EP2SGX90FF1508C3 vs EP2SGX90FF1508C3ES Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX90FF1508C3 sa pamamagitan ng Intel at EP2SGX90FF1508C3ES sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2SGX90FF1508C3 EP2SGX90FF1508C3ES
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family Stratix II GX Stratix II GX
Logic Elements 90,960 90,960
LABs / CLBs 4,548 —
Total Memory Bits 4,520,448 —
Maximum User I/O 650 —
Number of Transceivers 4 (per family datasheet) —
Core Voltage 1.2 V —
Temperature na Operasyon 0C to +85C (commercial) —
Speed Grade -3 —
Process Technology 90 nm CMOS 90 nm CMOS
Package Type 1508-ball FC-FBGA (FBGA-1508) —
Package Dimensions 40 x 40 mm —
Ball Pitch 1.0 mm —
Uri ng Pagpapasok Surface Mount (Tray) Surface Mount
Tindminan RoHS Compliant [DATA_NEEDED: rohs]
Configuration Method SRAM-based, JTAG / Passive / Active serial —
Logic Array Blocks (LABs) — 4,828
Embedded Memory (TriMatrix) — 4,520,448 bits
Total RAM Bits — 4,520,448
Core Supply Voltage — 1.2 V
Maximum Internal Frequency — 816.9 MHz
DSP Blocks — Yes (dedicated multiplier blocks)
Embedded Transceivers — Up to 3.125 Gbps multi-gigabit transceivers
Global Clock Networks — Up to 16
Regional Clock Networks — Up to 32 per device region
Packhaging — 1508-ball FC-FBGA (Flip-Chip FineLine BGA), 1.00 mm pitch
Configuration Interface — JTAG / EPCS serial flash / Passive parallel
Operating Temperature Grade — Commercial / Industrial (per part suffix)

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