5CGXBC9D6F27C7N vs 5CGXBC9D7F27C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CGXBC9D6F27C7N sa pamamagitan ng Intel at 5CGXBC9D7F27C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 5CGXBC9D6F27C7N | 5CGXBC9D7F27C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone V GX | — |
| Logic Elements | 301,000 | 113,560 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 14,251,008 bits | 14,251,008 bits (6,876 Kbit M10K + 657 Kbit MLAB) |
| Memory Blocks (M20K) | [DATA_NEEDED: M20K count] | — |
| Embedded Multipliers (18x18) | 336 | — |
| Transceivers | GX family transceivers (per package variant) | 9 channels, up to 3.125 Gbps |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| PCIe Hard IP | Yes, Gen1/Gen2 | — |
| Core Voltage | 1.1 V | — |
| I/O Voltage Support | 1.2 V to 3.3 V (bank-dependent) | — |
| User I/O Pins | [DATA_NEEDED: user I/O count for FBGA-672] | 336 |
| Process Technology | 28 nm TSMC low-power | — |
| Packhaging | 672-ball FBGA | 672-ball FineLine BGA (F27), 27 mm x 27 mm |
| Speed/Grade | C7 (commercial, speed grade 7) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Tindminan RoHS | Compliant | Compliant |
| Series | — | Cyclone V GX |
| Embedded Multipliers | — | 156 (18x18) |
| Number of I/O Banks | — | 9 |
| Number of PLLs | — | 4 |
| Hard PCIe Gen2 | — | x4 IP block |
| Speed Grade | — | -8 |
| Temperature na Operasyon | — | -40C to +100C (industrial) |
| Process Node | — | TSMC 28 nm low-power |
| Configuration Modes | — | JTAG, AS, PS, FPP |