EP2AGZ300FH29I3G vs EP2AGZ350FH29I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300FH29I3G sa pamamagitan ng Intel at EP2AGZ350FH29I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ300FH29I3G | EP2AGZ350FH29I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 300,000 | 350000 (approximately) |
| Embedded Memory | 18,520 Kbits | — |
| DSP Blocks (18x18 multipliers) | 720 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Number of Transceivers | 24 | — |
| Process Node | 40 nm TSMC | 40 nm |
| Packhaging | 780-pin FineLine BGA (FH29), 29x29 mm | 780-FBGA (FineLine BGA, FH29) |
| Speed Grade | -3 | — |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Operating Voltage (Core) | 0.9 V | — |
| External Memory Interface | DDR3 up to 800 MHz | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| User I/O Count | — | 281 |
| Hanay ng Temperature na Operasyon | — | -40C to +100C |
| Supply Voltage Core | — | [DATA_NEEDED: VCC core voltage] |
| Transceivers | — | Multi-gigabit transceivers (family supports up to 16 channels at up to 6.375 Gbps per family datasheet) |
| Memory Interface | — | DDR3 with read/write leveling support (family feature) |
| Embedded Multipliers | — | 18x18 hardware multipliers (family feature) |
| Configuration Method | — | Serial or parallel via Quartus II (family feature) |
| Level ng MSL | — | 3 (per BGA package handling guidelines) |
| Lead Free | — | Yes |
| Wala sa Halogen | — | [DATA_NEEDED: halogen free status] |