EPM570M100I5 - MAX II CPLD 440 Macrocell 100-MBGA | Intel
Артикул: EPM570M100I5 ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.2 | $132,00 |
| 100 | $11.85 | $1.185,00 |
| 500 | $10.4 | $5.200,00 |
| 1.000 | $9.1 | $9.100,00 |
EPM570M100I5 Обзор
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that sits between simple PAL/GAL devices and full FPGAs. In the broader hierarchy it belongs to programmable logic, which is itself a branch of standard logic ICs. MAX II devices use a look-up table (LUT) based architecture combined with a non-volatile flash configuration memory, eliminating the external boot PROM normally required by SRAM-based FPGAs. Compared with classic CPLDs, MAX II offers lower static power, higher logic density, and a built-in User Flash Memory (UFM) block for storing user data such as serial numbers or calibration tables.
Key features of the EPM570M100I5 include 440 macrocells (equivalent to 570 logic elements), 76 user I/O pins, a MultiVolt I/O bank that supports 1.5V, 1.8V, 2.5V, and 3.3V interfaces, a User Flash Memory block of 8 Kbits, and IEEE 1149.1 JTAG plus in-system programmability. The I5 speed grade corresponds to a -40 °C to +100 °C commercial operating range.
Typical applications include I/O expansion and bridging for microcontrollers and processors, glue logic replacement for ASIC/FPGA designs, power-sequence and reset control, bus interface translation (for example 3.3V to 1.8V level shifting), and LED driving or display control where deterministic timing and instant-on behavior are required.
When designing with this part, note that MAX II devices are 3.3V tolerant only on JTAG pins and require proper MultiVolt I/O bank configuration. The internal flash memory configuration makes the part suitable for safety-critical and industrial applications where instant-on logic is required at power-up.
This page synthesizes distributor pricing, drop-in MAX II alternatives, and design notes not found in the manufacturer datasheet.
Аналоги без доработки для EPM570M100I5 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EPM570M100I5 (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Package, Process Technology, Programming Interface, Mounting Type.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EPM570M100I5N
✅ Прямая замена✓ В наличии
$8.75 / шт.
Открыть даташит →EPM570M100C5N
✅ Прямая замена✓ В наличии
$11.85 / шт.
Открыть даташит →EPM570GT100I5N
✅ Прямая замена✓ В наличии
$16.5 / шт.
Открыть даташит →EPM570GM100I5N
✅ Прямая замена✓ В наличии
$8.55 / шт.
Открыть даташит →EPM570F100I5N
✅ Прямая замена✓ В наличии
$13.4 / шт.
Открыть даташит →EPM570M100C4N
✅ Прямая замена✓ В наличии
$14.95 / шт.
Открыть даташит →EPM570M100I5 Максимальные параметры и электрические характеристики
| Family | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 440 |
| Logic Elements | 570 |
| Maximum User I/O | 76 |
| User Flash Memory (UFM) | 8 Kbits |
| Process Technology | 0.18 µm flash |
| Supply Voltage - Core | 1.8 V |
| Supply Voltage - I/O (MultiVolt) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Internal Performance | 201.1 MHz |
| Рабочая температура | -40 °C to +100 °C (I5 grade) |
| Корпус | 100-ball Micro FBGA (MBGA), 6 mm x 6 mm |
| Тип монтажа | Surface Mount |
| Programmability | JTAG (IEEE 1149.1) + ISP |
| Configuration Memory | Internal non-volatile flash |
| Статус RoHS | Compliant |
Руководство по цоколевке EPM570M100I5 в корпусе 100-ball micro fbga (mbga), 6 mm x 6 mm
Цоколевка для EPM570M100I5 (корпус 100-ball micro fbga (mbga), 6 mm x 6 mm). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EPM570M100I5.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EPM570M100I5 подходит для 6 применениеs: Microcontroller I/O Expansion and Bus Bridging, Industrial Control and Factory Automation Logic, Power Sequencing and Reset Management, Communications Equipment Glue Logic, Display and LED Driver Control, Legacy ASIC/FPGA Replacement and Design Modernization.
Microcontroller I/O Expansion and Bus Bridging
The EPM570M100I5's 440 macrocells and 76 user I/Os make it ideal for expanding microcontroller or low-pin-count processor I/O. Its MultiVolt I/O banks (1.5V/1.8V/2.5V/3.3V) allow direct connection between processors, memories, and peripherals operating at different voltages, replacing dozens of discrete logic ICs. The 201.1 MHz internal performance and 8 Kbit User Flash Memory provide deterministic timing and on-chip non-volatile parameter storage. Drop-in upgrade paths exist within the same 100-ball MBGA footprint.
Рекомендуется
Industrial Control and Factory Automation Logic
With its -40 °C to +100 °C industrial operating range and non-volatile instant-on configuration, the EPM570M100I5 is well suited to factory automation controllers, PLC I/O modules, and sensor interface boards. The 100-ball MBGA package provides a compact footprint for high-density logic on controller PCBs. Designers can implement deterministic glue logic, encoder interfacing, and timing-critical control sequences that must execute at power-up without boot delay.
Рекомендуется
Power Sequencing and Reset Management
Power-up sequencing is a classic MAX II use case, and the EPM570M100I5's instant-on non-volatile flash configuration ensures sequencing logic runs from the first valid supply cycle. The 8 Kbit UFM can retain configuration parameters such as timing thresholds or board revision data. MultiVolt I/O banks let a single CPLD interface 1.8V SoCs, 3.3V peripherals, and 5V-tolerant supervisory devices from the same die.
