A3PE3000L-FGG324 vs A3PE3000L-FGG324I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-FGG324 sa pamamagitan ng Microchip Technology at A3PE3000L-FGG324I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip
A3PE3000L-FGG324 ✓ NakahandaMicrochip Technology
A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip
A3PE3000L-FGG324I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-FGG324 | A3PE3000L-FGG324I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Manufacturer Part Number | A3PE3000L-FGG324 | — |
| Family | ProASIC3L (Flash-based FPGA) | ProASIC3L (Flash FPGA) |
| System Gates | 3,000,000 | 3,000,000 |
| Logic Cells (CLBs) | 75264 | — |
| User I/O | 221 | 221 |
| Configuration Memory | On-chip Flash (single-chip, nonvolatile) | — |
| Core Voltage Range | 1.2 V to 1.5 V | — |
| Supply Voltage na Operasyon | 1.5 V | — |
| Maximum Operating Frequency | 250 MHz | — |
| Special Features | Flash*Freeze Technology, Schmitt Trigger inputs, weak pull-up/down | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| Packhaging | 324-BGA / FBGA (FGG324) | 324-BGA FBGA (19x19 mm) |
| Style ng Pagpapasok | SMD/SMT | — |
| Temperature na Operasyon | 0 C to +70 C (commercial) | -40C to +100C (industrial) |
| Packaging | Tray | Tray |
| Embedded RAM | [DATA_NEEDED: embedded RAM capacity] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | RoHS Compliant |
| Total RAM Bits | — | 516096 |
| Core Voltage | — | 1.2 V to 1.5 V |
| Process Technology | — | 130 nm CMOS |
| Uri ng Pagpapasok | — | Surface Mount (SMD) |
| Technology Features | — | Nonvolatile Flash, Instant On, Flash*Freeze |
| Configuration | — | Single-chip, no external boot PROM |
| Lead Free Status | — | Lead Free |
| Number of Package Balls | — | 324 |