EP2SGX60EF1152C3 vs EP2SGX60EF1152C4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60EF1152C3 sa pamamagitan ng Intel at EP2SGX60EF1152C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX60EF1152C3 - Stratix II GX FPGA 60K LE 1152-FBGA | Intel
EP2SGX60EF1152C3 ⚠ Huling PagbiliIntel
EP2SGX60EF1152C4 - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
EP2SGX60EF1152C4 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX60EF1152C3 | EP2SGX60EF1152C4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Device Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | — |
| LABs / CLBs | 3,022 | — |
| User I/Os | 534 | — |
| Total Memory Bits | 2,544,192 | — |
| Number of Transceivers | 36 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Internal Frequency | 717 MHz | 717 MHz (max) |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | [DATA_NEEDED: propagation delay exact value] |
| Core Voltage | 1.2 V | 1.15 V to 1.25 V |
| Process Technology | 90 nm | 90 nm CMOS |
| Multipliers (18x18) | 252 | — |
| Packhaging | 1152-ball FC-FBGA (35 x 35 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0C to +85C (Commercial, C3 suffix) | 0C to 85C (commercial) |
| Configuration Memory Interface | EPCS serial configuration devices | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Logic Elements (LE) | — | 60,440 |
| Logic Array Blocks / CLBs | — | 3022 |
| Total RAM Bits | — | 2,544,192 |
| User I/O Pins | — | 534 |
| Number of LABs/CLBs | — | 3022 |
| Package Type | — | 1152-BBGA, FC-FBGA |
| Package Pitch | — | 1.0 mm |
| Speed Grade | — | C4 (commercial) |