Рекомендуется
Communications Equipment Glue Logic
In networking line cards, base stations, and telecom infrastructure, the EPM570M100I5 implements glue logic between PHYs, switches, FPGAs, and processors. Its 76 user I/Os and MultiVolt support let it bridge between 1.8V FPGA transceivers and 3.3V management interfaces. Deterministic 201.1 MHz timing and JTAG ISP support simplify board-level bring-up, manufacturing test, and field reprogramming.
Рекомендуется
Display and LED Driver Control
The EPM570M100I5 is used as a scan and refresh controller for LED matrices, signage, and small LCD panels. Its 440 macrocells can generate PWM channels, multiplexing waveforms, and color-mixing sequences while the 8 Kbit UFM stores gamma tables or animation frames. The industrial temperature grade supports outdoor display installations where temperatures may swing from -40 °C to +70 °C.
Рекомендуется
Legacy ASIC/FPGA Replacement and Design Modernization
Designers use the EPM570M100I5 to replace obsolete discrete logic, ASICs, or older CPLDs in long-lifecycle programs. Its flash configuration is non-volatile and reprogrammable in-circuit via JTAG, reducing manufacturing cost versus one-time-programmable devices. The same 100-ball MBGA footprint across EPM570 variants enables PCB reuse during design refreshes or component obsolescence mitigation.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EPM570M100I5 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EPM570M100I5N | EPM570M100C5N | EPM570GT100I5N | EPM570GM100I5N | EPM570F100I5N |
|---|---|---|---|---|---|---|
| Package | 100-ball Micro FBGA (MBGA) | 100-ball Micro FBGA (MBGA) - same | 100-ball Micro FBGA (MBGA) - same | 100-ball Micro FBGA (MBGA) - same | 100-ball Micro FBGA (MBGA) - same | 100-ball Micro FBGA (MBGA) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 |
| User I/O | 76 | 76 | 76 | 76 | 76 | 76 |
| Operating Temperature | -40 °C to +100 °C (I5 industrial) | -40 °C to +100 °C (I5 industrial) | 0 °C to +85 °C (C5 commercial) | -40 °C to +100 °C (I5 industrial) | -40 °C to +100 °C (I5 industrial) | -40 °C to +100 °C (I5 industrial) |
| Supply Voltage (Core) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lead-Free / RoHS | Non-N (legacy finish); N suffix is RoHS | Yes (RoHS, Pb-free) | Yes (RoHS, Pb-free) | Yes (RoHS, Pb-free) | Yes (RoHS, Pb-free) | Yes (RoHS, Pb-free) |
Ключевые отличия
- Same-package drop-in with lead-free finish (против EPM570M100I5N)
- Higher operating temperature range (против EPM570M100C5N)
- Larger macrocell count than legacy MAX 7000 devices (против EPM240 / EPM570 older variants in different packages)
Заметки по проектированию
The EPM570M100I5 requires a clean 1.8 V core supply (VCCINT) and one or more VCCIO bank supplies selected from 1.5V, 1.8V, 2.5V, or 3.3V. Decoupling: place 0.1 µF X7R ceramic capacitors close to every VCCINT and VCCIO ball, with at least one bulk 10 µF tantalum or ceramic capacitor per supply rail. Power-up monotonicity must be maintained on VCCINT before JTAG configuration begins. Voltage tolerance on JTAG pins differs from regular I/O - consult the MAX II datasheet before back-driving JTAG lines.
Estimated: at the maximum I5 ambient of 100 °C with all 76 I/Os toggling at 100 MHz, the EPM570M100I5's MBGA-100 package dissipates roughly 200-300 mW. With a typical θJA of 35-45 °C/W for a 100-ball MBGA on a 4-layer JEDEC board, junction-to-ambient rise is approximately 7-14 °C. For sealed industrial enclosures with limited airflow, design the PCB with thermal vias under the center balls and stitch the inner ground plane to spread heat. Always verify against the latest Altera/Intel thermal model for the specific speed grade.
The 100-ball Micro FBGA uses a 0.5 mm or 0.4 mm pitch ball array. PCB design must use laser-drilled micro vias, ENIG or OSP surface finish, and 0.4 mm-wide escape traces between balls. Maintain a reference ground plane under the package and stitch vias around the BGA perimeter to control return paths for high-speed I/O. For JTAG, route TCK, TMS, TDI, and TDO as a bus with matched lengths to within 25 mm and a 10 kΩ pull-up on TCK/TMS/TDI as the datasheet recommends.
Common pitfalls: (1) Do not apply 3.3 V to VCCIO banks that are configured for 1.5 V or 1.8 V logic - this damages the I/O cells. (2) Do not omit the nCONFIG or nCE pull-up resistors, or the device will fail to enter user mode. (3) Do not assume I5 (industrial) and C5 (commercial) parts are interchangeable - the temperature range drops from -40/+100 °C to 0/+85 °C. (4) Do not program the UFM block without first reserving logic capacity in the Quartus fitter report - the UFM consumes macrocell resources adjacent to its block.
Информация о соответствии
EPM570M100I5N suffix variant is lead-free / RoHS compliant; non-N EPM570M100I5 uses legacy finish. Industrial -40 °C to +100 °C operating range per I5 grade. AEC-Q100 qualification not applicable - MAX II CPLDs are not automotive-grade qualified. REACH compliance confirmed per Intel product declaration.
