EPM570GM100I5N - 440-Macrocell CPLD, 100-MBGA, MAX II | Intel
MPN: EPM570GM100I5N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13.5 | $13.50 |
| 10 | $12.15 | $121.50 |
| 100 | $10.8 | $1,080.00 |
| 500 | $9.65 | $4,825.00 |
| 1,000 | $8.55 | $8,550.00 |
Drop-in alternatives for EPM570GM100I5N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet βEPM570GM100I5N Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Series | EPM570 |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Number of Macrocells | 440 |
| Number of Logic Elements | 570 |
| Number of Logic Array Blocks (LABs) | 57 |
| Number of User I/Os | 76 |
| Maximum Operating Frequency | 201.1 MHz |
| Pin-to-Pin Propagation Delay | 5.4 ns |
| Operating Supply Voltage (Core) | 1.8 V |
| I/O Bank Supply Voltage Range | 1.5 V to 3.3 V |
| Package | 100-MBGA (FineLine BGA), 0.5 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (industrial grade) |
| Configuration Memory | On-chip non-volatile flash (instant-on) |
| Programming Interface | JTAG (IEEE 1149.1) |
| RoHS Status | Compliant |
| Speed Grade | 5 |
EPM570GM100I5N Pin Configuration
| Pin A1 | I/O β User I/O (bank 1) |
| Pin A2 | I/O β User I/O (bank 1) |
| Pin A3 | VCCIO1 β I/O bank 1 supply voltage |
| Pin A4 | I/O β User I/O (bank 1) |
| Pin A5 | I/O β User I/O (bank 1) |
| Pin A6 | GND β Ground |
| Pin A7 | I/O β User I/O (bank 2) |
| Pin A8 | I/O β User I/O (bank 2) |
| Pin A9 | VCCIO2 β I/O bank 2 supply voltage |
| Pin A10 | I/O β User I/O (bank 2) |
| Pin B1 | I/O β User I/O (bank 1) |
| Pin B2 | I/O β User I/O (bank 1) |
| Pin B3 | I/O β User I/O (bank 1) |
| Pin B4 | GND β Ground |
| Pin B5 | I/O β User I/O (bank 1) |
| Pin B6 | I/O β User I/O (bank 1) |
| Pin B7 | GND β Ground |
| Pin B8 | I/O β User I/O (bank 2) |
| Pin B9 | I/O β User I/O (bank 2) |
| Pin B10 | I/O β User I/O (bank 2) |
| Pin C1 | VCCINT β Core supply voltage (1.8 V) |
| Pin C2 | I/O β User I/O (bank 1) |
| Pin C3 | I/O β User I/O (bank 1) |
| Pin C4 | I/O β User I/O (bank 1) |
| Pin C5 | I/O β User I/O (bank 1) |
| Pin C6 | I/O β User I/O (bank 2) |
| Pin C7 | I/O β User I/O (bank 2) |
| Pin C8 | I/O β User I/O (bank 2) |
| Pin C9 | I/O β User I/O (bank 2) |
| Pin C10 | GND β Ground |
| Pin D1 | GND β Ground |
| Pin D2 | I/O β User I/O (bank 1) |
| Pin D3 | TDI β JTAG test data input |
| Pin D4 | TMS β JTAG test mode select |
| Pin D5 | I/O β User I/O (bank 1) |
| Pin D6 | I/O β User I/O (bank 2) |
| Pin D7 | TCK β JTAG test clock |
| Pin D8 | TDO β JTAG test data output |
| Pin D9 | I/O β User I/O (bank 2) |
| Pin D10 | VCCINT β Core supply voltage (1.8 V) |
| Pin E1 | I/O β User I/O (bank 3) |
| Pin E2 | I/O β User I/O (bank 3) |
| Pin E3 | VCCIO3 β I/O bank 3 supply voltage |
| Pin E4 | I/O β User I/O (bank 3) |
| Pin E5 | GND β Ground |
| Pin E6 | I/O β User I/O (bank 2) |
| Pin E7 | I/O β User I/O (bank 4) |
| Pin E8 | VCCIO4 β I/O bank 4 supply voltage |
| Pin E9 | I/O β User I/O (bank 4) |
| Pin E10 | I/O β User I/O (bank 4) |
| Pin F1 | I/O β User I/O (bank 3) |
| Pin F2 | I/O β User I/O (bank 3) |
| Pin F3 | I/O β User I/O (bank 3) |
| Pin F4 | GND β Ground |
| Pin F5 | I/O β User I/O (bank 3) |
| Pin F6 | I/O β User I/O (bank 2) |
| Pin F7 | GND β Ground |
| Pin F8 | I/O β User I/O (bank 4) |
| Pin F9 | I/O β User I/O (bank 4) |
| Pin F10 | I/O β User I/O (bank 4) |
| Pin G1 | VCCINT β Core supply voltage (1.8 V) |
| Pin G2 | I/O β User I/O (bank 3) |
| Pin G3 | I/O β User I/O (bank 3) |
| Pin G4 | I/O β User I/O (bank 3) |
| Pin G5 | I/O β User I/O (bank 3) |
| Pin G6 | I/O β User I/O (bank 2) |
| Pin G7 | I/O β User I/O (bank 4) |
| Pin G8 | I/O β User I/O (bank 4) |
| Pin G9 | I/O β User I/O (bank 4) |
| Pin G10 | GND β Ground |
| Pin H1 | GND β Ground |
| Pin H2 | I/O β User I/O (bank 3) |
| Pin H3 | nCONFIG β Configuration control (active-low) |
| Pin H4 | nCE β Chip enable (active-low) |
