EP3C16F256C8 vs EP3C16F256I7N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3C16F256C8 sa pamamagitan ng Intel at EP3C16F256I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3C16F256C8 EP3C16F256I7N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Aktibo
Device Type Cyclone III Field-Programmable Gate Array (FPGA) —
Logic Elements 15,408 logic elements —
Embedded Memory 516,096 bits (504 Kb) 56 M9K blocks (504 Kbit)
Maximum Frequency 402 MHz —
I/O Pins 168 pins —
Process Technology 65 nm CMOS TSMC 60 nm low-leakage
Core Supply Voltage 1.2 V —
Packhaging 256-LBGA (F256) 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch)
Package Dimensions 17 mm × 17 mm —
Number of Package Terminals 256 balls —
Style ng Pagpapasok Surface mount —
Speed Grade Grade 8 —
Commercial Junction Temperature 0 °C to 85 °C —
Industrial Junction Temperature -40 °C to 125 °C —
Package Outline Reference MS-034 —
Lead-Free Status Lead free —
Terminal Form Ball-grid array —
Programmable Logic Family Cyclone III —
RoHS Compliance [DATA_NEEDED: RoHS compliance] Compliant
REACH Compliance [DATA_NEEDED: REACH compliance] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Family — Cyclone III
Logic Elements (LEs) — 15408
Logic Array Blocks (LABs) — 963
Total Memory Bits — 516096
Embedded 18x18 Multipliers — 56
PLLs — 4
Maximum User I/O Pins — 168
Temperature na Operasyon — -40C to +100C (industrial, I7)
Supply Voltage (Core) — 1.2 V typical
Configuration — SRAM-based, requires external config device (EPCS/EPCQ)
Lead-Free / Pb-Free — Yes (N suffix per JEDEC JESD97)

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