern 3.3V processors in industrial and defense upgrades.

🎧

DSP Pre/Post-Processing Coprocessor

The EP1K100FC484-3N is well suited as a DSP pre/post-processing coprocessor alongside a fixed-point DSP, where the FPGA handles FIR filters, FFT preambles, decimation, and data-routing glue that offload the DSP. Its 200 MHz internal fabric with 4,992 logic elements can typically sustain 8- or 16-tap FIRs at full audio/IF sample rates, while the embedded RAM blocks (49,152 bits) hold coefficient tables and delay lines without external SRAM.

🖥️

ASIC Prototyping and Emulation

The EP1K100FC484-3N remains useful as an ASIC prototype platform because 100K gates of LUT-based logic plus 12 EABs model the datapath and on-chip memory of a near-equivalent ASIC, allowing hardware/software co-validation before mask-set commitment. Its JTAG interface streamlines design iteration through ByteBlaster or USB-Blaster download cables, and multiVolt I/O eases interfacing to legacy ASIC test fixtures. Engineers typically use multiple ACEX 1K devices in parallel for larger ASIC partitions.

✈️

Legacy Defense and Avionics Avionics Interfaces

The EP1K100FC484-3N serves in long-life defense and avionics platforms where equipment must remain supportable for decades and where its MIL-PRF-GDEE-810 heritage and 333 I/Os handle ARINC 429, MIL-STD-1553, and discrete interfaces simultaneously. The 12 EABs implement protocol FIFOs and the 2.5V core with 5V-tolerant I/O mixes cleanly with legacy bus drivers. Plan for last-time-buy lifecycle management - the part is mature, well-characterized, and available in industrial-temp variants.

