EPM570M100I5 - MAX II CPLD 440 Macrocell 100-MBGA | Intel
MPN: EPM570M100I5 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $14.5 | $14.50 |
| 10 | $13.2 | $132.00 |
| 100 | $11.85 | $1,185.00 |
| 500 | $10.4 | $5,200.00 |
| 1,000 | $9.1 | $9,100.00 |
Drop-in alternatives for EPM570M100I5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM570M100I5N
✅ Drop-In✓ In Stock
$8.75 / Unit
View Datasheet →EPM570M100C5N
✅ Drop-In✓ In Stock
$11.85 / Unit
View Datasheet →EPM570GT100I5N
✅ Drop-In✓ In Stock
$16.5 / Unit
View Datasheet →EPM570GM100I5N
✅ Drop-In✓ In Stock
$8.55 / Unit
View Datasheet →EPM570F100I5N
✅ Drop-In✓ In Stock
$13.4 / Unit
View Datasheet →EPM570M100C4N
✅ Drop-In✓ In Stock
$14.95 / Unit
View Datasheet →EPM570M100I5 Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 440 |
| Logic Elements | 570 |
| Maximum User I/O | 76 |
| User Flash Memory (UFM) | 8 Kbits |
| Process Technology | 0.18 µm flash |
| Supply Voltage - Core | 1.8 V |
| Supply Voltage - I/O (MultiVolt) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Internal Performance | 201.1 MHz |
| Operating Temperature | -40 °C to +100 °C (I5 grade) |
| Package | 100-ball Micro FBGA (MBGA), 6 mm x 6 mm |
| Mounting Type | Surface Mount |
| Programmability | JTAG (IEEE 1149.1) + ISP |
| Configuration Memory | Internal non-volatile flash |
| RoHS Status | Compliant |
EPM570M100I5 100-ball micro fbga (mbga), 6 mm x 6 mm Pin Configuration Guide
Complete pinout information for EPM570M100I5 (100-ball micro fbga (mbga), 6 mm x 6 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM570M100I5.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570M100I5 is suitable for 6 applications: Microcontroller I/O Expansion and Bus Bridging, Industrial Control and Factory Automation Logic, Power Sequencing and Reset Management, Communications Equipment Glue Logic, Display and LED Driver Control, Legacy ASIC/FPGA Replacement and Design Modernization.
Microcontroller I/O Expansion and Bus Bridging
The EPM570M100I5's 440 macrocells and 76 user I/Os make it ideal for expanding microcontroller or low-pin-count processor I/O. Its MultiVolt I/O banks (1.5V/1.8V/2.5V/3.3V) allow direct connection between processors, memories, and peripherals operating at different voltages, replacing dozens of discrete logic ICs. The 201.1 MHz internal performance and 8 Kbit User Flash Memory provide deterministic timing and on-chip non-volatile parameter storage. Drop-in upgrade paths exist within the same 100-ball MBGA footprint.
Recommended
Industrial Control and Factory Automation Logic
With its -40 °C to +100 °C industrial operating range and non-volatile instant-on configuration, the EPM570M100I5 is well suited to factory automation controllers, PLC I/O modules, and sensor interface boards. The 100-ball MBGA package provides a compact footprint for high-density logic on controller PCBs. Designers can implement deterministic glue logic, encoder interfacing, and timing-critical control sequences that must execute at power-up without boot delay.
Recommended
Power Sequencing and Reset Management
Power-up sequencing is a classic MAX II use case, and the EPM570M100I5's instant-on non-volatile flash configuration ensures sequencing logic runs from the first valid supply cycle. The 8 Kbit UFM can retain configuration parameters such as timing thresholds or board revision data. MultiVolt I/O banks let a single CPLD interface 1.8V SoCs, 3.3V peripherals, and 5V-tolerant supervisory devices from the same die.
Recommended
Communications Equipment Glue Logic
In networking line cards, base stations, and telecom infrastructure, the EPM570M100I5 implements glue logic between PHYs, switches, FPGAs, and processors. Its 76 user I/Os and MultiVolt support let it bridge between 1.8V FPGA transceivers and 3.3V management interfaces. Deterministic 201.1 MHz timing and JTAG ISP support simplify board-level bring-up, manufacturing test, and field reprogramming.
Recommended
Display and LED Driver Control
The EPM570M100I5 is used as a scan and refresh controller for LED matrices, signage, and small LCD panels. Its 440 macrocells can generate PWM channels, multiplexing waveforms, and color-mixing sequences while the 8 Kbit UFM stores gamma tables or animation frames. The industrial temperature grade supports outdoor display installations where temperatures may swing from -40 °C to +70 °C.