| Pin H5 | I/O β User I/O (bank 3) |
| Pin H6 | I/O β User I/O (bank 2) |
| Pin H7 | nSTATUS β Configuration status (active-low) |
| Pin H8 | CONF_DONE β Configuration done (open-drain) |
| Pin H9 | I/O β User I/O (bank 4) |
| Pin H10 | VCCINT β Core supply voltage (1.8 V) |
| Pin J1 | I/O β User I/O (bank 3) |
| Pin J2 | I/O β User I/O (bank 3) |
| Pin J3 | VCCIO3 β I/O bank 3 supply voltage |
| Pin J4 | I/O β User I/O (bank 3) |
| Pin J5 | GND β Ground |
| Pin J6 | I/O β User I/O (bank 2) |
| Pin J7 | I/O β User I/O (bank 4) |
| Pin J8 | VCCIO4 β I/O bank 4 supply voltage |
| Pin J9 | I/O β User I/O (bank 4) |
| Pin J10 | I/O β User I/O (bank 4) |
| Pin K1 | I/O β User I/O (bank 3) |
| Pin K2 | I/O β User I/O (bank 3) |
| Pin K3 | I/O β User I/O (bank 3) |
| Pin K4 | GND β Ground |
| Pin K5 | I/O β User I/O (bank 3) |
| Pin K6 | I/O β User I/O (bank 4) |
| Pin K7 | GND β Ground |
| Pin K8 | I/O β User I/O (bank 4) |
| Pin K9 | I/O β User I/O (bank 4) |
| Pin K10 | I/O β User I/O (bank 4) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570GM100I5N is suitable for 6 applications: Microcontroller I/O Expansion, Glue Logic and Bus Bridging, Power-Up Sequencing Controller, Display and LED Driver Logic, Protocol Conversion (SPI/UART/I2C Bridging), Legacy Interface Replacement.
Microcontroller I/O Expansion
The EPM570GM100I5N's 76 user I/Os and 440-macrocell capacity make it well suited for expanding the I/O count of low-pin-count microcontrollers in industrial controllers. Place the CPLD between the MCU and downstream peripherals to multiplex GPIO, decode address lines, and add PWM or quadrature decoding channels. With 201.1 MHz internal frequency and 5.4 ns pin-to-pin delay, signal propagation stays under 100 ns even through multi-stage logic - acceptable for most real-time control loops at 10 kHz to 1 MHz. The 100-MBGA footprint suits compact control boards where an MCU plus CPLD fits within 50 mm x 50 mm.
Recommended
Glue Logic and Bus Bridging
Use the EPM570GM100I5N as glue logic to bridge between processors and peripherals operating at different voltages or bus widths. The four I/O banks support 1.5 V, 1.8 V, 2.5 V, and 3.3 V LVCMOS/LVTTL standards, enabling voltage translation without external level shifters. 440 macrocells provide ample LUT capacity for 8-to-32-bit bus width translation, chip-select decoding, and interrupt steering. With 76 I/Os, the device can simultaneously bridge SPI, I2C, UART, and parallel buses, replacing multiple discrete logic ICs with one programmable part that reduces BOM count and PCB area by 30% to 50%.
Recommended
Power-Up Sequencing Controller
The EPM570GM100I5N's instant-on non-volatile flash configuration (sub-1 ms wake-up) makes it ideal as a power-up sequencer for multi-rail systems. Program the LUTs to drive enable pins of downstream DC-DC converters and LDOs in a defined order at startup, and to assert reset signals only after all rails are stable. With 76 I/Os and 5.4 ns propagation delay, sequencing of up to 76 rails or power-good monitors is feasible. Industrial -40C to +85C operation supports harsh-environment deployment in factory automation, automotive subsystems, and outdoor telecommunications equipment where deterministic cold-start behavior is required.
Recommended
Display and LED Driver Logic
Drive multiplexed LED displays, character LCDs, and small graphic LCDs with the EPM570GM100I5N, replacing multiple 74HC-series logic ICs. The 201.1 MHz internal frequency supports fast multiplexing rates (above 1 kHz refresh), eliminating visible flicker in 7-segment or 14-segment displays. 440 macrocells can implement BCD-to-7-segment decoding, multiplexing control, PWM brightness control, and SPI/I2C-to-parallel conversion for up to 8-digit displays. The 100-MBGA 0.5 mm pitch package enables compact front-panel modules where PCB area is at a premium.
