10CL010YM164C8G vs 10CL010ZM164I8G 比較

詳細並排比較 10CL010YM164C8G 由 Intel 與 10CL010ZM164I8G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 10CL010YM164C8G 10CL010ZM164I8G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Cyclone 10 LP Cyclone 10 LP
Logic Elements 10,320 10,320
Embedded Memory 414 Kbit (M9K blocks) 423,936 bits (414 Kbits)
Embedded 18x18 Multipliers 56 46
PLLs 4 4 (per device, exact count [DATA_NEEDED: PLL count])
Maximum User I/Os 224 —
Process Node TSMC 60 nm low-power —
Core Voltage 1.0 V nominal (range 1.0 V to 1.1 V) 1.0 V (typical), 1.2 V I/O banks
Speed Grade -8C (commercial, 8 speed grade) —
封裝 164-ball MBGA (Micro BGA, 8x8 mm) 164-ball MBGA (FineLine BGA, M164)
工作接面溫度 0 C to +85 C (commercial) —
Configuration Method SRAM-based, JTAG/AS/AP/PS —
Transceivers None (general-purpose FPGA, no high-speed SERDES) —
Hard PCIe Controller 1x PCIe Gen1 (x1/x2 root port or endpoint) —
安裝類型 Surface Mount (BGA) —
RoHS 狀態 Compliant Compliant
MSL 等級 3 (per JEDEC J-STD-020) —
Lead-Free Yes —
Maximum User I/O — 101
工作溫度 — -40C to +100C (Industrial)
Process Technology — 60 nm low-power CMOS
Configuration Modes — PS, FPP, JTAG
I/O Standards — LVTTL, LVCMOS, LVDS, SSTL, HSTL
External Memory Support — DDR2, DDR3, LPDDR2 (via soft IP)
Packaging — Tray (I8G suffix)

資料表與資源

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