10M25DAF484C8G vs 10M25DAF484C7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M25DAF484C8G sa pamamagitan ng Intel at 10M25DAF484C7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M25DAF484C8G | 10M25DAF484C7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | — |
| Logic Elements | 25,000 | — |
| Embedded Memory (Kbits) | 1638 | — |
| User I/O Count | 360 | — |
| Process Technology | 55 nm CMOS | — |
| Core Supply Voltage (VCCINT) | 1.2 V (1.15 V min / 1.25 V max) | — |
| Packhaging | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-BGA (F484) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature na Operasyon | 0 °C to 85 °C (Commercial) | 0C to +85C (commercial) |
| Speed Grade | -8 | — |
| Configuration Memory | On-chip dual-configuration flash | — |
| ADC | Integrated 12-bit ADC (where enabled) | — |
| PLLs | Yes (up to 4 analog PLLs per device) | 4 general-purpose |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | MSL3 | — |
| Number of I/O Banks | 8 (per F484 pinout) | — |
| Series | — | MAX 10 |
| Logic Elements (LE) | — | 25,000 |
| Embedded Memory (M9K blocks) | — | 1,728 Kbit |
| Embedded 18x18 Multipliers | — | 66 |
| User I/O Pins (max) | — | 360 |
| On-chip Configuration Flash | — | Dual-configuration (instant-on, remote update) |
| Hard IP: ADC | — | 12-bit, 1 MSPS, 16-channel (MAX 10 family) |
| Global Clocks | — | 20 |
| On-chip Temperature Sensor | — | Yes |
| Design Tool | — | Intel Quartus Prime (Lite / Standard / Pro) |