5CGXBC9D6F27C7N vs 5CGXBC9D7F27C8N 比較

詳細並排比較 5CGXBC9D6F27C7N 由 Intel 與 5CGXBC9D7F27C8N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 5CGXBC9D6F27C7N 5CGXBC9D7F27C8N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Cyclone V GX —
Logic Elements 301,000 113,560
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory 14,251,008 bits 14,251,008 bits (6,876 Kbit M10K + 657 Kbit MLAB)
Memory Blocks (M20K) [DATA_NEEDED: M20K count] —
Embedded Multipliers (18x18) 336 —
Transceivers GX family transceivers (per package variant) 9 channels, up to 3.125 Gbps
Transceiver Data Rate Up to 3.125 Gbps —
PCIe Hard IP Yes, Gen1/Gen2 —
Core Voltage 1.1 V —
I/O Voltage Support 1.2 V to 3.3 V (bank-dependent) —
User I/O Pins [DATA_NEEDED: user I/O count for FBGA-672] 336
Process Technology 28 nm TSMC low-power —
封裝 672-ball FBGA 672-ball FineLine BGA (F27), 27 mm x 27 mm
Speed/Grade C7 (commercial, speed grade 7) —
安裝類型 Surface Mount (BGA) —
MSL 等級 [DATA_NEEDED: MSL rating] —
RoHS 狀態 Compliant Compliant
Series — Cyclone V GX
Embedded Multipliers — 156 (18x18)
Number of I/O Banks — 9
Number of PLLs — 4
Hard PCIe Gen2 — x4 IP block
Speed Grade — -8
工作溫度 — -40C to +100C (industrial)
Process Node — TSMC 28 nm low-power
Configuration Modes — JTAG, AS, PS, FPP

資料表與資源

瀏覽所有產品 建立 BOM 索取報價