EP2SGX60DF780C3N vs EP2SGX60DF780C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60DF780C3N sa pamamagitan ng Intel at EP2SGX60DF780C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX60DF780C4N - Stratix II GX FPGA, 60K LEs, 364 I/O, FBGA-780 | Intel
EP2SGX60DF780C4N ObsoletePagsanggunian na paghahambing
| Parametro | EP2SGX60DF780C3N | EP2SGX60DF780C4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Tapus ng Buhay | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Device Type | FPGA | — |
| Logic Elements | 60,440 | 60,440 |
| LABs/CLBs | 3,022 | — |
| Total Memory Bits | 2,544,192 | — |
| User I/Os | 364 | 364 |
| Package Type | 780-pin FC-FBGA (DF780) | — |
| Package Dimensions | 23 x 23 mm | — |
| Pitch | 1 mm | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | — |
| Internal Frequency | 717 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range C] | Commercial 0C to +85C |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Tindminan RoHS | Compliant (per distributor listing) | Lead-free (per part suffix N) |
| Logic Array Blocks (LABs) | — | 3,022 |
| Adaptive Logic Modules (ALMs) | — | 24,176 |
| Total RAM Bits | — | 2,544,192 |
| Embedded Multipliers (18x18) | — | 144 |
| DSP Blocks | — | 36 |
| Transceivers | — | Up to 20 (up to 6.375 Gbps) |
| PLLs | — | 4 |
| Global Clock Networks | — | 16 |
| Process Node | — | 90 nm CMOS |
| Packhaging | — | 780-ball FBGA (29 x 29 mm, 1.0 mm pitch) |
| Maximum Internal Frequency | — | 717 MHz |
| Speed Grade | — | C4 |