EP1SGX25F1020C6 vs EP1SGX25DF1020C6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1SGX25F1020C6 sa pamamagitan ng Intel at EP1SGX25DF1020C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1SGX25F1020C6 | EP1SGX25DF1020C6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix GX | Stratix GX |
| Logic Elements | 25,660 | — |
| LABs/CLBs | 2,566 | — |
| Total RAM Bits | 1,944,576 | 1,944,576 |
| User I/O Pins | 607 | — |
| Packhaging | 1020-ball FineLine BGA (FBGA-1020) | — |
| Package Dimensions | 33 x 33 mm, 1.0 mm pitch | — |
| Core Voltage | 1.5 V | — |
| Temperature na Operasyon | 0C to 85C (commercial) | 0 °C to +85 °C (commercial) |
| Logic Family | CMOS | CMOS |
| Transceivers | Up to 20 multi-gigabit channels (this die density supports up to 14 active) | Embedded multi-gigabit transceivers (3.125 Gbps class) |
| Transceiver Data Rate | 622 Mbps to 3.1875 Gbps | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Lead Free | Yes | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | Lead-free per datasheet |
| Level ng MSL | [DATA_NEEDED: msl level] | — |
| Device Logic Elements | — | 25,660 |
| LABs / CLBs | — | 2,566 |
| Number of I/O | — | 607 (614 user pins per datasheet) |
| Core Supply Voltage | — | 1.5 V (1.425 V min, 1.575 V max) |
| Package Type | — | 1020-BBGA / FC-FBGA |
| Package Size | — | 33 x 33 mm, 1.0 mm pitch |
| Process Technology | — | 130 nm CMOS |
| Configuration Method | — | Passive Serial, Fast Passive Parallel, JTAG |