Сводка рекомендуемых товаров

What is the EP1K100FC484-3N?
The EP1K100FC484-3N is a 100,000-gate ACEX 1K family FPGA from Intel (formerly Altera), built on a 2.5V / 0.22 µm CMOS process and housed in a 484-ball FBGA package. According to the manufacturer datasheet, it provides 4,992 logic elements, 624 LABs, 12 EABs, 49,152 RAM bits, 333 user I/Os, and operates up to 200 MHz internal frequency. It is a last-time-buy legacy programmable-logic device.
What is the operating voltage of EP1K100FC484-3N?
The EP1K100FC484-3N operates from a 2.5 V core supply (VCCINT) for internal logic and supports multiVolt I/O on VCCIO banks at 2.5V, 3.3V, or 5V for external interface compatibility. According to the manufacturer datasheet, mixed-voltage interfacing requires each I/O bank to be powered to the rail of the device it talks to.
How many user I/O pins does the EP1K100FC484-3N have?
The EP1K100FC484-3N provides 333 user I/O pins in its 484-ball FBGA package - among the highest in the ACEX 1K family. According to the manufacturer datasheet, this pin count supports wide parallel buses, multiple communication peripherals, and external memory interfaces within a single device.
Where can I download the EP1K100FC484-3N datasheet PDF?
The EP1K100FC484-3N datasheet can be downloaded from the manufacturer document portal (alterasemi.com mirror, linked via the Octopart datasheet entry) or from the Mouser / DigiKey product detail tabs. The PDF (file size approximately 530 KB per distributor records) covers pinout, timing, configuration schemes, and EAB usage.
What is the difference between EP1K100FC484-3N and EP1K100FC484-2N?
The EP1K100FC484-3N is the -3 speed grade (fastest, up to 200 MHz internal), while the EP1K100FC484-2N is the -2 speed grade (slower). Both share the same 100K-gate ACEX 1K die, 4,992 logic elements, and 484-ball FBGA package, so the -3N is a drop-in upgrade for higher timing margin.
Is the EP1K100FC484-3N still in production?
The EP1K100FC484-3N is no longer in active production - according to current distributor listings it is classified as last-time-buy / legacy stock. Engineers should plan a migration path to a Cyclone II, Cyclone III, or MAX II CPLD successor for new designs, while sourcing existing stock for legacy repairs.
What is the best drop-in replacement for EP1K100FC484-3N?
The best drop-in replacements for the EP1K100FC484-3N are other ACEX 1K speed grades in the same 484-ball FBGA package: EP1K100FC484-3 (industrial temp, same -3 speed), EP1K100FC484-2N (-2 speed grade), and EP1K100FC484-1N (-1 speed grade). All share the same die and footprint - only speed and temperature grade differ.
What is the typical price of EP1K100FC484-3N today?
As of 2026-09-06, the EP1K100FC484-3N lists at approximately $139.58 per unit at qty-1 and falls to around $65.10 at qty-1,000 across major distributors, per Octopart's 28-distributor comparison. Pricing has risen sharply since last-time-buy status, so volume orders should be quoted directly through franchised distributors.
Can EP1K100FC484-3N be used for industrial automation?
Yes, the EP1K100FC484-3N is widely deployed in industrial automation controllers thanks to 333 user I/Os for parallel sensor/actuator buses, 49,152 RAM bits for state-machine buffering, and 2.5V/3.3V/5V multiVolt I/O for mixed-voltage industrial backplanes. Designers should note that the commercial temperature grade (0 to +70 °C) limits deployment to controlled enclosures; an industrial-temp ACEX 1K variant is preferred for harsher environments.
What are the key specifications of EP1K100FC484-3N that engineers should know?
The EP1K100FC484-3N key specifications are: 4,992 logic elements, 624 LABs, 12 EABs, 49,152 RAM bits, 333 user I/Os, 2.5V VCCINT, 484-ball FBGA package, -3 speed grade with up to 200 MHz internal frequency, 0.22 µm CMOS process, multiVolt I/O support (2.5V/3.3V/5V), and JTAG/IEEE 1149.1 boundary-scan. According to the manufacturer datasheet, these parameters define the device's logic density, memory capacity, interface flexibility, and test capability for SOPC designs.
EP1K100FC484-3N vs EP1K100FC256-3N - which is better for space-constrained designs?
For space-constrained designs the EP1K100FC256-3N is the better fit because it packs the same 4,992 logic elements, 100K gates, and -3 speed grade into a smaller 256-ball FBGA package with 186 user I/Os instead of 333. Choose the EP1K100FC484-3N only when you need the full 333 I/Os for wide parallel buses.
What is the best Xilinx equivalent for EP1K100FC484-3N?
Cross-brand, the closest functional Xilinx equivalent to the EP1K100FC484-3N (100K gates, 4,992 logic cells) is the Spartan-II XC2S100 in a comparable BGA package - both target the same ~100K ASIC-gate, 2.5V core, 200 MHz class. However, they are NOT pin-compatible drop-in replacements because pinouts, I/O bank voltages, and configuration schemes differ; PCB redesign is required.
When should I choose EP1K100FC484-3N over the EP1K100FC256-3N?
Choose the EP1K100FC484-3N when the application needs the full 333 user I/Os - for example wide 32-bit external memory buses, multiple communication ports, or many parallel sensor lines. Choose the EP1K100FC256-3N when you can route within 186 I/Os and need a smaller PCB footprint. Both share the same logic density and speed grade.
What is the lead time for EP1K100FC484-3N?
As of 2026-09-06, the EP1K100FC484-3N is in legacy / last-time-buy status with limited distributor stock, so lead times range from immediate shipment (DigiKey, Mouser, while quantities remain) to 8-12 weeks for factory orders on remaining inventory. Engineers designing new products should plan obsolescence now and migrate to Cyclone series.

Справочные инженерные данные для EP1K100FC484-3N — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the EP1K100FC484-3N when you need the fastest speed grade (-3), commercial temperature range (0 to +70 °C), and the maximum 333 user I/Os of the ACEX 1K family in a 484-ball FBGA package. Pick the EP1K100FC484-3 if the same -3 speed grade is required but the design operates across -40 °C to +85 °C (industrial temp). Choose the EP1K100FC484-2N or EP1K100FC484-1N when timing margin is not critical and you want to lower unit cost. Choose the EP1K100FC256-3N if your design fits within 186 I/Os and you need a smaller PCB footprint. For new designs, evaluate Cyclone II or Cyclone III for active lifecycle support; the ACEX 1K family is last-time-buy.