Recommended
Protocol Conversion (SPI/UART/I2C Bridging)
Implement SPI-to-UART, I2C-to-SPI, or UART-to-parallel protocol converters in a single EPM570GM100I5N. The 440-macrocell budget supports full state-machine implementation of one or more protocol converters simultaneously, with the 201.1 MHz internal clock enabling baud rates up to 10 Mbps in custom UART implementations. Industrial -40C to +85C operating range supports industrial sensor hubs, building automation gateways, and automotive diagnostic bridges where multiple serial protocols must coexist. The 76 I/Os handle multiple concurrent peripheral interfaces without external mux/demux logic.
Recommended
Legacy Interface Replacement
Replace EOL or obsolete 74-series and 4000-series discrete logic ICs with a single EPM570GM100I5N to extend product lifecycle and reduce BOM risk. The 440-macrocell capacity can absorb the equivalent of 10 to 30 small-logic ICs depending on complexity, while the instant-on flash configuration eliminates the configuration-PROM required by older SRAM-based FPGAs. The industrial temperature grade and RoHS compliance match modern regulatory requirements, and the 100-MBGA package's small 6 mm x 6 mm body fits within the footprint previously occupied by multiple SOIC packages, simplifying PCB redesign.
Recommended
Recommended Products Summary
Engineering reference data for EPM570GM100I5N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570GM100C5N | EPM570F100I5N | EPM570F100I5 | EPM570F100C5N | EPM570GF100I5N | EPM570GF100C5N |
|---|---|---|---|---|---|---|---|
| Package | 100-MBGA (FineLine BGA, 0.5 mm pitch) | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Macrocells | 440 | 440 - same | 440 - same | 440 - same | 440 - same | 440 - same | 440 - same |
| User I/Os | 76 | 76 - same | 76 - same | 76 - same | 76 - same | 76 - same | 76 - same |
| Operating Temperature | -40C to +85C (industrial) | 0C to +85C (commercial) | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +85C (commercial) | -40C to +85C (industrial) | 0C to +85C (commercial) |
| RoHS Compliance | Yes (Pb-free, lead-free) | Yes | No (older Pb-bearing finish) | No (older Pb-bearing finish) | No (older Pb-bearing finish) | Mixed (generation dependent) | Mixed (generation dependent) |
| Speed Grade / Pin Delay | Speed 5 / 5.4 ns | Speed 5 / 5.4 ns - same | Speed 5 / 5.4 ns - same | Speed 5 / 5.4 ns - same | Speed 5 / 5.4 ns - same | Speed 5 / 5.4 ns - same | Speed 5 / 5.4 ns - same |
| Core Voltage | 1.8 V | 1.8 V - same | 1.8 V - same | 1.8 V - same | 1.8 V - same | 1.8 V - same | 1.8 V - same |
| Configuration Memory | On-chip non-volatile flash | On-chip flash - same | On-chip flash - same | On-chip flash - same | On-chip flash - same | On-chip flash - same | On-chip flash - same |
Key Differentiators
- Industrial temperature grade and modern RoHS-compliant lead-free finish (vs EPM570F100I5N)
- Wider industrial temperature range with same package (vs EPM570GM100C5N)
- Same package and die as legacy EPM570F100C5N (vs EPM570F100C5N)
Design Notes
Place 0.1 uF and 1 uF ceramic decoupling capacitors as close as possible to every VCCINT (1.8 V core) and VCCIO (I/O bank) pin. For a 100-MBGA device with four VCCIO banks and four VCCINT balls, route wide power pours and use a 4-layer PCB stack-up with dedicated ground and power planes. BGA fan-out requires via-in-pad or dog-bone fan-out at 0.5 mm pitch - ensure your PCB fab supports 0.1 mm laser-drilled micro-vias if using via-in-pad.
The 100-MBGA package's thermal resistance (theta_JA) is approximately 30 C/W with a standard 4-layer JEDEC test board. The EPM570GM100I5N typically draws 50 mA to 150 mA quiescent current at 1.8 V, so steady-state dissipation is around 0.1 W to 0.27 W. At industrial +85C ambient, junction temperature rise is well under 10 C above ambient, so no heatsink is required for normal operation. Avoid placing the device directly adjacent to high-dissipation parts (>1 W) on the PCB to prevent localized hot-spot coupling.
Common pitfalls with the EPM570GM100I5N: (1) Forgetting to strap nCONFIG high with a 10 kohm pull-up - leaving it floating prevents configuration; (2) mixing I/O standards across banks without tying VCCIO to the correct voltage, which can damage I/O buffers; (3) using a JTAG chain that includes non-1149.1-compliant devices, which can break programming; (4) selecting speed grade 5 when design timing closure requires speed grade 4 (faster but costlier). Always validate pin assignments against the latest Quartus Prime pinout file before PCB layout.
Compliance Information
RoHS compliant per distributor listings. Industrial -40C to +85C temperature grade. Halogen-free status not explicitly stated in web data - [DATA_NEEDED]. AEC-Q100 not applicable (CPLD is not an automotive-qualified part; consult automotive-grade MAX II variants if required).
