10CL010YM164C8G vs 10CL010ZM164I8G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 10CL010YM164C8G sa pamamagitan ng Intel at 10CL010ZM164I8G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro 10CL010YM164C8G 10CL010ZM164I8G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone 10 LP Cyclone 10 LP
Logic Elements 10,320 10,320
Embedded Memory 414 Kbit (M9K blocks) 423,936 bits (414 Kbits)
Embedded 18x18 Multipliers 56 46
PLLs 4 4 (per device, exact count [DATA_NEEDED: PLL count])
Maximum User I/Os 224 —
Process Node TSMC 60 nm low-power —
Core Voltage 1.0 V nominal (range 1.0 V to 1.1 V) 1.0 V (typical), 1.2 V I/O banks
Speed Grade -8C (commercial, 8 speed grade) —
Packhaging 164-ball MBGA (Micro BGA, 8x8 mm) 164-ball MBGA (FineLine BGA, M164)
Temperature ng Junction na Operasyon 0 C to +85 C (commercial) —
Configuration Method SRAM-based, JTAG/AS/AP/PS —
Transceivers None (general-purpose FPGA, no high-speed SERDES) —
Hard PCIe Controller 1x PCIe Gen1 (x1/x2 root port or endpoint) —
Uri ng Pagpapasok Surface Mount (BGA) —
Tindminan RoHS Compliant Compliant
Level ng MSL 3 (per JEDEC J-STD-020) —
Lead-Free Yes —
Maximum User I/O — 101
Temperature na Operasyon — -40C to +100C (Industrial)
Process Technology — 60 nm low-power CMOS
Configuration Modes — PS, FPP, JTAG
I/O Standards — LVTTL, LVCMOS, LVDS, SSTL, HSTL
External Memory Support — DDR2, DDR3, LPDDR2 (via soft IP)
Packaging — Tray (I8G suffix)

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