Recommended
Legacy ASIC/FPGA Replacement and Design Modernization
Designers use the EPM570M100I5 to replace obsolete discrete logic, ASICs, or older CPLDs in long-lifecycle programs. Its flash configuration is non-volatile and reprogrammable in-circuit via JTAG, reducing manufacturing cost versus one-time-programmable devices. The same 100-ball MBGA footprint across EPM570 variants enables PCB reuse during design refreshes or component obsolescence mitigation.
Recommended
Recommended Products Summary
Engineering reference data for EPM570M100I5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570M100I5N | EPM570M100C5N | EPM570GT100I5N | EPM570GM100I5N | EPM570F100I5N |
|---|---|---|---|---|---|---|
| Package | 100-ball Micro FBGA (MBGA) | 100-ball Micro FBGA (MBGA) - same | 100-ball Micro FBGA (MBGA) - same | 100-ball Micro FBGA (MBGA) - same | 100-ball Micro FBGA (MBGA) - same | 100-ball Micro FBGA (MBGA) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 |
| User I/O | 76 | 76 | 76 | 76 | 76 | 76 |
| Operating Temperature | -40 °C to +100 °C (I5 industrial) | -40 °C to +100 °C (I5 industrial) | 0 °C to +85 °C (C5 commercial) | -40 °C to +100 °C (I5 industrial) | -40 °C to +100 °C (I5 industrial) | -40 °C to +100 °C (I5 industrial) |
| Supply Voltage (Core) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lead-Free / RoHS | Non-N (legacy finish); N suffix is RoHS | Yes (RoHS, Pb-free) | Yes (RoHS, Pb-free) | Yes (RoHS, Pb-free) | Yes (RoHS, Pb-free) | Yes (RoHS, Pb-free) |
| Internal Performance | 201.1 MHz | 201.1 MHz | 201.1 MHz | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Same-package drop-in with lead-free finish (vs EPM570M100I5N)
- Higher operating temperature range (vs EPM570M100C5N)
- Larger macrocell count than legacy MAX 7000 devices (vs EPM240 / EPM570 older variants in different packages)
Design Notes
The EPM570M100I5 requires a clean 1.8 V core supply (VCCINT) and one or more VCCIO bank supplies selected from 1.5V, 1.8V, 2.5V, or 3.3V. Decoupling: place 0.1 µF X7R ceramic capacitors close to every VCCINT and VCCIO ball, with at least one bulk 10 µF tantalum or ceramic capacitor per supply rail. Power-up monotonicity must be maintained on VCCINT before JTAG configuration begins. Voltage tolerance on JTAG pins differs from regular I/O - consult the MAX II datasheet before back-driving JTAG lines.
Estimated: at the maximum I5 ambient of 100 °C with all 76 I/Os toggling at 100 MHz, the EPM570M100I5's MBGA-100 package dissipates roughly 200-300 mW. With a typical θJA of 35-45 °C/W for a 100-ball MBGA on a 4-layer JEDEC board, junction-to-ambient rise is approximately 7-14 °C. For sealed industrial enclosures with limited airflow, design the PCB with thermal vias under the center balls and stitch the inner ground plane to spread heat. Always verify against the latest Altera/Intel thermal model for the specific speed grade.
The 100-ball Micro FBGA uses a 0.5 mm or 0.4 mm pitch ball array. PCB design must use laser-drilled micro vias, ENIG or OSP surface finish, and 0.4 mm-wide escape traces between balls. Maintain a reference ground plane under the package and stitch vias around the BGA perimeter to control return paths for high-speed I/O. For JTAG, route TCK, TMS, TDI, and TDO as a bus with matched lengths to within 25 mm and a 10 kΩ pull-up on TCK/TMS/TDI as the datasheet recommends.
Common pitfalls: (1) Do not apply 3.3 V to VCCIO banks that are configured for 1.5 V or 1.8 V logic - this damages the I/O cells. (2) Do not omit the nCONFIG or nCE pull-up resistors, or the device will fail to enter user mode. (3) Do not assume I5 (industrial) and C5 (commercial) parts are interchangeable - the temperature range drops from -40/+100 °C to 0/+85 °C. (4) Do not program the UFM block without first reserving logic capacity in the Quartus fitter report - the UFM consumes macrocell resources adjacent to its block.
Compliance Information
EPM570M100I5N suffix variant is lead-free / RoHS compliant; non-N EPM570M100I5 uses legacy finish. Industrial -40 °C to +100 °C operating range per I5 grade. AEC-Q100 qualification not applicable - MAX II CPLDs are not automotive-grade qualified. REACH compliance confirmed per Intel product declaration.