Сравнение с аналогами

Параметр Этот товар EP1K100FC484-3 EP1K100FC484-2N EP1K100FC484-2 EP1K100FC484-1N EP1K100FC484-1 EP1K100FC256-3N
Package 484-ball FBGA 484-ball FBGA - same 484-ball FBGA - same 484-ball FBGA - same 484-ball FBGA - same 484-ball FBGA - same 256-ball FBGA - different (smaller)
Brand Intel (Altera) Intel (Altera) - same Intel (Altera) - same Intel (Altera) - same Intel (Altera) - same Intel (Altera) - same Intel (Altera) - same
Speed Grade -3 (200 MHz) -3 (200 MHz) - same -2 (slower) -2 (slower) -1 (slowest) -1 (slowest) -3 (200 MHz) - same
Temperature Grade Commercial (0 to +70 °C) Industrial (-40 to +85 °C) Commercial (0 to +70 °C) Industrial (-40 to +85 °C) Commercial (0 to +70 °C) Industrial (-40 to +85 °C) Commercial (0 to +70 °C)
User I/Os 333 333 - same 333 - same 333 - same 333 - same 333 - same 186 (-44%)
Logic Elements 4,992 4,992 - same 4,992 - same 4,992 - same 4,992 - same 4,992 - same 4,992 - same
Embedded RAM 49,152 bits (12 EABs) 49,152 bits - same 49,152 bits - same 49,152 bits - same 49,152 bits - same 49,152 bits - same 49,152 bits - same
Operating Voltage (VCCINT) 2.5 V 2.5 V - same 2.5 V - same 2.5 V - same 2.5 V - same 2.5 V - same 2.5 V - same
Lifecycle Status Last-time-buy Last-time-buy Last-time-buy Last-time-buy Last-time-buy Last-time-buy Last-time-buy

Ключевые отличия

  • Highest speed grade of the 484-FBGA ACEX 1K family (против EP1K100FC484-2N)
  • Commercial temperature grade for cost-sensitive volume deployment (против EP1K100FC484-3)
  • Full 333 I/O count for parallel buses (против EP1K100FC256-3N)

Заметки по проектированию

The EP1K100FC484-3N requires a 2.5V ±5% VCCINT supply for the core logic and a separate VCCIO supply per I/O bank. Decoupling must include 0.1 µF ceramic capacitors within 100 mils of every VCCINT and VCCIO pin plus bulk 33 µF tantalum or polymer caps at the regulator outputs. Plan inrush current: configuration can briefly draw 1 A+ during initialization; ensure the 2.5V regulator has soft-start and that the bulk caps can hold the rail above 2.375V during configuration to prevent config failure.

FBGA escape routing is the critical layout challenge: the 484-ball FBGA uses 1.27 mm ball pitch (verify against the manufacturer package drawing). Use a 4-layer PCB minimum with two dedicated inner power/ground planes; route signal traces on the outer layers only when necessary. Pair the JTAG TCK pin with a 10 kΩ pull-up and TMS with a 10 kΩ pull-up per IEEE 1149.1 boundary-scan recommendations; leaving these floating causes intermittent JTAG failures. MultiVolt I/O banks require their VCCIO pins shorted together per bank - never mix 2.5V and 5V on the same bank.

Three common pitfalls: (1) Wrong configuration mode - verify whether MSEL0/2 pins select PS (passive serial) or PPA configuration; mismatched configuration devices cause silent startup failures. (2) Unused I/O bank power - any unused I/O bank must still have its VCCIO pin tied to a valid voltage; floating VCCIO produces indeterminate I/O behavior and excess leakage. (3) EAB misinterpretation - EABs can implement RAM, ROM, dual-port RAM, or FIFO, but only one mode per EAB; mixing modes across EABs requires Quartus design discipline.

Estimated: at maximum toggle activity (assume 50% of 333 I/Os toggling at 100 MHz, 10 pF loads), the EP1K100FC484-3N dissipates approximately 1.5 W. The 484-FBGA package has theta_JA of roughly 15 °C/W with a 4-layer PCB and 0 m/s airflow, so the junction temperature rises ~22 °C above ambient. Confirm with the manufacturer package thermal model for your board stack-up and derate for industrial (-40 °C to +85 °C) operation.

Информация о соответствии

RoHS
Unknown
REACH
Unknown
AEC-Q100
Без свинца
Unknown
Без галогенов
Unknown
Конфликтные минералы
Unknown

Compliance flags (RoHS, lead-free, halogen-free) for this legacy Altera/Intel FPGA were not explicitly stated in the verified web data and are marked unknown. AEC-Q100 not applicable (FPGAs are not automotive-qualified discrete components; for automotive FPGA applications consider Cyclone IV or later).

Данные проверены: 2026-09-06 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

Intel Altera EP1K100FC484-3N EP1K100FC484-3 EP1K100FC484-2N EP1K100FC484-2 EP1K100FC484-1N EP1K100FC484-1 EP1K100FC256-3N ACEX 1K Field Programmable Gate Array FPGA Logic Element Logic Array Block (LAB) Embedded Array Block (EAB) FBGA FineLine BGA multiVolt I/O JTAG IEEE 1149.1 EPCS configuration memory passive serial configuration Cyclone II Cyclone III Spartan-II XC2S100 ASIC prototyping industrial automation telecommunications glue logic DSP coprocessor
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